FR2496987A1 - Electrodes pour pastille semi-conductrice de puissance - Google Patents
Electrodes pour pastille semi-conductrice de puissance Download PDFInfo
- Publication number
- FR2496987A1 FR2496987A1 FR8027448A FR8027448A FR2496987A1 FR 2496987 A1 FR2496987 A1 FR 2496987A1 FR 8027448 A FR8027448 A FR 8027448A FR 8027448 A FR8027448 A FR 8027448A FR 2496987 A1 FR2496987 A1 FR 2496987A1
- Authority
- FR
- France
- Prior art keywords
- electrodes
- grooves
- pastille
- power
- semiconductor power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/13—Containers comprising a conductive base serving as an interconnection
- H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
Landscapes
- Thyristors (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Die Bonding (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8027448A FR2496987A1 (fr) | 1980-12-24 | 1980-12-24 | Electrodes pour pastille semi-conductrice de puissance |
| GB8135867A GB2090058B (en) | 1980-12-24 | 1981-11-27 | An electrode structure for a semiconductor wafer |
| SE8107624A SE8107624L (sv) | 1980-12-24 | 1981-12-18 | Elektrod for halvledarbricka |
| DE19813151113 DE3151113A1 (de) | 1980-12-24 | 1981-12-23 | "elektroden fuer leistungs-halbleiterzelle" |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8027448A FR2496987A1 (fr) | 1980-12-24 | 1980-12-24 | Electrodes pour pastille semi-conductrice de puissance |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2496987A1 true FR2496987A1 (fr) | 1982-06-25 |
| FR2496987B1 FR2496987B1 (ref) | 1984-02-03 |
Family
ID=9249477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8027448A Granted FR2496987A1 (fr) | 1980-12-24 | 1980-12-24 | Electrodes pour pastille semi-conductrice de puissance |
Country Status (4)
| Country | Link |
|---|---|
| DE (1) | DE3151113A1 (ref) |
| FR (1) | FR2496987A1 (ref) |
| GB (1) | GB2090058B (ref) |
| SE (1) | SE8107624L (ref) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5305338A (en) * | 1990-09-25 | 1994-04-19 | Mitsubishi Denki Kabushiki Kaisha | Switch device for laser |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2012440A1 (de) * | 1969-03-15 | 1971-02-04 | Mitsubishi Denki Kabushiki Kaisha, Tokio | Halbleiterelement |
| US3566958A (en) * | 1968-12-18 | 1971-03-02 | Gen Systems Inc | Heat sink for electrical devices |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NO118754B (ref) * | 1964-04-20 | 1970-02-09 | Asea Ab |
-
1980
- 1980-12-24 FR FR8027448A patent/FR2496987A1/fr active Granted
-
1981
- 1981-11-27 GB GB8135867A patent/GB2090058B/en not_active Expired
- 1981-12-18 SE SE8107624A patent/SE8107624L/ not_active Application Discontinuation
- 1981-12-23 DE DE19813151113 patent/DE3151113A1/de not_active Withdrawn
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3566958A (en) * | 1968-12-18 | 1971-03-02 | Gen Systems Inc | Heat sink for electrical devices |
| DE2012440A1 (de) * | 1969-03-15 | 1971-02-04 | Mitsubishi Denki Kabushiki Kaisha, Tokio | Halbleiterelement |
Also Published As
| Publication number | Publication date |
|---|---|
| SE8107624L (sv) | 1982-06-25 |
| FR2496987B1 (ref) | 1984-02-03 |
| GB2090058A (en) | 1982-06-30 |
| DE3151113A1 (de) | 1982-08-19 |
| GB2090058B (en) | 1985-08-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |