FR2372904B1 - - Google Patents

Info

Publication number
FR2372904B1
FR2372904B1 FR7729874A FR7729874A FR2372904B1 FR 2372904 B1 FR2372904 B1 FR 2372904B1 FR 7729874 A FR7729874 A FR 7729874A FR 7729874 A FR7729874 A FR 7729874A FR 2372904 B1 FR2372904 B1 FR 2372904B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7729874A
Other languages
French (fr)
Other versions
FR2372904A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of FR2372904A1 publication Critical patent/FR2372904A1/fr
Application granted granted Critical
Publication of FR2372904B1 publication Critical patent/FR2372904B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
    • H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
FR7729874A 1976-11-19 1977-09-28 Composition de decapage du silicium polycristallin contenant de l'hydroxyde de tetramethylammonium et procede d'application Granted FR2372904A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US74336276A 1976-11-19 1976-11-19

Publications (2)

Publication Number Publication Date
FR2372904A1 FR2372904A1 (fr) 1978-06-30
FR2372904B1 true FR2372904B1 (de) 1982-07-23

Family

ID=24988491

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7729874A Granted FR2372904A1 (fr) 1976-11-19 1977-09-28 Composition de decapage du silicium polycristallin contenant de l'hydroxyde de tetramethylammonium et procede d'application

Country Status (5)

Country Link
US (1) US4113551A (de)
JP (1) JPS5364637A (de)
DE (1) DE2749636A1 (de)
FR (1) FR2372904A1 (de)
GB (1) GB1589619A (de)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4155866A (en) * 1978-04-24 1979-05-22 International Business Machines Corporation Method of controlling silicon wafer etching rates-utilizing a diazine catalyzed etchant
US4187140A (en) * 1978-10-11 1980-02-05 International Business Machines Corporation Method for etching silicon and a residue and oxidation resistant etchant therefor
DE3148037C2 (de) * 1981-12-04 1983-10-27 Maschinenfabrik Alfred Schmermund Gmbh & Co, 5820 Gevelsberg Vorrichtung zum intermittierenden Auftragen von Klebstoff
GB2193976B (en) * 1986-03-19 1990-05-30 Gen Electric Plc Process for depositing a polysilicon film on a substrate
US4964919A (en) * 1988-12-27 1990-10-23 Nalco Chemical Company Cleaning of silicon wafers with an aqueous solution of KOH and a nitrogen-containing compound
US4996627A (en) * 1989-01-30 1991-02-26 Dresser Industries, Inc. High sensitivity miniature pressure transducer
DE4003472C2 (de) * 1989-09-22 1999-08-12 Bosch Gmbh Robert Verfahren zum anisotropen Ätzen von Siliziumplatten
US5071510A (en) * 1989-09-22 1991-12-10 Robert Bosch Gmbh Process for anisotropic etching of silicon plates
US5312781A (en) * 1991-11-12 1994-05-17 At&T Bell Laboratories Flash EEPROM fabrication process that uses a selective wet chemical etch
US5259888A (en) * 1992-02-03 1993-11-09 Sachem, Inc. Process for cleaning quartz and silicon surfaces
US5431777A (en) * 1992-09-17 1995-07-11 International Business Machines Corporation Methods and compositions for the selective etching of silicon
US5466389A (en) * 1994-04-20 1995-11-14 J. T. Baker Inc. PH adjusted nonionic surfactant-containing alkaline cleaner composition for cleaning microelectronics substrates
US5498293A (en) * 1994-06-23 1996-03-12 Mallinckrodt Baker, Inc. Cleaning wafer substrates of metal contamination while maintaining wafer smoothness
US5928969A (en) * 1996-01-22 1999-07-27 Micron Technology, Inc. Method for controlled selective polysilicon etching
JP3266041B2 (ja) * 1996-05-22 2002-03-18 株式会社島津製作所 部材接合法及びこの方法により製造した光学測定装置
US6755989B2 (en) * 1997-01-09 2004-06-29 Advanced Technology Materials, Inc. Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
US6896826B2 (en) * 1997-01-09 2005-05-24 Advanced Technology Materials, Inc. Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
JP2001508239A (ja) * 1997-01-09 2001-06-19 アドバンスド ケミカル システムズ インターナショナル，インコーポレイテッド 水性フッ化アンモニウムおよびアミンを用いた、半導体ウエハ洗浄組成物および方法
US6551972B1 (en) 1997-07-10 2003-04-22 Merck Patent Gesellschaft Solutions for cleaning silicon semiconductors or silicon oxides
US6114248A (en) * 1998-01-15 2000-09-05 International Business Machines Corporation Process to reduce localized polish stop erosion
US5981401A (en) * 1998-03-13 1999-11-09 Micron Technology, Inc. Method for selective etching of anitreflective coatings
US6221269B1 (en) 1999-01-19 2001-04-24 International Business Machines Corporation Method of etching molybdenum metal from substrates
US6248704B1 (en) 1999-05-03 2001-06-19 Ekc Technology, Inc. Compositions for cleaning organic and plasma etched residues for semiconductors devices
US6372618B2 (en) * 2000-01-06 2002-04-16 Micron Technology, Inc. Methods of forming semiconductor structures
US6703320B1 (en) * 2002-01-04 2004-03-09 Taiwan Semiconductor Manufacturing Company Successful and easy method to remove polysilicon film
EP1520211A2 (de) * 2002-06-07 2005-04-06 Mallinckrodt Baker, Inc. Oxydationsmittel und organische lösungsmittel enthaltende zusammensetzungen zum reinigen von mikroelektronischen substraten
US7354863B2 (en) * 2004-03-19 2008-04-08 Micron Technology, Inc. Methods of selectively removing silicon
EP2897171B1 (de) * 2007-12-20 2019-01-30 Sveuciliste U Zagrebu Fakultet Elektrotehnike I Racunarstva Halbleiterbauelement mit lateralen Bipolartransistor und Verfahren zur Herstellung davon
US8366954B2 (en) 2009-01-13 2013-02-05 Avantor Performance Materials, Bv Solution for increasing wafer sheet resistance and/or photovoltaic cell power density level
KR20110105396A (ko) * 2009-01-14 2011-09-26 아반토르 퍼포먼스 머티리얼스 베.파우. 웨이퍼 표면 저항 및/또는 광전지 전력 밀도 수준을 증가시키기 위한 용액
US7994062B2 (en) * 2009-10-30 2011-08-09 Sachem, Inc. Selective silicon etch process
KR101894603B1 (ko) 2010-06-09 2018-09-03 바스프 에스이 수성 알칼리 에칭 및 세정 조성물 및 실리콘 기판 표면을 처리하는 방법
EP2514799A1 (de) 2011-04-21 2012-10-24 Rohm and Haas Electronic Materials LLC Verbesserte polykristalline Strukturierungszusammensetzung und Verfahren
EP2557147B1 (de) 2011-08-09 2015-04-01 Basf Se Wässrige basische Lösung und Verfahren zur Behandlung der Oberfläche von Siliziumsubstraten
EP2782144B1 (de) * 2013-03-19 2019-05-15 IMEC vzw Verfahren zur Herstellung ineinandergreifender Ruhekontakt-Photovoltaikzellen mit Heteroübergang
CN113292999A (zh) * 2021-04-27 2021-08-24 昆明理工大学 铜催化刻蚀硅片刻蚀液用添加剂、刻蚀体系及刻蚀方法
WO2023099002A1 (de) * 2021-12-02 2023-06-08 Wacker Chemie Ag Verfahren zur herstellung von silicium enthaltenden materialien

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3361589A (en) * 1964-10-05 1968-01-02 Du Pont Process for treating polyimide surface with basic compounds, and polyimide surface having thin layer of polyamide acid
FR2142126A5 (de) * 1971-06-14 1973-01-26 Le Pessot Gabriel
BE789090A (fr) * 1971-09-22 1973-01-15 Western Electric Co Procede et solution d'attaque de semi-conducteurs
US3791848A (en) * 1972-05-19 1974-02-12 Western Electric Co A method of improving the adherence of a metal deposit to a polyimide surface
GB1417170A (en) * 1972-12-22 1975-12-10 Mullard Ltd Methods of manufacturing semiconductor devices
US3909335A (en) * 1974-05-22 1975-09-30 Gen Tire & Rubber Co Pneumatic tire transporter
US3909325A (en) * 1974-06-28 1975-09-30 Motorola Inc Polycrystalline etch
JPS5351970A (en) * 1976-10-21 1978-05-11 Toshiba Corp Manufacture for semiconductor substrate

Also Published As

Publication number Publication date
FR2372904A1 (fr) 1978-06-30
DE2749636A1 (de) 1978-05-24
US4113551A (en) 1978-09-12
GB1589619A (en) 1981-05-13
JPS5364637A (en) 1978-06-09
JPS552474B2 (de) 1980-01-21

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Legal Events

Date Code Title Description
ST Notification of lapse