FR2387294A1 - Composition pour l'etamage non electrique des metaux - Google Patents
Composition pour l'etamage non electrique des metauxInfo
- Publication number
- FR2387294A1 FR2387294A1 FR7810944A FR7810944A FR2387294A1 FR 2387294 A1 FR2387294 A1 FR 2387294A1 FR 7810944 A FR7810944 A FR 7810944A FR 7810944 A FR7810944 A FR 7810944A FR 2387294 A1 FR2387294 A1 FR 2387294A1
- Authority
- FR
- France
- Prior art keywords
- cpd
- plating
- acid
- metals
- deriv
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Abstract
L'invention concerne une composition pour l'étamage non électrique des métaux, et qui contient une source d'ion stanneux, un composant du type thiourée et un acide. Selon l'invention, elle contient au moins un composé organique appartenant au groupe comprenant : les alcools bivalents ayant un nombre d'atomes de carbone non inférieur à 2 non supérieur à 4; les composés pouvant être obtenus à partir de ces alcools bivalents au moyen de déshydratation; les composés pouvant être obtenus à partir de ces alcools bivalents au moyen de sulfuration; des oxyacides organiques n'ayant pas moins de 2 et pas plus de 3 atomes de carbone; des composés pouvant être obtenus à partir de ces oxyacides au moyen d'une estérification et ceux pouvant être obtenus au moyen d'une salification. L'invention s'applique notamment au traitement de métaux tels que le cuivre, des alliages de cuivre avec du laiton, du bronze, des alliages d'étain et de plomb, du plomb, de l'or et autres.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT6783177A IT1082499B (it) | 1977-04-14 | 1977-04-14 | Composizione per la stagnatura anelettrica di metalli |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2387294A1 true FR2387294A1 (fr) | 1978-11-10 |
FR2387294B3 FR2387294B3 (fr) | 1980-12-12 |
Family
ID=11305615
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7810944A Granted FR2387294A1 (fr) | 1977-04-14 | 1978-04-13 | Composition pour l'etamage non electrique des metaux |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE2815175A1 (fr) |
FR (1) | FR2387294A1 (fr) |
IT (1) | IT1082499B (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1106957B (it) * | 1978-01-11 | 1985-11-18 | Alfachimici Spa | Composizione per la stagnatura anelettrica di metallo specialmente con procedimenti a spruzzo |
DE3800918A1 (de) * | 1988-01-14 | 1989-07-27 | Siemens Ag | Bad zur stromlosen zinnabscheidung |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2891871A (en) * | 1956-09-21 | 1959-06-23 | Westinghouse Electric Corp | Tin immersion plating composition and process for using the same |
US3303029A (en) * | 1964-01-23 | 1967-02-07 | Shipley Co | Tin coating of copper surfaces by replacement plating |
-
1977
- 1977-04-14 IT IT6783177A patent/IT1082499B/it active
-
1978
- 1978-04-07 DE DE19782815175 patent/DE2815175A1/de not_active Ceased
- 1978-04-13 FR FR7810944A patent/FR2387294A1/fr active Granted
Also Published As
Publication number | Publication date |
---|---|
DE2815175A1 (de) | 1978-10-26 |
FR2387294B3 (fr) | 1980-12-12 |
IT1082499B (it) | 1985-05-21 |
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