FR2486308A3 - Heat sink for vehicle alternator diode - has cooling fins obtained by drawing operation carried out simultaneously with receptacle for current diode before slicing - Google Patents
Heat sink for vehicle alternator diode - has cooling fins obtained by drawing operation carried out simultaneously with receptacle for current diode before slicing Download PDFInfo
- Publication number
- FR2486308A3 FR2486308A3 FR8014895A FR8014895A FR2486308A3 FR 2486308 A3 FR2486308 A3 FR 2486308A3 FR 8014895 A FR8014895 A FR 8014895A FR 8014895 A FR8014895 A FR 8014895A FR 2486308 A3 FR2486308 A3 FR 2486308A3
- Authority
- FR
- France
- Prior art keywords
- profile
- heat sink
- diode
- radiator
- cooling fins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4878—Mechanical treatment, e.g. deforming
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
PROCEDE D'OBTENTION DEPJ~DIATEUP SUPPOnT Di- DIODES POUR PONTS
REDRESSEURS DE COURANT NOTAINT POUR ALTEPN(TEUP DE VéHICULE AUTOtZBILE. PROCESS FOR OBTAINING DEPJ ~ DIATEUP SUPPOnT DIDODES FOR BRIDGES
NOTAINT CURRENT RECTIFIERS FOR ALTEPN (AUTOtZBILE VEHICLE TEUP.
La présente invention concerne un procédé d'obtention de radiateurs support de diodes pour ponts redresseurs de courant notamment pour alternateurs de véhicules automobiles. The present invention relates to a method for obtaining diode support radiators for current rectifier bridges, in particular for alternators of motor vehicles.
Ces radiateurs sont du type comportant sur une face des ailettes de refroidissement et se présentent sous la forme de tranches de profilé obtenu par étirage de la matière et comportant sur une face longitudinalement lesdites ailettes de refroidissement, l'autre face étant sensiblement lisse. These radiators are of the type comprising on one face of the cooling fins and are in the form of profile sections obtained by drawing the material and comprising on one face longitudinally said cooling fins, the other face being substantially smooth.
Dans les redresseurs connus équipés de tels radiateurs les diodes sont disposées face à face entre les deux radiateurs, l'un positif et l'autre négatif, il est donc nécessaire d'usiner les deux tranches de profilé perpendiculairement aux fibres d'étirage pour réaliser d'une part les logements des diodes et d'autre part la liaison entre les deux radiateurs, ceci entraine une pluralité d'opérations de reprise d'usinage et conséquemment une augmentation très nette du prix de tels redresseurs. In known rectifiers equipped with such radiators the diodes are arranged face to face between the two radiators, one positive and the other negative, it is therefore necessary to machine the two sections of profile perpendicular to the drawing fibers to achieve on the one hand the housing of the diodes and on the other hand the connection between the two radiators, this leads to a plurality of operations for resuming machining and consequently a very marked increase in the price of such rectifiers.
La présente invention a pour but de remédier à de tels inconvénients et concerne à cet effet un procédé économique d'obtention de radiateurs supports de diodes pour ponts redresseurs de courant notamment pour alternateur de véhicule automobile, radiateur caractérisé en ce que les logements des diodes sont obtenus lors de l'étirage du profilé à partir duquel sont obtenus les radiateurs. The present invention aims to remedy such drawbacks and to this end relates to an economical process for obtaining diode support radiators for current rectifier bridges, in particular for a motor vehicle alternator, radiator characterized in that the diode housings are obtained during the stretching of the profile from which the radiators are obtained.
La description qui va suivre en regard des figures annexées fera mieux comprendre comment l'invention peut être réalisée. The description which follows with reference to the appended figures will make it easier to understand how the invention can be implemented.
La figure 1 représente un radiateur déjà connu. Figure 1 shows a radiator already known.
La figure 2 représente un radiateur obtenu suivant le procédé conforme à l'invention. FIG. 2 represents a radiator obtained according to the method according to the invention.
Il est donc connu suivant la figure 1 d'obtenir un radiateur
A à partir d'un profilé étiré qui comporte les rainures longitudinales B. Ce profilé est découpé suivant l'épaisseur nécessaire pour le radiateur A, puis ce radiateur ainsi découpé est ensuite usiné perpendiculaire aux fibres d'étirage du profilé pour obtenir les trous C de logement pour les diodes redresseuses de courant (non représentées).It is therefore known from FIG. 1 to obtain a radiator
A from a drawn profile which has the longitudinal grooves B. This profile is cut to the thickness necessary for the radiator A, then this radiator thus cut is then machined perpendicular to the drawing fibers of the profile to obtain the holes C housing for current rectifying diodes (not shown).
La figure 2 représente un radiateur support de diodes pour redresseur de courant obtenu conformément à l'invention à partir d'un profilé 1 obtenu par ntirage et qui comporte, obtenus lors de l'étirage, des ailettes longitudinales 6, des trous longitu finaux 3 et des rainures longitudinales 4 et 5. FIG. 2 represents a diode support radiator for current rectifier obtained in accordance with the invention from a profile 1 obtained by drawing and which comprises, obtained during drawing, longitudinal fins 6, final longitu holes 3 and longitudinal grooves 4 and 5.
Un tel profilé est ensuite coupé en tranches lesquelles forment des radiateurs 2 de la forme désirée dont les ailettes 6 forment ses ailettes de refroidissement, les trous 3 forment les logements des diodes de redressement, les rainures 4 assurent, en coopération avec des moyens de liaison connus, le positionnement d'un radiateur positif avec un radiateur négatif, la rainure 5 ase sure, avec des moyens connus, le positionnement et la fixation du radiateur sur son support tel qu'un palier d'alternateur de véhicule automobile. Such a profile is then cut into slices which form radiators 2 of the desired shape whose fins 6 form its cooling fins, the holes 3 form the housings of the rectifier diodes, the grooves 4 ensure, in cooperation with connection means known, the positioning of a positive radiator with a negative radiator, the groove 5 ase sure, with known means, the positioning and fixing of the radiator on its support such as a bearing of a motor vehicle alternator.
En conséquence à partir d'un tel profilé seule une opération de coupe est nécessaire pour l'obtention d'un radiateur ce qui le rend très économique et conséquemment rend un ensemble redresseur, obtenu à l'aide de tels radiateurs, très économique
Il est bien évident que des modifications pourront être apportées à une telle réalisation, notamment quant aux formes, sans sortir pour cela du cadre de l'invention. Consequently from such a profile only a cutting operation is necessary to obtain a radiator which makes it very economical and consequently makes a rectifier assembly, obtained using such radiators, very economical
It is quite obvious that modifications could be made to such an embodiment, in particular as regards the shapes, without departing from the scope of the invention.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8014895A FR2486308A3 (en) | 1980-07-04 | 1980-07-04 | Heat sink for vehicle alternator diode - has cooling fins obtained by drawing operation carried out simultaneously with receptacle for current diode before slicing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8014895A FR2486308A3 (en) | 1980-07-04 | 1980-07-04 | Heat sink for vehicle alternator diode - has cooling fins obtained by drawing operation carried out simultaneously with receptacle for current diode before slicing |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2486308A3 true FR2486308A3 (en) | 1982-01-08 |
Family
ID=9243843
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8014895A Pending FR2486308A3 (en) | 1980-07-04 | 1980-07-04 | Heat sink for vehicle alternator diode - has cooling fins obtained by drawing operation carried out simultaneously with receptacle for current diode before slicing |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2486308A3 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE9319259U1 (en) * | 1993-12-15 | 1994-03-24 | Siemens Ag | Heatsink |
EP0682223A1 (en) * | 1993-12-08 | 1995-11-15 | Fanuc Ltd. | Heat sink with a heat plate |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3305004A (en) * | 1965-08-24 | 1967-02-21 | Philips Corp | Heat dissipator with pivotable means to grip a semiconductor device |
FR2072775A5 (en) * | 1969-12-04 | 1971-09-24 | Siemens Ag |
-
1980
- 1980-07-04 FR FR8014895A patent/FR2486308A3/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3305004A (en) * | 1965-08-24 | 1967-02-21 | Philips Corp | Heat dissipator with pivotable means to grip a semiconductor device |
FR2072775A5 (en) * | 1969-12-04 | 1971-09-24 | Siemens Ag |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0682223A1 (en) * | 1993-12-08 | 1995-11-15 | Fanuc Ltd. | Heat sink with a heat plate |
EP0682223A4 (en) * | 1993-12-08 | 1996-08-14 | Fanuc Ltd | Heat sink with a heat plate. |
DE9319259U1 (en) * | 1993-12-15 | 1994-03-24 | Siemens Ag | Heatsink |
US5844313A (en) * | 1993-12-15 | 1998-12-01 | Siemens Aktiengesellschaft | Heat sink |
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