FR2375717B1 - - Google Patents
Info
- Publication number
- FR2375717B1 FR2375717B1 FR7727691A FR7727691A FR2375717B1 FR 2375717 B1 FR2375717 B1 FR 2375717B1 FR 7727691 A FR7727691 A FR 7727691A FR 7727691 A FR7727691 A FR 7727691A FR 2375717 B1 FR2375717 B1 FR 2375717B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
- H10W20/071—Manufacture or treatment of dielectric parts thereof
- H10W20/081—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts
- H10W20/082—Manufacture or treatment of dielectric parts thereof by forming openings in the dielectric parts the openings being tapered via holes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/68—Organic materials, e.g. photoresists
- H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
- H10W20/031—Manufacture or treatment of conductive parts of the interconnections
- H10W20/063—Manufacture or treatment of conductive parts of the interconnections by forming conductive members before forming protective insulating material
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/736,615 US4070501A (en) | 1976-10-28 | 1976-10-28 | Forming self-aligned via holes in thin film interconnection systems |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2375717A1 FR2375717A1 (fr) | 1978-07-21 |
| FR2375717B1 true FR2375717B1 (online.php) | 1979-09-07 |
Family
ID=24960568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7727691A Granted FR2375717A1 (fr) | 1976-10-28 | 1977-09-09 | Procede de formation de trous de connexion auto-alignes dans des systemes d'interconnexion multicouches |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4070501A (online.php) |
| JP (1) | JPS5360191A (online.php) |
| DE (1) | DE2746778A1 (online.php) |
| FR (1) | FR2375717A1 (online.php) |
| GB (1) | GB1532349A (online.php) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4176029A (en) * | 1978-03-02 | 1979-11-27 | Sperry Rand Corporation | Subminiature bore and conductor formation |
| US4263603A (en) * | 1978-03-02 | 1981-04-21 | Sperry Corporation | Subminiature bore and conductor formation |
| US4244799A (en) * | 1978-09-11 | 1981-01-13 | Bell Telephone Laboratories, Incorporated | Fabrication of integrated circuits utilizing thick high-resolution patterns |
| US4222816A (en) * | 1978-12-26 | 1980-09-16 | International Business Machines Corporation | Method for reducing parasitic capacitance in integrated circuit structures |
| JPS5595340A (en) * | 1979-01-10 | 1980-07-19 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Preparation of semiconductor device |
| US4272561A (en) * | 1979-05-29 | 1981-06-09 | International Business Machines Corporation | Hybrid process for SBD metallurgies |
| US4378627A (en) * | 1980-07-08 | 1983-04-05 | International Business Machines Corporation | Self-aligned metal process for field effect transistor integrated circuits using polycrystalline silicon gate electrodes |
| US4367119A (en) * | 1980-08-18 | 1983-01-04 | International Business Machines Corporation | Planar multi-level metal process with built-in etch stop |
| US4423547A (en) * | 1981-06-01 | 1984-01-03 | International Business Machines Corporation | Method for forming dense multilevel interconnection metallurgy for semiconductor devices |
| US4393096A (en) * | 1981-11-16 | 1983-07-12 | International Business Machines Corporation | Aluminum-copper alloy evaporated films with low via resistance |
| CA1169022A (en) * | 1982-04-19 | 1984-06-12 | Kevin Duncan | Integrated circuit planarizing process |
| US4440804A (en) * | 1982-08-02 | 1984-04-03 | Fairchild Camera & Instrument Corporation | Lift-off process for fabricating self-aligned contacts |
| FR2537779B1 (fr) * | 1982-12-10 | 1986-03-14 | Commissariat Energie Atomique | Procede de positionnement d'un trou de contact electrique entre deux lignes d'interconnexion d'un circuit integre |
| GB2137808A (en) * | 1983-04-06 | 1984-10-10 | Plessey Co Plc | Integrated circuit processing method |
| US4508815A (en) * | 1983-11-03 | 1985-04-02 | Mostek Corporation | Recessed metallization |
| US4997521A (en) * | 1987-05-20 | 1991-03-05 | Massachusetts Institute Of Technology | Electrostatic micromotor |
| US4758306A (en) * | 1987-08-17 | 1988-07-19 | International Business Machines Corporation | Stud formation method optimizing insulator gap-fill and metal hole-fill |
| US5231751A (en) * | 1991-10-29 | 1993-08-03 | International Business Machines Corporation | Process for thin film interconnect |
| US5266530A (en) * | 1991-11-08 | 1993-11-30 | Bell Communications Research, Inc. | Self-aligned gated electron field emitter |
| JP2000022337A (ja) | 1998-06-30 | 2000-01-21 | Matsushita Electric Works Ltd | 多層配線板及びその製造方法 |
| DE10215654A1 (de) * | 2002-04-09 | 2003-11-06 | Infineon Technologies Ag | Elektronisches Bauteil mit mindestens einem Halbleiterchip und Flip-Chip-Kontakten sowie Verfahren zu seiner Herstellung |
| US9496217B2 (en) * | 2009-06-04 | 2016-11-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus of forming a via |
| US11652036B2 (en) * | 2018-04-02 | 2023-05-16 | Santa Clara | Via-trace structures |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3976524A (en) * | 1974-06-17 | 1976-08-24 | Ibm Corporation | Planarization of integrated circuit surfaces through selective photoresist masking |
-
1976
- 1976-10-28 US US05/736,615 patent/US4070501A/en not_active Expired - Lifetime
-
1977
- 1977-08-24 GB GB35554/77A patent/GB1532349A/en not_active Expired
- 1977-09-09 FR FR7727691A patent/FR2375717A1/fr active Granted
- 1977-09-27 JP JP11521877A patent/JPS5360191A/ja active Granted
- 1977-10-18 DE DE19772746778 patent/DE2746778A1/de not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5746657B2 (online.php) | 1982-10-05 |
| GB1532349A (en) | 1978-11-15 |
| DE2746778A1 (de) | 1978-05-03 |
| FR2375717A1 (fr) | 1978-07-21 |
| US4070501A (en) | 1978-01-24 |
| JPS5360191A (en) | 1978-05-30 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |