FR2431348B3 - - Google Patents

Info

Publication number
FR2431348B3
FR2431348B3 FR7918137A FR7918137A FR2431348B3 FR 2431348 B3 FR2431348 B3 FR 2431348B3 FR 7918137 A FR7918137 A FR 7918137A FR 7918137 A FR7918137 A FR 7918137A FR 2431348 B3 FR2431348 B3 FR 2431348B3
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7918137A
Other versions
FR2431348A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/924,884 external-priority patent/US4197676A/en
Application filed by Individual filed Critical Individual
Publication of FR2431348A1 publication Critical patent/FR2431348A1/fr
Application granted granted Critical
Publication of FR2431348B3 publication Critical patent/FR2431348B3/fr
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
FR7918137A 1978-07-17 1979-07-12 Appareil pour le controle automatique du rodage Granted FR2431348A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US05/924,884 US4197676A (en) 1978-07-17 1978-07-17 Apparatus for automatic lapping control
US06/010,983 US4199902A (en) 1978-07-17 1979-02-09 Apparatus for automatic lapping control

Publications (2)

Publication Number Publication Date
FR2431348A1 FR2431348A1 (fr) 1980-02-15
FR2431348B3 true FR2431348B3 (fr) 1981-03-27

Family

ID=26681839

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7918137A Granted FR2431348A1 (fr) 1978-07-17 1979-07-12 Appareil pour le controle automatique du rodage

Country Status (4)

Country Link
US (1) US4199902A (fr)
DE (1) DE2923209C2 (fr)
FR (1) FR2431348A1 (fr)
GB (1) GB2029961B (fr)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4281484A (en) * 1980-02-11 1981-08-04 The Stoneleigh Trust System for precisely and economically adjusting the resonance frequence of electroacoustic transducers
DE3034425A1 (de) * 1980-09-12 1982-05-13 Robert Bosch Gmbh, 7000 Stuttgart Verfahren zum gleichzeitigen laeppen mehrerer scheibenfoermiger koerper
US4407094A (en) * 1981-11-03 1983-10-04 Transat Corp. Apparatus for automatic lapping control
GB2124386B (en) * 1982-06-26 1985-12-11 Derek Harry Graddon Redman Dynamic measuring system
US4502253A (en) * 1982-08-12 1985-03-05 Magnaflux Corporation Surface treating and testing apparatus
GB8404007D0 (en) * 1984-02-15 1984-03-21 Redman D H G Measuring system
DE3628143A1 (de) * 1986-08-19 1988-02-25 Winter & Sohn Ernst Verfahren und vorrichtung zum abrichten von schleifscheiben
US4793895A (en) * 1988-01-25 1988-12-27 Ibm Corporation In situ conductivity monitoring technique for chemical/mechanical planarization endpoint detection
US5175938A (en) * 1988-08-31 1993-01-05 Digital Equipment Corporation Electrical guide for tight tolerance machining
US5136817A (en) * 1990-02-28 1992-08-11 Nihon Dempa Kogyo Co., Ltd. Automatic lapping apparatus for piezoelectric materials
US5081421A (en) * 1990-05-01 1992-01-14 At&T Bell Laboratories In situ monitoring technique and apparatus for chemical/mechanical planarization endpoint detection
US5433650A (en) * 1993-05-03 1995-07-18 Motorola, Inc. Method for polishing a substrate
US5618447A (en) * 1996-02-13 1997-04-08 Micron Technology, Inc. Polishing pad counter meter and method for real-time control of the polishing rate in chemical-mechanical polishing of semiconductor wafers
US5947799A (en) * 1996-04-05 1999-09-07 Kaoyashi; Michihiko Automatic lapping control
US7374644B2 (en) * 2000-02-17 2008-05-20 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7303662B2 (en) * 2000-02-17 2007-12-04 Applied Materials, Inc. Contacts for electrochemical processing
US20080156657A1 (en) * 2000-02-17 2008-07-03 Butterfield Paul D Conductive polishing article for electrochemical mechanical polishing
US20040020789A1 (en) * 2000-02-17 2004-02-05 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7029365B2 (en) 2000-02-17 2006-04-18 Applied Materials Inc. Pad assembly for electrochemical mechanical processing
US6416392B1 (en) * 2000-11-30 2002-07-09 Seh America, Inc. Sound enhanced lapping process
US7137879B2 (en) * 2001-04-24 2006-11-21 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7344432B2 (en) * 2001-04-24 2008-03-18 Applied Materials, Inc. Conductive pad with ion exchange membrane for electrochemical mechanical polishing
US7052364B2 (en) * 2004-06-14 2006-05-30 Cabot Microelectronics Corporation Real time polishing process monitoring
JP2008227393A (ja) * 2007-03-15 2008-09-25 Fujikoshi Mach Corp ウェーハの両面研磨装置
US8012000B2 (en) * 2007-04-02 2011-09-06 Applied Materials, Inc. Extended pad life for ECMP and barrier removal
US20080293343A1 (en) * 2007-05-22 2008-11-27 Yuchun Wang Pad with shallow cells for electrochemical mechanical processing
JP2012205258A (ja) * 2011-03-28 2012-10-22 Seiko Instruments Inc 研磨方法、圧電振動片の製造方法、圧電振動子、発振器、電子機器及び電波時計

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2340843A (en) * 1941-08-20 1944-02-01 Bendix Aviat Corp Piezoelectric apparatus and method
US2794951A (en) * 1953-08-27 1957-06-04 Socony Mobil Oil Co Inc Dynamic cable measuring system
US3063206A (en) * 1959-05-05 1962-11-13 Westinghouse Electric Corp Lapping machine
US3097458A (en) * 1960-05-13 1963-07-16 Method of accurately machining semiconductor bodies
US3579922A (en) * 1968-10-11 1971-05-25 Western Electric Co Apparatus for abrading articles

Also Published As

Publication number Publication date
DE2923209C2 (de) 1985-04-04
GB2029961A (en) 1980-03-26
DE2923209A1 (de) 1980-01-31
US4199902A (en) 1980-04-29
GB2029961B (en) 1983-02-02
FR2431348A1 (fr) 1980-02-15

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Legal Events

Date Code Title Description
ST Notification of lapse