FR2470444B1 - - Google Patents

Info

Publication number
FR2470444B1
FR2470444B1 FR7928721A FR7928721A FR2470444B1 FR 2470444 B1 FR2470444 B1 FR 2470444B1 FR 7928721 A FR7928721 A FR 7928721A FR 7928721 A FR7928721 A FR 7928721A FR 2470444 B1 FR2470444 B1 FR 2470444B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7928721A
Other languages
French (fr)
Other versions
FR2470444A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Radiotechnique Compelec RTC SA
Original Assignee
Radiotechnique Compelec RTC SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Radiotechnique Compelec RTC SA filed Critical Radiotechnique Compelec RTC SA
Priority to FR7928721A priority Critical patent/FR2470444A1/fr
Publication of FR2470444A1 publication Critical patent/FR2470444A1/fr
Application granted granted Critical
Publication of FR2470444B1 publication Critical patent/FR2470444B1/fr
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76886Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances
    • H01L21/76888By rendering at least a portion of the conductor non conductive, e.g. oxidation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Element Separation (AREA)
FR7928721A 1979-11-21 1979-11-21 Perfectionnement au procede de realisation d'un reseau de connexions par anodisation localisee sur un support semi-conducteur Granted FR2470444A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7928721A FR2470444A1 (fr) 1979-11-21 1979-11-21 Perfectionnement au procede de realisation d'un reseau de connexions par anodisation localisee sur un support semi-conducteur

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7928721A FR2470444A1 (fr) 1979-11-21 1979-11-21 Perfectionnement au procede de realisation d'un reseau de connexions par anodisation localisee sur un support semi-conducteur

Publications (2)

Publication Number Publication Date
FR2470444A1 FR2470444A1 (fr) 1981-05-29
FR2470444B1 true FR2470444B1 (OSRAM) 1983-04-29

Family

ID=9231951

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7928721A Granted FR2470444A1 (fr) 1979-11-21 1979-11-21 Perfectionnement au procede de realisation d'un reseau de connexions par anodisation localisee sur un support semi-conducteur

Country Status (1)

Country Link
FR (1) FR2470444A1 (OSRAM)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4488349A (en) * 1982-04-09 1984-12-18 Nissan Motor Company, Limited Method of repairing shorts in parallel connected vertical semiconductor devices by selective anodization

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1010157A (en) * 1974-01-14 1977-05-10 Bernard T. Murphy Oxide isolated integrated circuit structure and method for fabricating

Also Published As

Publication number Publication date
FR2470444A1 (fr) 1981-05-29

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Legal Events

Date Code Title Description
CA Change of address
CD Change of name or company name
ST Notification of lapse