FR2466103B1 - - Google Patents

Info

Publication number
FR2466103B1
FR2466103B1 FR7923204A FR7923204A FR2466103B1 FR 2466103 B1 FR2466103 B1 FR 2466103B1 FR 7923204 A FR7923204 A FR 7923204A FR 7923204 A FR7923204 A FR 7923204A FR 2466103 B1 FR2466103 B1 FR 2466103B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7923204A
Other languages
French (fr)
Other versions
FR2466103A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to FR7923204A priority Critical patent/FR2466103A1/fr
Publication of FR2466103A1 publication Critical patent/FR2466103A1/fr
Application granted granted Critical
Publication of FR2466103B1 publication Critical patent/FR2466103B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/467—Adding a circuit layer by thin film methods
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
FR7923204A 1979-09-18 1979-09-18 Procede de realisation d'un reseau d'interconnexion de composants electroniques a conducteurs en aluminium et isolant en alumine et reseau d'interconnexion obtenu par ce procede Granted FR2466103A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7923204A FR2466103A1 (fr) 1979-09-18 1979-09-18 Procede de realisation d'un reseau d'interconnexion de composants electroniques a conducteurs en aluminium et isolant en alumine et reseau d'interconnexion obtenu par ce procede

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7923204A FR2466103A1 (fr) 1979-09-18 1979-09-18 Procede de realisation d'un reseau d'interconnexion de composants electroniques a conducteurs en aluminium et isolant en alumine et reseau d'interconnexion obtenu par ce procede

Publications (2)

Publication Number Publication Date
FR2466103A1 FR2466103A1 (fr) 1981-03-27
FR2466103B1 true FR2466103B1 (https=) 1983-07-18

Family

ID=9229735

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7923204A Granted FR2466103A1 (fr) 1979-09-18 1979-09-18 Procede de realisation d'un reseau d'interconnexion de composants electroniques a conducteurs en aluminium et isolant en alumine et reseau d'interconnexion obtenu par ce procede

Country Status (1)

Country Link
FR (1) FR2466103A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3315615A1 (de) * 1983-04-29 1984-10-31 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren zur herstellung einer multilayer-schaltung
JPS60140897A (ja) * 1983-12-28 1985-07-25 日本電気株式会社 樹脂絶縁多層基板
US4657778A (en) * 1984-08-01 1987-04-14 Moran Peter L Multilayer systems and their method of production
US5580825A (en) * 1993-09-20 1996-12-03 International Technology Exchange Corp. Process for making multilevel interconnections of electronic components
IL110431A (en) * 1994-07-25 2001-08-08 Microcomponents And Systems Lt Method of manufacturing a composite structure for use in electronic device and structure manufactured by said method
IL120866A0 (en) 1997-05-20 1997-09-30 Micro Components Systems Ltd Process for producing an aluminum substrate
IL127256A (en) * 1998-11-25 2002-09-12 Micro Components Ltd Device for electronic packaging, a process for manufacturing thereof, and a pin jig fixture for use in the process
NL1033519C2 (nl) * 2007-03-08 2008-09-16 Yun Tai Werkwijze voor warmteoverdracht bij halfgeleiders.
WO2016190737A2 (en) * 2015-05-26 2016-12-01 Metalmembranes.Com B.V. Method to produce electrically isolated or insulated areas in a metal, and a product comprising such area

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3827949A (en) * 1972-03-29 1974-08-06 Ibm Anodic oxide passivated planar aluminum metallurgy system and method of producing
JPS49131863U (https=) * 1973-03-10 1974-11-13
US4015987A (en) * 1975-08-13 1977-04-05 The United States Of America As Represented By The Secretary Of The Navy Process for making chip carriers using anodized aluminum

Also Published As

Publication number Publication date
FR2466103A1 (fr) 1981-03-27

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Legal Events

Date Code Title Description
ST Notification of lapse