FR2498377A1 - Procede de fabrication de dispositifs semiconducteurs sur bande metallique - Google Patents

Procede de fabrication de dispositifs semiconducteurs sur bande metallique Download PDF

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Publication number
FR2498377A1
FR2498377A1 FR8100772A FR8100772A FR2498377A1 FR 2498377 A1 FR2498377 A1 FR 2498377A1 FR 8100772 A FR8100772 A FR 8100772A FR 8100772 A FR8100772 A FR 8100772A FR 2498377 A1 FR2498377 A1 FR 2498377A1
Authority
FR
France
Prior art keywords
strip
connection
heat sink
integrated circuit
conductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8100772A
Other languages
English (en)
French (fr)
Other versions
FR2498377B1 (de
Inventor
Roger Chabbal
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
ALE International SAS
Original Assignee
Thomson CSF Telephone SA
Le Materiel Telephonique Thomson CSF
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF Telephone SA, Le Materiel Telephonique Thomson CSF filed Critical Thomson CSF Telephone SA
Priority to FR8100772A priority Critical patent/FR2498377A1/fr
Publication of FR2498377A1 publication Critical patent/FR2498377A1/fr
Application granted granted Critical
Publication of FR2498377B1 publication Critical patent/FR2498377B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
FR8100772A 1981-01-16 1981-01-16 Procede de fabrication de dispositifs semiconducteurs sur bande metallique Granted FR2498377A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8100772A FR2498377A1 (fr) 1981-01-16 1981-01-16 Procede de fabrication de dispositifs semiconducteurs sur bande metallique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8100772A FR2498377A1 (fr) 1981-01-16 1981-01-16 Procede de fabrication de dispositifs semiconducteurs sur bande metallique

Publications (2)

Publication Number Publication Date
FR2498377A1 true FR2498377A1 (fr) 1982-07-23
FR2498377B1 FR2498377B1 (de) 1984-07-20

Family

ID=9254228

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8100772A Granted FR2498377A1 (fr) 1981-01-16 1981-01-16 Procede de fabrication de dispositifs semiconducteurs sur bande metallique

Country Status (1)

Country Link
FR (1) FR2498377A1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4115128A1 (de) * 1990-05-24 1991-11-28 Motorola Inc Halbleiter-leistungs-anordnung fuer hochfrequnez-anwendungen
WO1992016968A1 (en) * 1991-03-15 1992-10-01 Asm-Fico Tooling B.V. Method and device for manufacturing a single product from integrated circuits received on a lead frame

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2118154A1 (de) * 1970-12-17 1972-07-28 Philips Nv
US3930114A (en) * 1975-03-17 1975-12-30 Nat Semiconductor Corp Integrated circuit package utilizing novel heat sink structure
GB2027990A (en) * 1978-08-02 1980-02-27 Hitachi Ltd Lead-frame for a semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2118154A1 (de) * 1970-12-17 1972-07-28 Philips Nv
US3930114A (en) * 1975-03-17 1975-12-30 Nat Semiconductor Corp Integrated circuit package utilizing novel heat sink structure
GB2027990A (en) * 1978-08-02 1980-02-27 Hitachi Ltd Lead-frame for a semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4115128A1 (de) * 1990-05-24 1991-11-28 Motorola Inc Halbleiter-leistungs-anordnung fuer hochfrequnez-anwendungen
DE4115128C2 (de) * 1990-05-24 1999-09-30 Motorola Inc Halbleiter-Leistungs-Anordnung für Hochfrequenz-Anwendungen und Verfahren zu Bildung einer solchen
WO1992016968A1 (en) * 1991-03-15 1992-10-01 Asm-Fico Tooling B.V. Method and device for manufacturing a single product from integrated circuits received on a lead frame
US5410804A (en) * 1991-03-15 1995-05-02 Asm-Fico Tooling B.V. Method for manufacturing a single product from integrated circuits received on a lead frame

Also Published As

Publication number Publication date
FR2498377B1 (de) 1984-07-20

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