FR2363194B1 - - Google Patents

Info

Publication number
FR2363194B1
FR2363194B1 FR7724855A FR7724855A FR2363194B1 FR 2363194 B1 FR2363194 B1 FR 2363194B1 FR 7724855 A FR7724855 A FR 7724855A FR 7724855 A FR7724855 A FR 7724855A FR 2363194 B1 FR2363194 B1 FR 2363194B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7724855A
Other languages
French (fr)
Other versions
FR2363194A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semikron GmbH and Co KG
Original Assignee
Semikron GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron GmbH and Co KG filed Critical Semikron GmbH and Co KG
Publication of FR2363194A1 publication Critical patent/FR2363194A1/fr
Application granted granted Critical
Publication of FR2363194B1 publication Critical patent/FR2363194B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/235—Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts
FR7724855A 1976-08-28 1977-08-12 Dispositif semi-conducteur a evacuation bilaterale de chaleur Granted FR2363194A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762638909 DE2638909A1 (de) 1976-08-28 1976-08-28 Halbleiteranordnung

Publications (2)

Publication Number Publication Date
FR2363194A1 FR2363194A1 (fr) 1978-03-24
FR2363194B1 true FR2363194B1 (https=) 1985-02-22

Family

ID=5986646

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7724855A Granted FR2363194A1 (fr) 1976-08-28 1977-08-12 Dispositif semi-conducteur a evacuation bilaterale de chaleur

Country Status (9)

Country Link
US (1) US4209799A (https=)
JP (1) JPS5329078A (https=)
BR (1) BR7704944A (https=)
CH (1) CH617535A5 (https=)
DE (1) DE2638909A1 (https=)
FR (1) FR2363194A1 (https=)
GB (1) GB1594141A (https=)
IT (1) IT1081539B (https=)
SE (1) SE437444B (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4404739A (en) * 1980-04-21 1983-09-20 Thermal Associates, Inc. Method for mounting, electrically isolating and maintaining constant pressure on a semiconductor element
FR2495838A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Dispositif de refroidissement amovible pour supports de circuits integres
FR2495846A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Dispositif de connexion electrique a haute densite de contacts
JP2569003B2 (ja) * 1986-03-20 1997-01-08 株式会社日立製作所 熱伝導装置
FR2614469B1 (fr) * 1987-04-24 1989-07-21 Inrets Dispositif de refroidissement, en particulier pour semi-conducteur de puissance
US4783428A (en) * 1987-11-23 1988-11-08 Motorola Inc. Method of producing a thermogenetic semiconductor device
US4987953A (en) * 1990-03-09 1991-01-29 Kohler Company Shared coolant system for marine generator
US5058660A (en) * 1990-03-09 1991-10-22 Kohler Co. Shared coolant system for marine generator
JPH06325708A (ja) * 1993-05-18 1994-11-25 Hamamatsu Photonics Kk Ｘ線発生装置
US5594355A (en) * 1994-07-19 1997-01-14 Delta Design, Inc. Electrical contactor apparatus for testing integrated circuit devices
US5792677A (en) * 1997-01-16 1998-08-11 Ford Motor Company Embedded metal planes for thermal management

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE527420A (https=) * 1953-03-20
BE534817A (https=) * 1954-01-14 1900-01-01
US2862159A (en) * 1954-10-29 1958-11-25 Raytheon Mfg Co Conduction cooled rectifiers
DE1042762B (de) * 1955-02-26 1958-11-06 Siemens Ag Flaechengleichrichter bzw. -transistor, welcher mit mindestens einer seiner Elektroden flaechenhaft mit einem die Verlustwaerme abfuehrenden Koerper in Kontakt steht
JPS4213216Y1 (https=) * 1966-04-18 1967-07-27
US3396361A (en) * 1966-12-05 1968-08-06 Solitron Devices Combined mounting support, heat sink, and electrical terminal connection assembly
DE1614012A1 (de) * 1967-06-16 1970-03-26 Theodor Kiepe Elektrotechn Fab Anordnung zur Abfuehrung der in Halbleiterelementen,wie Dioden,Thyristoren u.dgl.erzeugten Waerme
US3483444A (en) * 1967-12-06 1969-12-09 Int Rectifier Corp Common housing for independent semiconductor devices
SE354943B (https=) * 1970-02-24 1973-03-26 Asea Ab
FR2125380B1 (https=) * 1971-02-13 1977-09-02 Bbc Brown Boveri & Cie
BE791418A (https=) * 1971-11-16 1973-05-16 Int Standard Electric Corp
US3768548A (en) * 1972-03-02 1973-10-30 Motor Co Cooling apparatus for semiconductor devices
DE2337694C2 (de) * 1973-07-25 1984-10-25 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitergleichrichteranordnung hoher Strombelastbarkeit
JPS5512740B2 (https=) * 1974-03-15 1980-04-03
JPS5241149B2 (https=) * 1974-03-16 1977-10-17
DE7512573U (de) * 1975-04-19 1975-09-04 Semikron Gesellschaft Fuer Gleichri Halbleitergleichrichteranordnung

Also Published As

Publication number Publication date
CH617535A5 (https=) 1980-05-30
GB1594141A (en) 1981-07-30
US4209799A (en) 1980-06-24
SE7709019L (sv) 1978-03-01
SE437444B (sv) 1985-02-25
BR7704944A (pt) 1978-04-25
DE2638909A1 (de) 1978-03-02
JPS5329078A (en) 1978-03-17
FR2363194A1 (fr) 1978-03-24
IT1081539B (it) 1985-05-21

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Legal Events

Date Code Title Description
ST Notification of lapse