FR2459552B1 - Support pour composants electriques - Google Patents

Support pour composants electriques

Info

Publication number
FR2459552B1
FR2459552B1 FR8013079A FR8013079A FR2459552B1 FR 2459552 B1 FR2459552 B1 FR 2459552B1 FR 8013079 A FR8013079 A FR 8013079A FR 8013079 A FR8013079 A FR 8013079A FR 2459552 B1 FR2459552 B1 FR 2459552B1
Authority
FR
France
Prior art keywords
support
electrical components
electrical
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8013079A
Other languages
English (en)
Other versions
FR2459552A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AEI Semiconductors Ltd
Original Assignee
AEI Semiconductors Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AEI Semiconductors Ltd filed Critical AEI Semiconductors Ltd
Publication of FR2459552A1 publication Critical patent/FR2459552A1/fr
Application granted granted Critical
Publication of FR2459552B1 publication Critical patent/FR2459552B1/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736Metallic materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731Ceramic materials or glass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3011Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR8013079A 1979-06-19 1980-06-12 Support pour composants electriques Expired FR2459552B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB7921369 1979-06-19
GB8011579A GB2051474B (en) 1979-06-19 1980-04-08 Mounting arrangements for electrical components

Publications (2)

Publication Number Publication Date
FR2459552A1 FR2459552A1 (fr) 1981-01-09
FR2459552B1 true FR2459552B1 (fr) 1985-11-15

Family

ID=26271900

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8013079A Expired FR2459552B1 (fr) 1979-06-19 1980-06-12 Support pour composants electriques

Country Status (2)

Country Link
FR (1) FR2459552B1 (fr)
GB (1) GB2051474B (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3584515D1 (de) * 1985-01-11 1991-11-28 Sumitomo Electric Industries Waermesenke unter verwendung eines gesinterten koerpers mit hoher waermeleitfaehigkeit und verfahren zu ihrer herstellung.
JPH03240259A (ja) * 1990-02-19 1991-10-25 Mitsubishi Electric Corp 半導体パッケージ
DE10022341B4 (de) * 2000-05-08 2005-03-31 eupec Europäische Gesellschaft für Leistungshalbleiter mbH & Co. KG Elektronisches Leistungsmodul
JP4450230B2 (ja) 2005-12-26 2010-04-14 株式会社デンソー 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1540188A (fr) * 1966-10-10 1968-09-20 Gen Electric Perfectionnements aux dispositifs à semi-conducteur sans soudure
US3609471A (en) * 1969-07-22 1971-09-28 Gen Electric Semiconductor device with thermally conductive dielectric barrier
GB1501388A (en) * 1974-07-30 1978-02-15 Aei Semiconductors Ltd Mounting assemblies for electronic components
GB1486745A (en) * 1976-07-28 1977-09-21 Aei Semiconductors Ltd Mounting assemblies for electronic components

Also Published As

Publication number Publication date
FR2459552A1 (fr) 1981-01-09
GB2051474B (en) 1984-04-26
GB2051474A (en) 1981-01-14

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Legal Events

Date Code Title Description
ST Notification of lapse