FR2466866B1 - - Google Patents
Info
- Publication number
- FR2466866B1 FR2466866B1 FR7924891A FR7924891A FR2466866B1 FR 2466866 B1 FR2466866 B1 FR 2466866B1 FR 7924891 A FR7924891 A FR 7924891A FR 7924891 A FR7924891 A FR 7924891A FR 2466866 B1 FR2466866 B1 FR 2466866B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/14—Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies
- H10F77/147—Shapes of bodies
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/421—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12043—Photo diode
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optical Couplings Of Light Guides (AREA)
- Light Receiving Elements (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7924891A FR2466866A1 (fr) | 1979-10-05 | 1979-10-05 | Procede de couplage entre une fibre optique et une diode opto-electronique, et tete d'emission ou de reception realisee par ce procede |
| EP80401353A EP0027072B1 (fr) | 1979-10-05 | 1980-09-23 | Procédé de couplage entre une fibre optique et une diode opto-électronique, et tête d'émission ou de réception réalisée par ce procédé |
| DE8080401353T DE3063348D1 (en) | 1979-10-05 | 1980-09-23 | Method of coupling an optical fibre to an opto-electronic diode, and emitting or receiving bit realized by this method |
| US06/193,294 US4326771A (en) | 1979-10-05 | 1980-10-02 | Method of coupling between an optical fiber and an optoelectronic diode, and a transmitting or receiving head fabricated by means of said method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7924891A FR2466866A1 (fr) | 1979-10-05 | 1979-10-05 | Procede de couplage entre une fibre optique et une diode opto-electronique, et tete d'emission ou de reception realisee par ce procede |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2466866A1 FR2466866A1 (fr) | 1981-04-10 |
| FR2466866B1 true FR2466866B1 (enExample) | 1983-03-18 |
Family
ID=9230384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7924891A Granted FR2466866A1 (fr) | 1979-10-05 | 1979-10-05 | Procede de couplage entre une fibre optique et une diode opto-electronique, et tete d'emission ou de reception realisee par ce procede |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4326771A (enExample) |
| EP (1) | EP0027072B1 (enExample) |
| DE (1) | DE3063348D1 (enExample) |
| FR (1) | FR2466866A1 (enExample) |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2458825A1 (fr) * | 1979-06-08 | 1981-01-02 | Thomson Csf | Procede de montage d'une fibre optique dans un embout, embout ainsi monte, et dispositif de connexion de fibres optiques utilisant cet embout |
| US4653847A (en) * | 1981-02-23 | 1987-03-31 | Motorola, Inc. | Fiber optics semiconductor package |
| US4461537A (en) * | 1981-12-24 | 1984-07-24 | Molex Incorporated | Fiber optic connector assembly |
| US4784454A (en) * | 1982-08-02 | 1988-11-15 | Andrew Corporation | Optical fiber and laser interface device |
| CA1267468A (en) * | 1983-11-21 | 1990-04-03 | Hideaki Nishizawa | Optical device package |
| US4647147A (en) * | 1984-01-20 | 1987-03-03 | Hughes Aircraft Company | Fiber optic to integrated optical chip coupler |
| CA1255382A (en) * | 1984-08-10 | 1989-06-06 | Masao Kawachi | Hybrid optical integrated circuit with alignment guides |
| US4616899A (en) * | 1984-08-31 | 1986-10-14 | Gte Laboratories Incorporated | Methods of and apparatus for coupling an optoelectronic component to an optical fiber |
| US4675624A (en) * | 1985-03-29 | 1987-06-23 | Rca Corporation | Electrical phase shifter controlled by light |
| US4744623A (en) * | 1985-10-16 | 1988-05-17 | The Trustees Of Columbia University In The City Of New York | Integrated fiber optic coupler for VHSIC/VLSI interconnects |
| CA1271550A (en) * | 1985-12-24 | 1990-07-10 | Fumio Inaba | Semiconductor light emitting device with vertical light emission |
| US4779946A (en) * | 1986-02-14 | 1988-10-25 | American Telephone And Telegraph Company, At&T Bell Laboratories | Microminiature optical assembly |
| US4751513A (en) * | 1986-05-02 | 1988-06-14 | Rca Corporation | Light controlled antennas |
| US4812002A (en) * | 1986-10-24 | 1989-03-14 | Hitachi, Ltd. | Optical coupling device and method of making the same |
| US4892374A (en) * | 1988-03-03 | 1990-01-09 | American Telephone And Telegraph Company, At&T Bell Laboratories | Article comprising an opto-electronic device and an optical waveguide coupled thereto, and method of making the article |
| US4995695A (en) * | 1989-08-17 | 1991-02-26 | At&T Bell Laboratories | Optical assembly comprising optical fiber coupling means |
| US4977107A (en) * | 1989-08-23 | 1990-12-11 | Motorola Inc. | Method for manufacturing semiconductor rectifier |
| DE4002490A1 (de) * | 1989-08-31 | 1991-08-01 | Bodenseewerk Geraetetech | Verfahren zum anbringen von elektrooptischen bauteilen an integriert-optischen wellenleitern |
| US5051789A (en) * | 1990-10-11 | 1991-09-24 | The United States Of America As Represented By The United States Department Of Energy | Device having two optical ports for switching applications |
| US5221641A (en) * | 1991-06-21 | 1993-06-22 | Rohm Co., Ltd. | Process for making light emitting diodes |
| US5308656A (en) * | 1991-07-16 | 1994-05-03 | Adc Telecommunications, Inc. | Electroformed mask and use therefore |
| JP3093049B2 (ja) * | 1992-09-22 | 2000-10-03 | ローム株式会社 | 光分岐結合器 |
| JPH06237016A (ja) * | 1993-02-09 | 1994-08-23 | Matsushita Electric Ind Co Ltd | 光ファイバモジュールおよびその製造方法 |
| US5546413A (en) * | 1994-09-01 | 1996-08-13 | Motorola | Integrated light emitting device |
| US5575929A (en) * | 1995-06-05 | 1996-11-19 | The Regents Of The University Of California | Method for making circular tubular channels with two silicon wafers |
| JP3166564B2 (ja) * | 1995-06-27 | 2001-05-14 | 松下電器産業株式会社 | 半導体レーザ実装体およびその製造方法 |
| FR2758888B1 (fr) * | 1997-01-27 | 1999-04-23 | Thomson Csf | Procede de modelisation fine du fouillis de sol recu par un radar |
| US6901221B1 (en) | 1999-05-27 | 2005-05-31 | Jds Uniphase Corporation | Method and apparatus for improved optical elements for vertical PCB fiber optic modules |
| US6213651B1 (en) | 1999-05-26 | 2001-04-10 | E20 Communications, Inc. | Method and apparatus for vertical board construction of fiber optic transmitters, receivers and transceivers |
| KR100420951B1 (ko) * | 2002-04-17 | 2004-03-02 | 한국전자통신연구원 | 분극 광섬유, 분극 광섬유를 제조하는 방법 및 분산 보상기 |
| US6913399B2 (en) * | 2003-07-23 | 2005-07-05 | Intel Corporation | Metallized optical fibers and ferrules for optical fibers for direct attachment to photodiodes |
| DE102006058622A1 (de) * | 2006-12-11 | 2008-06-19 | Schleifring Und Apparatebau Gmbh | Empfangseinheit für einen optischen Drehübertrager |
| US9386655B2 (en) | 2008-05-27 | 2016-07-05 | Nxp B.V. | Light sensor device and manufacturing method |
| EP2730212A4 (en) * | 2012-06-28 | 2015-04-15 | Olympus Medical Systems Corp | SCANNING DOSE AND METHOD OF MANUFACTURING SCANNING DOCUMENT |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4010483A (en) * | 1974-08-08 | 1977-03-01 | International Telephone And Telegraph Corporation | Current confining light emitting diode |
| CA1058732A (en) * | 1976-06-11 | 1979-07-17 | Northern Telecom Limited | Light emitting diodes with increased light emission efficiency |
| FR2387517A1 (fr) * | 1977-04-13 | 1978-11-10 | Thomson Csf | Systeme d'encapsulation etanche d'un dispositif optoelectronique emetteur ou recepteur a transmission par fibre optique |
| US4227975A (en) * | 1979-01-29 | 1980-10-14 | Bell Telephone Laboratories, Incorporated | Selective plasma etching of dielectric masks in the presence of native oxides of group III-V compound semiconductors |
-
1979
- 1979-10-05 FR FR7924891A patent/FR2466866A1/fr active Granted
-
1980
- 1980-09-23 DE DE8080401353T patent/DE3063348D1/de not_active Expired
- 1980-09-23 EP EP80401353A patent/EP0027072B1/fr not_active Expired
- 1980-10-02 US US06/193,294 patent/US4326771A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP0027072B1 (fr) | 1983-05-18 |
| EP0027072A1 (fr) | 1981-04-15 |
| FR2466866A1 (fr) | 1981-04-10 |
| DE3063348D1 (en) | 1983-07-07 |
| US4326771A (en) | 1982-04-27 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |