FR2477829A1 - Hybrid microwave circuit mfr. using serigraphic layers - uses laser to machine notches from layers of conducting ink obtained by serigraphic process - Google Patents

Hybrid microwave circuit mfr. using serigraphic layers - uses laser to machine notches from layers of conducting ink obtained by serigraphic process Download PDF

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Publication number
FR2477829A1
FR2477829A1 FR8005181A FR8005181A FR2477829A1 FR 2477829 A1 FR2477829 A1 FR 2477829A1 FR 8005181 A FR8005181 A FR 8005181A FR 8005181 A FR8005181 A FR 8005181A FR 2477829 A1 FR2477829 A1 FR 2477829A1
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France
Prior art keywords
layers
serigraphic
notches
band
ink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8005181A
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French (fr)
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FR2477829B1 (en
Inventor
Hugues Baudry
Peter Harrop
Michel Monnier
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Laboratoires dElectronique Philips SAS
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Laboratoires dElectronique et de Physique Appliquee
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Priority to FR8005181A priority Critical patent/FR2477829A1/en
Publication of FR2477829A1 publication Critical patent/FR2477829A1/en
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Publication of FR2477829B1 publication Critical patent/FR2477829B1/fr
Granted legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00Auxiliary devices
    • H01P1/20Frequency-selective devices, e.g. filters
    • H01P1/201Filters for transverse electromagnetic waves
    • H01P1/203Strip line filters
    • H01P1/2039Galvanic coupling between Input/Output
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C17/00Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/24Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
    • H01C17/242Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles

Abstract

The circuit has a conductive band (1) applied across the surface of a substrate (3) by serigraphic printing using a conductive ink. The applied band is notched to provide a capacitive effect, with the notches (2) formed by laser machining. Pref. the conductive band (1) is applied to an Al substrate (3) by an atomic printing machine before firing at a temp. of about 850 deg.C. for 30 minutes. The machining of the notches (2) is effected by an automatic laser appts. using a YAG laser with a mean power of between 1 and 3 watts and a frequency of 1 to 5 Kg giving a spot with about 50 microns. The machining process can be also used to separate an applied conductive band into halves, or for selective material removal from an applied band for impedance adjustment. The mfg. process can be fully automated.

Description

REALISATION D'UN CIRCUIT HYPERFREQUENCE EN COUCHES SERIGRAPHIEES. REALIZATION OF A MICROWAVE CIRCUIT IN PRINTED LAYERS.

L'invention concerne un procédé de réalisation d'espaces de faible dimension, dans des couches obtenues par sérigraphie d'une encre sur un substrat, puis cuisson. L'invention concerne plus particulièrement la réalisation de circuits hyperfréquences, par exemple des filtres du type à micro-rubans, muni d'entailles de faible dimension, de manière à présenter un effet capacitif. The invention relates to a process for producing small spaces, in layers obtained by screen printing an ink on a substrate, then baking. The invention relates more particularly to the production of microwave circuits, for example filters of the micro-ribbon type, provided with small notches, so as to have a capacitive effect.

L'invention a trait à l'électronique, plus spécifiquement à la microcircuiterie hybride. The invention relates to electronics, more specifically to hybrid microcircuitry.

Lors de la réalisation de microcircuits, on est amené fréquemment à réaliser des espaces de faible dimension, que ce soit pour séparer deux bandes conductrices ou pour réaliser des entailles d'une forme prédéterminée , de manière à obtenir par exemple des filtres hyperfréquences. Par faibles dimensions, on entend ici des dimensions inférieures ou égales à 100 microns. When making microcircuits, it is frequently necessary to make small spaces, either to separate two conductive strips or to make notches of a predetermined shape, so as to obtain, for example, microwave filters. By small dimensions is meant here dimensions less than or equal to 100 microns.

Selon l'art antérieur, les motifs étaient réalisés par évaporation sous vide et l'on pouvait obtenir aisément à partir d'un masque donné, des couches minces de forme géométrique désirée. En outre, les procédés de photogravure permettaient d'obtenir ultérieurement la formation d'espaces de faibles dimensions. According to the prior art, the patterns were produced by vacuum evaporation and it was easy to obtain, from a given mask, thin layers of desired geometric shape. In addition, photogravure methods made it possible to subsequently obtain the formation of small spaces.

Mais ces méthodes de dépôt sous vide et de photogravure s'avèrent désormais trop chères; par rapport à la sérigraphie. But these methods of vacuum deposition and photoengraving are now proving to be too expensive; compared to screen printing.

Le procédé de sérigraphie, bien connu de l'homme de l'art, permet d'obtenir par passage à travers un écran de maille relativement fine, d'une encre suffisamment visqueuse pour ne pas trop s'étaler, la reproduction du motif défini sur l'écran. On effectue ensuite la cuisson, dans une atmosphère qui peut être par exemple l'air ou l'azote, de manière à éliminer le véhicule organique de l'encre, et à obtenir une couche solide, d'une épaisseur sensiblement égale à 10 microns. The screen printing process, well known to those skilled in the art, makes it possible to obtain, by passing through a relatively fine mesh screen, an ink sufficiently viscous not to spread too much, the reproduction of the defined pattern. on the screen. Baking is then carried out, in an atmosphere which may be, for example, air or nitrogen, so as to eliminate the organic vehicle from the ink, and to obtain a solid layer, of a thickness substantially equal to 10 microns. .

Ce procédé de sérigraphie est appliqué depuis peu, à la réalisation de microcircuits, car il est d'application industrielle immédiate et moins onéreux que les précédents procédés ; cependant, la mise en oeuvre de ce nouveau procédé ne permet pas d'obtenir des es paces'libres (non recouverts d'encre) de faible dimension, c'est-àdire dont les dimensions sont inférieures à une centaine de microns, car les dimensions des mailles de l'écran de sérigraphie sont approximativement de cet ordre de grandeur.L'article paru dans E.M.I. du ler octobre 1975, sous le titre"Les Ecrans : des outils essentiels pour la sérigraphie des couches épaisses" par F.FRANCONVILLE décrit les propriétés générales des écrans de sérigraphie et cite notamment qu'une bonne règle est d'utiliser une ouverture de mailles de 2,5 à 5 fois plus grande que la taille moyenne des particules. Les particules se présentant typiquement sous la forme de grains sphériques de 1 'ordre d'une dizaine de microns, on en déduit facilement que l'ouverture est environ de cinquante microns. I1 est indiqué également que les écrans de sérigraphie commercialisés présentent généralement une densité d'ouvertures de 325 Mesh, unité qui définit le nombre d'ouvertures par pouce linéraire (2,54 cm), soit environ une ouverture calculée de 50 microns. This screen printing process has recently been applied to the production of microcircuits, since it is of immediate industrial application and less expensive than the previous processes; however, the implementation of this new process does not make it possible to obtain free spaces (not covered with ink) of small size, that is to say whose dimensions are less than a hundred microns, because the dimensions of the meshes of the screen printing screen are approximately of this order of magnitude. The article published in EMI October 1, 1975, under the title "Screens: essential tools for screen printing thick layers" by F. FRANCONVILLE describes the general properties of screen printing screens and cites in particular that a good rule is to use a mesh opening 2.5 to 5 times larger than the average particle size. The particles being typically in the form of spherical grains of the order of ten microns, it can easily be deduced that the opening is about fifty microns. It is also indicated that the screen printing screens marketed generally have an opening density of 325 mesh, a unit which defines the number of openings per linear inch (2.54 cm), that is to say about a calculated opening of 50 microns.

L'invention vise à pallier les susdits inconvénients, en proposant un procédé de réalisation d'espaces de faible dimension dans des couches sérigraphiées, qui soit simple et économique. The invention aims to overcome the above drawbacks, by proposing a method of producing small spaces in screen-printed layers, which is simple and economical.

Ce procédé est remarquable en ce qu'il consiste à enlever la matière de la couche, en des endroits déterminés, au moyen d'un faisceau laser. This process is remarkable in that it consists in removing the material from the layer, in determined locations, by means of a laser beam.

Ce procédé trouve une application particulièrement avantageuse dans la réalisation de circuits hyperfréquences, tels que des filtres sous la forme de micro-rubans munis d'entailles de faible dimension. This method finds a particularly advantageous application in the production of microwave circuits, such as filters in the form of micro-ribbons provided with small notches.

La description qui va suivre, en regard des dessins annexés permettra de mieux comprendre comment l'invention se réalise. The description which follows, with reference to the appended drawings, will allow a better understanding of how the invention is implemented.

La figure 1 représente un riltre hyperfréquence, sous la forme d'un microruban, muni d'entailles dites en éperon.  FIG. 1 represents a microwave frequency filter, in the form of a microstrip, provided with so-called spur notches.

La figure 2 représente un transducteur interdigité. Figure 2 shows an interdigitated transducer.

Les figures 3 et 4 représentent un coupleur. Figures 3 and 4 show a coupler.

Selon l'art antérieur, la réalisation d'espaces de faible dimension s'obtient au moment du dépôt de couches minces, par évaporation sous vide, à travers un masque adéquat, ou ultérieurement au dépôt, par les techniques classiques de photogravure. According to the prior art, the creation of small spaces is obtained at the time of the deposition of thin layers, by evaporation under vacuum, through an adequate mask, or subsequently to the deposition, by conventional photogravure techniques.

Mais de tels procédés s'avèrent trop coûteux pour les produits de grande diffusion, comme le sont de nos jours les composants électroniques. However, such methods prove to be too expensive for mass market products, as electronic components are today.

La réalisation de microcircuits hybrides, par des procédés aussi classiques et peu chers que la sérigraphie a permis de développer toute une gamme de composants (conducteurs, résistances, capacités...), mais les dimensions des mailles des écrans empêchent la réalisation de bandes conductrices rapprochées, ou la formation d'entailles en vue d'obtenir des circuits hyperfréquences, de haute définition. The realization of hybrid microcircuits, by processes as conventional and inexpensive as screen printing has made it possible to develop a whole range of components (conductors, resistances, capacities ...), but the dimensions of the mesh of the screens prevent the production of conductive strips. close together, or the formation of notches in order to obtain high definition microwave circuits.

Des filtres hyperfréquences sont connus de l'art antérieur et l'on citera pour exemple l'article paru dans Microwaves,
Optics and Acoustics novembre 1977, Vol.l, nO 6, sous le titre "Design of microstrip spur-line band stop filters" par R.N. Bates qui décrit un type particulier de filtres munis d'entailles dites en éperon, et que l'on a représenté à la figure 1.
Microwave filters are known from the prior art and the article published in Microwaves will be cited as an example,
Optics and Acoustics November 1977, Vol.l, nO 6, under the title "Design of microstrip spur-line band stop filters" by RN Bates which describes a particular type of filters provided with notches known as spurs, and which one shown in Figure 1.

Selon cette figure, une bande conductrice 1 est munie d'entailles 2, dites en éperon, car constituées d'une première fente rectiligne perpendiculaire au bord de la bande, et d'une seconde fente rectiligne parallèle au bord de la bande, au milieu de celle-ci. According to this figure, a conductive strip 1 is provided with notches 2, called spurs, since they consist of a first straight slot perpendicular to the edge of the strip, and a second straight slot parallel to the edge of the strip, in the middle of it.

L'ensemble est réalisé sur un substrat 3, par exemple en alumine.The assembly is produced on a substrate 3, for example in alumina.

Les dimensions des fentes peuvent être différentes.The dimensions of the slots may be different.

Le procédé de réalisation d'une telle structure, conformément à la présente invention, consiste,à réaliser la bande conductrice 1, par sérigraphie d'une encre conductrice, par exemple une encre conductrice au cuivre, décrite dans le brevet de numéro 2 305 478 déposé le 25 Mars 1975, au nom de la Demanderesse, et cuisson sous azote, pendant 30 minutes à une température voisine de 8500C. The process for producing such a structure, in accordance with the present invention, consists in producing the conductive strip 1, by screen printing of a conductive ink, for example a conductive ink with copper, described in patent number 2,305,478 deposited on March 25, 1975, in the name of the Applicant, and cooking under nitrogen, for 30 minutes at a temperature in the region of 8500C.

On effectue alors, au moyen d'un faisceau laser focalisé, de puissance moyenne 1 à 5 W, une fréquence d'ajustage 1 à5 kHz, et une vitesse de découpe de 2 mm.s 1, pour un diamètre du spot voisin de 50 microns, l'enlèvement de la matière aux endroits déterminés. Then, by means of a focused laser beam, of average power 1 to 5 W, an adjustment frequency 1 to 5 kHz, and a cutting speed of 2 mm.s 1, for a diameter of the spot close to 50 microns, the removal of the material at the determined locations.

Pour des largeurs plUs importantes, plusieurs passages successifs se recouvrant partiellement, peuvent être utilisés.For larger widths, several successive partially overlapping passages can be used.

La conduite des opérations peut être entièrement automatisée, que se soit le dépôt par sérigraphie, à partir de machines automatiques commercialisées par exemple par la firme DE HAART, la cuisson sous azote, ou la volatilisation de matière par faisceau laser. The operations can be fully automated, whether by screen printing, from automatic machines marketed for example by the firm DE HAART, cooking under nitrogen, or volatilization of material by laser beam.

Un laser YAG permet notamment la réalisation de ces entailles, la longueur d'onde (1,06 /um) du rayonnement de ce type de laser le rendant facilement focalisable > des machines outils automatiques munies d'un tel laser et d'une table de commande étant déjà commercialisées.A YAG laser allows in particular the production of these notches, the wavelength (1.06 / μm) of the radiation of this type of laser making it easy to focus> automatic machine tools provided with such a laser and a table already sold.

Un tel procédé peut servir à la fabrication de filtres hyperfréquences mais également à la formation de tout espace de faible dimension. Ainsi, on peut séparer deux bandes conductrices après dépôt, et même rectifier des bandes de manière à ajuster leurs impédances à une valeur précise. Such a process can be used for the manufacture of microwave filters but also for the formation of any small space. Thus, it is possible to separate two conductive strips after deposition, and even to rectify strips so as to adjust their impedances to a precise value.

La liste des applications n'est pas limitée aux exemples cités, et l'homme de l'art ne fera pas oeuvre inventive dans la réalisation d'une variante non essentiellement différente. I1 ressort encore du domaine de l'invention, la réalisation d'antennes telles que décrite dans la demande de brevet européen 5.642 , déposée le 28 novembre 1979, où la formation des entailles peut être conduite selon ce procédé ; de même , la réalisation d'une structure telle que représentée à la figure 2, et qui représente un transducteur interdigité peut être effectuée selon ce procédé. The list of applications is not limited to the examples cited, and those skilled in the art will not do inventive work in the production of a variant which is not essentially different. I1 also emerges from the field of the invention, the production of antennas as described in European patent application 5.642, filed on November 28, 1979, where the formation of notches can be carried out according to this process; similarly, the production of a structure as shown in FIG. 2, and which represents an interdigital transducer can be carried out according to this method.

Il convient d'ajouter-en outre que les automatisations existantes permettent des géométries d'entailles extrêmement variées telles que celles représentées à la figure 3 (linéaire brisée) ou à la figure 4 (courbe ), et qui représentent un coupleur. It should also be added that the existing automations allow extremely varied notch geometries such as those represented in FIG. 3 (broken line) or in FIG. 4 (curve), and which represent a coupler.

Claims (3)

REVENDICATIONS :CLAIMS: 1. Procédé de réalisation d'espaces de faible dimension, dans des couches obtenues par sérigraphie puis cuisson, d'une encre sur un substrat, caractérisé en ce que l'on enlèue la matière de la couche en des endroits déterminés , au moyen d'un faisceau laser.1. A method of producing small spaces, in layers obtained by screen printing and then baking, of ink on a substrate, characterized in that the material of the layer is removed in determined locations, by means of 'a laser beam. 2. Application du procédé selon la revendication 12 à la réalisation de circuits hyperfréquences, sous la forme de micro-rubans munis d'entailles de faible dimension, de manière à présenter un effet capacitif, caractérisé en ce que l'on dépose ledit micro-ruban par sérigraphie d'une encre conductrice sur un substrat généralement en alumine, à travers un écran de sérigraphie, puis que l'on effectue la cuisson de ladite encre de manière à obtenir une couche solide, puis que l'on enlève la matière de la couche, en des endroits déterminés, au moyen d'un faisceau laser. 2. Application of the method according to claim 12 to the production of microwave circuits, in the form of micro-ribbons provided with small notches, so as to have a capacitive effect, characterized in that said micro- ribbon by serigraphy of a conductive ink on a generally alumina substrate, through a serigraphy screen, and then the ink is baked so as to obtain a solid layer, then the material is removed the layer, in determined locations, by means of a laser beam. 3. Filtres hyperfréquences, du type à micro-rubans munis d'entailles de faible dimension, obtenus par la mise en oeuvre du procédé selon la revendication l ou 2. 3. Microwave filters, of the micro-ribbon type provided with small notches, obtained by implementing the method according to claim 1 or 2.
FR8005181A 1980-03-07 1980-03-07 Hybrid microwave circuit mfr. using serigraphic layers - uses laser to machine notches from layers of conducting ink obtained by serigraphic process Granted FR2477829A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8005181A FR2477829A1 (en) 1980-03-07 1980-03-07 Hybrid microwave circuit mfr. using serigraphic layers - uses laser to machine notches from layers of conducting ink obtained by serigraphic process

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FR8005181A FR2477829A1 (en) 1980-03-07 1980-03-07 Hybrid microwave circuit mfr. using serigraphic layers - uses laser to machine notches from layers of conducting ink obtained by serigraphic process

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FR2477829A1 true FR2477829A1 (en) 1981-09-11
FR2477829B1 FR2477829B1 (en) 1984-10-19

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0181766A1 (en) * 1984-11-14 1986-05-21 Richard E. Caddock A high-voltage, noninductive, film-type resistor, and a method of making it

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1587471A (en) * 1967-10-12 1970-03-20
FR2105486A5 (en) * 1970-09-09 1972-04-28 Electro Resistance
US3764938A (en) * 1972-08-28 1973-10-09 Bell Telephone Labor Inc Resonance suppression in interdigital capacitors useful as dc bias breaks in diode oscillator circuits
FR2174247A1 (en) * 1972-03-01 1973-10-12 Electronic Components Ltd
FR2249488A1 (en) * 1973-10-29 1975-05-23 Matsushita Electric Ind Co Ltd
FR2357995A1 (en) * 1976-07-06 1978-02-03 Blaupunkt Werke Gmbh PROCESS FOR MANUFACTURING THICK FILM RESISTORS WITH IMPROVED CALIBRATION
FR2360969A1 (en) * 1976-08-03 1978-03-03 Spinner Gmbh Elektrotech HIGH FREQUENCY TERMINAL RESISTANCE IN TAPE CONDUCTOR TECHNOLOGY

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1587471A (en) * 1967-10-12 1970-03-20
FR2105486A5 (en) * 1970-09-09 1972-04-28 Electro Resistance
FR2174247A1 (en) * 1972-03-01 1973-10-12 Electronic Components Ltd
US3764938A (en) * 1972-08-28 1973-10-09 Bell Telephone Labor Inc Resonance suppression in interdigital capacitors useful as dc bias breaks in diode oscillator circuits
FR2249488A1 (en) * 1973-10-29 1975-05-23 Matsushita Electric Ind Co Ltd
FR2357995A1 (en) * 1976-07-06 1978-02-03 Blaupunkt Werke Gmbh PROCESS FOR MANUFACTURING THICK FILM RESISTORS WITH IMPROVED CALIBRATION
FR2360969A1 (en) * 1976-08-03 1978-03-03 Spinner Gmbh Elektrotech HIGH FREQUENCY TERMINAL RESISTANCE IN TAPE CONDUCTOR TECHNOLOGY

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0181766A1 (en) * 1984-11-14 1986-05-21 Richard E. Caddock A high-voltage, noninductive, film-type resistor, and a method of making it
US4670734A (en) * 1984-11-14 1987-06-02 Caddock Richard E Method of making a compact, high-voltage, noninductive, film-type resistor

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