FR2404921A1 - Systeme d'encapsulation de composant electronique a l'etat solide, et oscillateur a tres haute frequence utilisant un tel systeme - Google Patents

Systeme d'encapsulation de composant electronique a l'etat solide, et oscillateur a tres haute frequence utilisant un tel systeme

Info

Publication number
FR2404921A1
FR2404921A1 FR7729463A FR7729463A FR2404921A1 FR 2404921 A1 FR2404921 A1 FR 2404921A1 FR 7729463 A FR7729463 A FR 7729463A FR 7729463 A FR7729463 A FR 7729463A FR 2404921 A1 FR2404921 A1 FR 2404921A1
Authority
FR
France
Prior art keywords
expansion
coefft
electronic component
metal
differences
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7729463A
Other languages
English (en)
Other versions
FR2404921B1 (fr
Inventor
Jacques Simon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR7729463A priority Critical patent/FR2404921A1/fr
Publication of FR2404921A1 publication Critical patent/FR2404921A1/fr
Application granted granted Critical
Publication of FR2404921B1 publication Critical patent/FR2404921B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Microwave Amplifiers (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention porte sur la confection de boîtiers pour composants électroniques à semi-conducteurs capable de délivrer une puissance relativement élevée entraînant inévitablement une forte dissipation thermique. Le système d'encapsulation selon l'invention comporte, outre un dissipateur 1 en cuivre ou en argent, donc à fort coefficient de dilatation thermique, une bague 2 en verre de type << quartz >>, à faible constante diélectrique et à faible coefficient de dilatation, insérée entre un disque 3 et une rondelle 21 à coefficient de dilatation voisin de celui du verre, et une rondelle 22 en métal mou à coefficient de dilatation intermédiaire, capable d'amortir les différences de dilatation jusque vers 300 degrés C. Applications aux sources d'ondes millimétriques.
FR7729463A 1977-09-30 1977-09-30 Systeme d'encapsulation de composant electronique a l'etat solide, et oscillateur a tres haute frequence utilisant un tel systeme Granted FR2404921A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7729463A FR2404921A1 (fr) 1977-09-30 1977-09-30 Systeme d'encapsulation de composant electronique a l'etat solide, et oscillateur a tres haute frequence utilisant un tel systeme

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7729463A FR2404921A1 (fr) 1977-09-30 1977-09-30 Systeme d'encapsulation de composant electronique a l'etat solide, et oscillateur a tres haute frequence utilisant un tel systeme

Publications (2)

Publication Number Publication Date
FR2404921A1 true FR2404921A1 (fr) 1979-04-27
FR2404921B1 FR2404921B1 (fr) 1982-10-22

Family

ID=9195963

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7729463A Granted FR2404921A1 (fr) 1977-09-30 1977-09-30 Systeme d'encapsulation de composant electronique a l'etat solide, et oscillateur a tres haute frequence utilisant un tel systeme

Country Status (1)

Country Link
FR (1) FR2404921A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1179846A3 (fr) * 2000-08-10 2003-09-03 Robert Bosch Gmbh Boítier pour un dispositif électronique

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1179846A3 (fr) * 2000-08-10 2003-09-03 Robert Bosch Gmbh Boítier pour un dispositif électronique

Also Published As

Publication number Publication date
FR2404921B1 (fr) 1982-10-22

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