FR2485262B1 - - Google Patents
Info
- Publication number
- FR2485262B1 FR2485262B1 FR8013596A FR8013596A FR2485262B1 FR 2485262 B1 FR2485262 B1 FR 2485262B1 FR 8013596 A FR8013596 A FR 8013596A FR 8013596 A FR8013596 A FR 8013596A FR 2485262 B1 FR2485262 B1 FR 2485262B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W90/00—
-
- H10W76/157—
-
- H10W76/18—
-
- H10W76/60—
-
- H10W72/5449—
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8013596A FR2485262A1 (fr) | 1980-06-19 | 1980-06-19 | Boitier d'encapsulation resistant a de fortes pressions externes |
| DE8181400904T DE3164131D1 (en) | 1980-06-19 | 1981-06-05 | Encapsulating housing resistant against high external pressures for a hybrid circuit |
| EP81400904A EP0044755B1 (fr) | 1980-06-19 | 1981-06-05 | Boîtier d'encapsulation, résistant à de fortes pressions externes, pour circuit hybride |
| US06/557,256 US4518818A (en) | 1980-06-19 | 1984-01-04 | Encapsulating case able to resist high external pressures |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8013596A FR2485262A1 (fr) | 1980-06-19 | 1980-06-19 | Boitier d'encapsulation resistant a de fortes pressions externes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2485262A1 FR2485262A1 (fr) | 1981-12-24 |
| FR2485262B1 true FR2485262B1 (OSRAM) | 1984-10-26 |
Family
ID=9243259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8013596A Granted FR2485262A1 (fr) | 1980-06-19 | 1980-06-19 | Boitier d'encapsulation resistant a de fortes pressions externes |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4518818A (OSRAM) |
| EP (1) | EP0044755B1 (OSRAM) |
| DE (1) | DE3164131D1 (OSRAM) |
| FR (1) | FR2485262A1 (OSRAM) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2591801B1 (fr) * | 1985-12-17 | 1988-10-14 | Inf Milit Spatiale Aeronaut | Boitier d'encapsulation d'un circuit electronique |
| FR2688629A1 (fr) * | 1992-03-10 | 1993-09-17 | Thomson Csf | Procede et dispositif d'encapsulation en trois dimensions de pastilles semi-conductrices. |
| FR2709020B1 (fr) * | 1993-08-13 | 1995-09-08 | Thomson Csf | Procédé d'interconnexion de pastilles semi-conductrices en trois dimensions, et composant en résultant. |
| FR2719967B1 (fr) * | 1994-05-10 | 1996-06-07 | Thomson Csf | Interconnexion en trois dimensions de boîtiers de composants électroniques utilisant des circuits imprimés. |
| FR2802706B1 (fr) * | 1999-12-15 | 2002-03-01 | 3D Plus Sa | Procede et dispositif d'interconnexion en trois dimensions de composants electroniques |
| FR2832136B1 (fr) * | 2001-11-09 | 2005-02-18 | 3D Plus Sa | Dispositif d'encapsulation hermetique de composant devant etre protege de toute contrainte |
| FR2875672B1 (fr) * | 2004-09-21 | 2007-05-11 | 3D Plus Sa Sa | Dispositif electronique avec repartiteur de chaleur integre |
| FR2884049B1 (fr) * | 2005-04-01 | 2007-06-22 | 3D Plus Sa Sa | Module electronique de faible epaisseur comprenant un empilement de boitiers electroniques a billes de connexion |
| FR2894070B1 (fr) * | 2005-11-30 | 2008-04-11 | 3D Plus Sa Sa | Module electronique 3d |
| FR2895568B1 (fr) * | 2005-12-23 | 2008-02-08 | 3D Plus Sa Sa | Procede de fabrication collective de modules electroniques 3d |
| FR2905198B1 (fr) * | 2006-08-22 | 2008-10-17 | 3D Plus Sa Sa | Procede de fabrication collective de modules electroniques 3d |
| FR2911995B1 (fr) * | 2007-01-30 | 2009-03-06 | 3D Plus Sa Sa | Procede d'interconnexion de tranches electroniques |
| FR2923081B1 (fr) * | 2007-10-26 | 2009-12-11 | 3D Plus | Procede d'interconnexion verticale de modules electroniques 3d par des vias. |
| FR2940521B1 (fr) | 2008-12-19 | 2011-11-11 | 3D Plus | Procede de fabrication collective de modules electroniques pour montage en surface |
| FR2943176B1 (fr) | 2009-03-10 | 2011-08-05 | 3D Plus | Procede de positionnement des puces lors de la fabrication d'une plaque reconstituee |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3404215A (en) * | 1966-04-14 | 1968-10-01 | Sprague Electric Co | Hermetically sealed electronic module |
| US3436775A (en) * | 1966-12-28 | 1969-04-08 | Arthur J Schlosser | Deep submersible instrumentation package assembly |
| US3450082A (en) * | 1968-01-29 | 1969-06-17 | Ppg Industries Inc | Load-bearing member for curved ceramic segments subjected to high compressive loads |
| DE1764263A1 (de) * | 1968-05-06 | 1971-06-16 | Siemens Ag | Gut waermeableitendes Flachgehaeuse fuer Halbleitersysteme |
| CA1032276A (en) * | 1973-12-03 | 1978-05-30 | Andrew Koutalides | Package for semiconductor beam lead devices |
| US4208698A (en) * | 1977-10-26 | 1980-06-17 | Ilc Data Device Corporation | Novel hybrid packaging scheme for high density component circuits |
-
1980
- 1980-06-19 FR FR8013596A patent/FR2485262A1/fr active Granted
-
1981
- 1981-06-05 DE DE8181400904T patent/DE3164131D1/de not_active Expired
- 1981-06-05 EP EP81400904A patent/EP0044755B1/fr not_active Expired
-
1984
- 1984-01-04 US US06/557,256 patent/US4518818A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP0044755A3 (en) | 1982-02-10 |
| EP0044755B1 (fr) | 1984-06-13 |
| EP0044755A2 (fr) | 1982-01-27 |
| DE3164131D1 (en) | 1984-07-19 |
| US4518818A (en) | 1985-05-21 |
| FR2485262A1 (fr) | 1981-12-24 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |