FR2368205A1 - Electrical component with hermetically sealed synthetic casing - with material for absorbing noxious reagents mixed with synthetic material - Google Patents
Electrical component with hermetically sealed synthetic casing - with material for absorbing noxious reagents mixed with synthetic materialInfo
- Publication number
- FR2368205A1 FR2368205A1 FR7730412A FR7730412A FR2368205A1 FR 2368205 A1 FR2368205 A1 FR 2368205A1 FR 7730412 A FR7730412 A FR 7730412A FR 7730412 A FR7730412 A FR 7730412A FR 2368205 A1 FR2368205 A1 FR 2368205A1
- Authority
- FR
- France
- Prior art keywords
- synthetic
- casing
- electrical component
- synthetic material
- hermetically sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0091—Housing specially adapted for small components
- H05K5/0095—Housing specially adapted for small components hermetically-sealed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Electrical component comprises a casing of synthetic material which encapsulates the component hermetically with respect to the atmos. The synthetic material contains a filler, pref. up to 60% comprising a material which absorbs or adsorbs noxious reagents penetrating within the casing. The casing is pref. surrounded by a sealing agent e.g. epoxy resin. The synthetic material is conventional e.g. thermoplastic or thermosetting plastic material, to which the absorbent material e.g. active C or a molecular sieve (zeolite) is added in powdered or granulated form, by a conventional method. After shaping by injection or pressing, the synthetic material is heated to degasify the synthetic fraction of the moulded article and activate the absorbent material embedded in it.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2646680A DE2646680B1 (en) | 1976-10-15 | 1976-10-15 | Electrical component with plastic housing |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2368205A1 true FR2368205A1 (en) | 1978-05-12 |
Family
ID=5990577
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7730412A Withdrawn FR2368205A1 (en) | 1976-10-15 | 1977-10-10 | Electrical component with hermetically sealed synthetic casing - with material for absorbing noxious reagents mixed with synthetic material |
Country Status (8)
Country | Link |
---|---|
JP (1) | JPS5349951A (en) |
BE (1) | BE859754A (en) |
DE (1) | DE2646680B1 (en) |
ES (1) | ES462698A1 (en) |
FR (1) | FR2368205A1 (en) |
IT (1) | IT1087065B (en) |
NL (1) | NL7711321A (en) |
SE (1) | SE7711601L (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2462841A1 (en) * | 1979-08-03 | 1981-02-13 | Siemens Ag | METHOD FOR INCORPORATING A DEGASER IN THE HOUSING OF AN ELECTRICAL COMPONENT |
EP0035256B1 (en) * | 1980-03-04 | 1983-07-13 | Siemens Aktiengesellschaft | Getter body and process for its manufacture |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57162644A (en) * | 1981-03-31 | 1982-10-06 | Matsushita Electric Works Ltd | Gas adsorbent |
DE4215058C1 (en) * | 1992-05-07 | 1993-11-11 | Audi Ag | Electric switch operated by flexible membrane for vehicle technology - has coating made on inside face with binder material for contact-damaging material within switch space |
-
1976
- 1976-10-15 DE DE2646680A patent/DE2646680B1/en not_active Withdrawn
-
1977
- 1977-09-28 ES ES462698A patent/ES462698A1/en not_active Expired
- 1977-10-10 FR FR7730412A patent/FR2368205A1/en not_active Withdrawn
- 1977-10-13 IT IT28550/77A patent/IT1087065B/en active
- 1977-10-14 BE BE181767A patent/BE859754A/en unknown
- 1977-10-14 NL NL7711321A patent/NL7711321A/en not_active Application Discontinuation
- 1977-10-14 JP JP12339077A patent/JPS5349951A/en active Pending
- 1977-10-14 SE SE7711601A patent/SE7711601L/en unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2462841A1 (en) * | 1979-08-03 | 1981-02-13 | Siemens Ag | METHOD FOR INCORPORATING A DEGASER IN THE HOUSING OF AN ELECTRICAL COMPONENT |
EP0035256B1 (en) * | 1980-03-04 | 1983-07-13 | Siemens Aktiengesellschaft | Getter body and process for its manufacture |
Also Published As
Publication number | Publication date |
---|---|
BE859754A (en) | 1978-04-14 |
ES462698A1 (en) | 1978-07-01 |
DE2646680B1 (en) | 1978-04-20 |
JPS5349951A (en) | 1978-05-06 |
NL7711321A (en) | 1978-04-18 |
SE7711601L (en) | 1978-04-16 |
IT1087065B (en) | 1985-05-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
HK71096A (en) | Method for packing a measured quantity of thermosetting resin intended for encapsulating a componentpacking obtained using this method method for operating a mould and mould for carrying out this method | |
GB2089126B (en) | Semiconductor device and process for producing the same | |
ATE163948T1 (en) | HEAT CURED REACTION RESIN MIXTURES | |
IT1012565B (en) | METHOD FOR THE PRODUCTION OF RUBBER AND PLASTIC COMPOUNDS | |
JPS5548241A (en) | Thermoplastic resin for bonding | |
KR860002139A (en) | Epoxy resin composition for semiconductor sealing and resin-sealed semiconductor device using the same | |
DE3485445D1 (en) | THERMOPLASTIC RESIN MATERIAL FOR MOLDING PROCESSES. | |
GB2025424B (en) | Epoxa resin composition and method for curing the epoxy resin composition | |
EP0274744A3 (en) | Epoxy containing impact modifiers for thermoplastic resins | |
FR2368205A1 (en) | Electrical component with hermetically sealed synthetic casing - with material for absorbing noxious reagents mixed with synthetic material | |
DE3171177D1 (en) | Thermosetting resin composition, process for preparation thereof and cured product thereof | |
HK10379A (en) | Thermoplastic polyoxymethylene molding resins | |
EP0103804A3 (en) | Epoxy resin composition and molded articles obtained therefrom | |
JPS5756218A (en) | Manufacture of polyurethane resin molding | |
JPS56135584A (en) | Molded sealing material | |
JPS5381076A (en) | Lroduction of resin seal semiconductor device | |
GB8920312D0 (en) | Phenol resin molding composition,process for producing the same,and semiconductor device sealed with said composition | |
JPS51130447A (en) | Thermoplastic resin compositions | |
JPS5391990A (en) | Adhesion between rubber and reinforcing material during vulcanization | |
GB1505403A (en) | Thermoplastic resin composition | |
JPS5280780A (en) | Semiconductor device | |
JPS52156561A (en) | Resin molded semiconductor device and its production | |
JPS5346349A (en) | Silicone resin composition | |
JPS5392857A (en) | Silane-corsslinkable polyolefin molding resin composition | |
IT1213250B (en) | EPOXY AND THEIR USE FOR EPOXY PLASTIC MATERIAL ELECTRICAL PURPOSES. SELF-EXTINGUISHING, COMPOUND IN RESIN |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |