FR2407570A1 - Support box for cooled power semiconductor - has cylindrical anode and cathode held together by polygonal plates with three parallel holding bolts - Google Patents
Support box for cooled power semiconductor - has cylindrical anode and cathode held together by polygonal plates with three parallel holding boltsInfo
- Publication number
- FR2407570A1 FR2407570A1 FR7732438A FR7732438A FR2407570A1 FR 2407570 A1 FR2407570 A1 FR 2407570A1 FR 7732438 A FR7732438 A FR 7732438A FR 7732438 A FR7732438 A FR 7732438A FR 2407570 A1 FR2407570 A1 FR 2407570A1
- Authority
- FR
- France
- Prior art keywords
- power semiconductor
- support box
- held together
- plates
- cathode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
The support box is for a power semiconductor chip immersed in a fluorinated compound. Two cylindrical metal blocks (1, 2) of diameter greater than that of the semiconductor form the anode and cathode. Two insulating plates (6, 7) of polygonal shape and with circular holes enclose the anode and cathode blocks respectively. The blocks each have a transverse channel (3) and a circlip inside the plates and in contact with them. The plates are held in place by three rods tangential to the semiconductor chip, and fastenable in three notches situated at 120 deg. from each other on the polygonal shape.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7732438A FR2407570A1 (en) | 1977-10-27 | 1977-10-27 | Support box for cooled power semiconductor - has cylindrical anode and cathode held together by polygonal plates with three parallel holding bolts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7732438A FR2407570A1 (en) | 1977-10-27 | 1977-10-27 | Support box for cooled power semiconductor - has cylindrical anode and cathode held together by polygonal plates with three parallel holding bolts |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2407570A1 true FR2407570A1 (en) | 1979-05-25 |
FR2407570B1 FR2407570B1 (en) | 1980-04-25 |
Family
ID=9197017
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7732438A Granted FR2407570A1 (en) | 1977-10-27 | 1977-10-27 | Support box for cooled power semiconductor - has cylindrical anode and cathode held together by polygonal plates with three parallel holding bolts |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2407570A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2539943A1 (en) * | 1983-01-19 | 1984-07-27 | Westinghouse Electric Corp | SELF-ALIGNMENT AND AUTOCOMPRESSION SUPPORT FOR TIGHTENING A SEMICONDUCTOR DEVICE |
-
1977
- 1977-10-27 FR FR7732438A patent/FR2407570A1/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2539943A1 (en) * | 1983-01-19 | 1984-07-27 | Westinghouse Electric Corp | SELF-ALIGNMENT AND AUTOCOMPRESSION SUPPORT FOR TIGHTENING A SEMICONDUCTOR DEVICE |
Also Published As
Publication number | Publication date |
---|---|
FR2407570B1 (en) | 1980-04-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |