FR2431451A1 - Appareil d'automatisation pour decouper et placer des segments de film sur des montages et pour empiler les montages dans un magasin de sortie - Google Patents
Appareil d'automatisation pour decouper et placer des segments de film sur des montages et pour empiler les montages dans un magasin de sortieInfo
- Publication number
- FR2431451A1 FR2431451A1 FR7916808A FR7916808A FR2431451A1 FR 2431451 A1 FR2431451 A1 FR 2431451A1 FR 7916808 A FR7916808 A FR 7916808A FR 7916808 A FR7916808 A FR 7916808A FR 2431451 A1 FR2431451 A1 FR 2431451A1
- Authority
- FR
- France
- Prior art keywords
- mounts
- cutting
- stacking
- segments
- automation apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
Abstract
Appareil d'automatisation pour découper et placer des segments de film sur des montages et pour empiler les montages dans un magasin. L'appareil comprend un mécanisme d'avance et de guidage de film comportant des segments de dimensions égales, un moyen de chargement effectuant à chaque cycle de fonctionnement le découpage d'un segment et son chargement sur un montage occupant une position prédéterminée par rapport à un premier moyen de guidage un moyen de transfert de montages opérant par cycles, pour faire déplacer chaque montage du premier moyen de guidage dans un second moyen de guidage pendant un cycle de fonctionnement du moyen de transfert, un dispositif de commande de cycle permettant d'empiler un à un dans le magasin les montages sur lesquels des segments sont mis en place. Application au montage de pastilles à circuits intégrés.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/921,664 US4192449A (en) | 1978-07-03 | 1978-07-03 | Coding system |
US05/921,638 US4227289A (en) | 1978-07-03 | 1978-07-03 | Automation system for mounting film segments into fixtures |
US05/921,640 US4180893A (en) | 1978-07-03 | 1978-07-03 | Apparatus for cutting a segment from a strip of film and mounting the segment in a fixture |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2431451A1 true FR2431451A1 (fr) | 1980-02-15 |
FR2431451B1 FR2431451B1 (fr) | 1984-11-16 |
Family
ID=27420649
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7916808A Granted FR2431451A1 (fr) | 1978-07-03 | 1979-06-28 | Appareil d'automatisation pour decouper et placer des segments de film sur des montages et pour empiler les montages dans un magasin de sortie |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE2926865A1 (fr) |
FR (1) | FR2431451A1 (fr) |
GB (1) | GB2028283B (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1990001793A1 (fr) * | 1988-08-03 | 1990-02-22 | Byers Photo Equipment Co. | Procede et appareil d'encadrement d'un circuit integre monte sur un film |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE8901638U1 (fr) * | 1989-01-31 | 1989-06-22 | Frost, Guenther, 8400 Regensburg, De |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3625384A (en) * | 1968-09-26 | 1971-12-07 | Ibm | Article-handling apparatus |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4007479A (en) * | 1976-03-29 | 1977-02-08 | Honeywell Information Systems, Inc. | Fixture for an integrated circuit chip |
US4069496A (en) * | 1976-12-30 | 1978-01-17 | Honeywell Information Systems Inc. | Reusable fixture for an integrated circuit chip |
-
1979
- 1979-06-05 GB GB7919624A patent/GB2028283B/en not_active Expired
- 1979-06-28 FR FR7916808A patent/FR2431451A1/fr active Granted
- 1979-07-03 DE DE19792926865 patent/DE2926865A1/de not_active Withdrawn
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3625384A (en) * | 1968-09-26 | 1971-12-07 | Ibm | Article-handling apparatus |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1990001793A1 (fr) * | 1988-08-03 | 1990-02-22 | Byers Photo Equipment Co. | Procede et appareil d'encadrement d'un circuit integre monte sur un film |
Also Published As
Publication number | Publication date |
---|---|
DE2926865A1 (de) | 1980-01-31 |
GB2028283B (en) | 1982-08-11 |
FR2431451B1 (fr) | 1984-11-16 |
GB2028283A (en) | 1980-03-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |