FR2441492B1 - - Google Patents

Info

Publication number
FR2441492B1
FR2441492B1 FR7928628A FR7928628A FR2441492B1 FR 2441492 B1 FR2441492 B1 FR 2441492B1 FR 7928628 A FR7928628 A FR 7928628A FR 7928628 A FR7928628 A FR 7928628A FR 2441492 B1 FR2441492 B1 FR 2441492B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7928628A
Other languages
French (fr)
Other versions
FR2441492A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dynamics Research Corp
Original Assignee
Dynamics Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dynamics Research Corp filed Critical Dynamics Research Corp
Publication of FR2441492A1 publication Critical patent/FR2441492A1/fr
Application granted granted Critical
Publication of FR2441492B1 publication Critical patent/FR2441492B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/385—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective supply of electric current or selective application of magnetism to a printing or impression-transfer material
    • B41J2/39—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective supply of electric current or selective application of magnetism to a printing or impression-transfer material using multi-stylus heads
    • B41J2/395—Structure of multi-stylus heads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4076—Through-connections; Vertical interconnect access [VIA] connections by thin-film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Dot-Matrix Printers And Others (AREA)
FR7928628A 1978-11-20 1979-11-20 Tete d'impression electrostatique et son procede de fabrication Granted FR2441492A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US96219378A 1978-11-20 1978-11-20

Publications (2)

Publication Number Publication Date
FR2441492A1 FR2441492A1 (fr) 1980-06-13
FR2441492B1 true FR2441492B1 (de) 1985-03-29

Family

ID=25505530

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7928628A Granted FR2441492A1 (fr) 1978-11-20 1979-11-20 Tete d'impression electrostatique et son procede de fabrication

Country Status (4)

Country Link
JP (1) JPS5571564A (de)
DE (1) DE2946866A1 (de)
FR (1) FR2441492A1 (de)
GB (1) GB2035908B (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NZ198031A (en) * 1980-08-21 1988-11-29 Dennison Mfg Co Electrostatic printer: charged particles extracted from glow discharge
JPS599066A (ja) * 1982-07-07 1984-01-18 Stanley Electric Co Ltd 静電記録用ヘツド
GB2139148B (en) * 1983-05-03 1987-02-25 Dynamics Res Corp Electrostatic print head and method of fabrication
FR2546819A1 (fr) * 1983-06-02 1984-12-07 Dynamics Res Corp Procede de fabrication de tetes d'impression electrostatique et tetes d'impression obtenues par sa mise en oeuvre
JPS61235163A (ja) * 1985-04-12 1986-10-20 Matsushita Electric Ind Co Ltd 高密度配線体の製造方法
JPS6222509A (ja) * 1985-07-22 1987-01-30 井関農機株式会社 作物掘取装置
JP2845813B2 (ja) * 1996-06-17 1999-01-13 新潟日本電気株式会社 静電式インクジェット記録ヘッドの製造方法
US9433101B2 (en) 2014-10-16 2016-08-30 International Business Machines Corporation Substrate via filling

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3754278A (en) * 1971-12-01 1973-08-21 American Micro Syst Thermal printing system
US3903594A (en) * 1974-05-28 1975-09-09 Gould Inc Method of making electrographic recording heads employing printed circuit techniques
JPS511135A (de) * 1974-06-24 1976-01-07 Nippon Telegraph & Telephone
JPS6020368B2 (ja) * 1974-10-11 1985-05-21 エーザイ株式会社 １，４ベンゾハイドロキノン誘導体の製法
JPS5320929A (en) * 1976-08-11 1978-02-25 Mitsubishi Electric Corp Electrostatic recording head with zigzag multi-stylus and its manufacture

Also Published As

Publication number Publication date
DE2946866A1 (de) 1980-06-19
FR2441492A1 (fr) 1980-06-13
GB2035908B (en) 1983-02-09
JPS5571564A (en) 1980-05-29
GB2035908A (en) 1980-06-25

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Legal Events

Date Code Title Description
ST Notification of lapse