FR2412167A1 - Dispositif semi-conducteur, comportant une feuille mince flexible et isolante - Google Patents

Dispositif semi-conducteur, comportant une feuille mince flexible et isolante

Info

Publication number
FR2412167A1
FR2412167A1 FR7834817A FR7834817A FR2412167A1 FR 2412167 A1 FR2412167 A1 FR 2412167A1 FR 7834817 A FR7834817 A FR 7834817A FR 7834817 A FR7834817 A FR 7834817A FR 2412167 A1 FR2412167 A1 FR 2412167A1
Authority
FR
France
Prior art keywords
thin sheet
semiconductor device
sheet
conductors
insulating sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7834817A
Other languages
English (en)
French (fr)
Other versions
FR2412167B1 (https=
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of FR2412167A1 publication Critical patent/FR2412167A1/fr
Application granted granted Critical
Publication of FR2412167B1 publication Critical patent/FR2412167B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/655—Fan-out layouts

Landscapes

  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
FR7834817A 1977-12-13 1978-12-11 Dispositif semi-conducteur, comportant une feuille mince flexible et isolante Granted FR2412167A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7713758A NL7713758A (nl) 1977-12-13 1977-12-13 Halfgeleiderinrichting.

Publications (2)

Publication Number Publication Date
FR2412167A1 true FR2412167A1 (fr) 1979-07-13
FR2412167B1 FR2412167B1 (https=) 1984-10-19

Family

ID=19829740

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7834817A Granted FR2412167A1 (fr) 1977-12-13 1978-12-11 Dispositif semi-conducteur, comportant une feuille mince flexible et isolante

Country Status (7)

Country Link
US (1) US4215359A (https=)
JP (1) JPS5489571A (https=)
BR (1) BR7808124A (https=)
DE (1) DE2853328C2 (https=)
FR (1) FR2412167A1 (https=)
GB (1) GB2010013B (https=)
NL (1) NL7713758A (https=)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3061383D1 (en) * 1979-02-19 1983-01-27 Fujitsu Ltd Semiconductor device and method for manufacturing the same
JPS57173113A (en) * 1981-04-17 1982-10-25 Mitsubishi Heavy Ind Ltd Continuous mixer for powdered body milk of cement, etc.
CA1212484A (en) * 1982-04-19 1986-10-07 Sheldon H. Butt Semiconductor package
US4866571A (en) * 1982-06-21 1989-09-12 Olin Corporation Semiconductor package
US5014159A (en) * 1982-04-19 1991-05-07 Olin Corporation Semiconductor package
US4819041A (en) * 1983-12-30 1989-04-04 Amp Incorporated Surface mounted integrated circuit chip package and method for making same
US4843036A (en) * 1987-06-29 1989-06-27 Eastman Kodak Company Method for encapsulating electronic devices
DE69010546T2 (de) * 1989-04-17 1995-02-09 Matsushita Electric Ind Co Ltd Hochfrequenz-Halbleiteranordnung.
DE3912893A1 (de) * 1989-04-19 1990-10-25 Siemens Ag Als mikropack montierte halbleiteranordnung
US5077598A (en) * 1989-11-08 1991-12-31 Hewlett-Packard Company Strain relief flip-chip integrated circuit assembly with test fixturing
US5047830A (en) * 1990-05-22 1991-09-10 Amp Incorporated Field emitter array integrated circuit chip interconnection
EP0598914B1 (en) * 1992-06-05 2000-10-11 Mitsui Chemicals, Inc. Three-dimensional printed circuit board, electronic circuit package using this board, and method for manufacturing this board
ES2453486T3 (es) * 1999-03-24 2014-04-07 Motorola Solutions, Inc. Conector de chip de circuito y método de conexión de un chip de circuito
US6891110B1 (en) 1999-03-24 2005-05-10 Motorola, Inc. Circuit chip connector and method of connecting a circuit chip
EP1109214A1 (de) * 1999-12-16 2001-06-20 Infineon Technologies AG Anordnung und Verfahren zur Kontaktierung von Schaltkreisen
RU2190768C1 (ru) * 2001-02-07 2002-10-10 Военный автомобильный институт Каталитический нейтрализатор для двс
NL1021245C2 (nl) * 2002-08-09 2004-02-10 Tno Drager voor tenminste een IC en systemen omvattende een dergelijke drager en een IC en/of een dergelijke drager en een verbindingsplaat.
US20050282355A1 (en) * 2004-06-18 2005-12-22 Edwards David N High density bonding of electrical devices
DE102004030383A1 (de) * 2004-06-23 2006-01-12 Infineon Technologies Ag Bondfolie und Halbleiterbauteil mit Bondfolie sowie Verfahren zu deren Herstellung
US8067253B2 (en) * 2005-12-21 2011-11-29 Avery Dennison Corporation Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2205745A1 (https=) * 1972-11-02 1974-05-31 Philips Nv

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2151765C2 (de) * 1970-11-05 1983-06-16 Honeywell Information Systems Italia S.p.A., Caluso, Torino Verfahren zum Kontaktieren von integrierten Schaltungen mit Beam-Lead-Anschlüssen
US3743893A (en) * 1971-05-27 1973-07-03 Mitsubishi Electric Corp Fluid cooled compression bonded semiconductor device structure

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2205745A1 (https=) * 1972-11-02 1974-05-31 Philips Nv

Also Published As

Publication number Publication date
FR2412167B1 (https=) 1984-10-19
DE2853328A1 (de) 1979-06-21
NL7713758A (nl) 1979-06-15
GB2010013B (en) 1982-02-17
JPS5746662B2 (https=) 1982-10-05
GB2010013A (en) 1979-06-20
DE2853328C2 (de) 1985-08-01
JPS5489571A (en) 1979-07-16
US4215359A (en) 1980-07-29
BR7808124A (pt) 1979-07-31

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Legal Events

Date Code Title Description
ST Notification of lapse