FR2352079A1 - Jig for selectively plating with noble metal partic. gold - partic. for plating can bases and connector pins for holding semiconductor chips - Google Patents

Jig for selectively plating with noble metal partic. gold - partic. for plating can bases and connector pins for holding semiconductor chips

Info

Publication number
FR2352079A1
FR2352079A1 FR7615222A FR7615222A FR2352079A1 FR 2352079 A1 FR2352079 A1 FR 2352079A1 FR 7615222 A FR7615222 A FR 7615222A FR 7615222 A FR7615222 A FR 7615222A FR 2352079 A1 FR2352079 A1 FR 2352079A1
Authority
FR
France
Prior art keywords
bases
jig
partic
pins
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7615222A
Other languages
French (fr)
Other versions
FR2352079B1 (en
Inventor
Daniel Candellier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Radiotechnique Compelec RTC SA
Original Assignee
Radiotechnique Compelec RTC SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Radiotechnique Compelec RTC SA filed Critical Radiotechnique Compelec RTC SA
Priority to FR7615222A priority Critical patent/FR2352079A1/en
Publication of FR2352079A1 publication Critical patent/FR2352079A1/en
Application granted granted Critical
Publication of FR2352079B1 publication Critical patent/FR2352079B1/fr
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

An electroplated deposit of noble metal, esp. gold, is achieved simultaneously on numerous metal bases and their connector pins. Before the partial immersion of the bases in the electrolyte, their pins are inserted in a jig connected to the negative pole of an electric current supply. The jig consists of a metal profile with a trapezoidal cross-section; the two sides of the profile contain holes with adjacent slots, forming spring tongues for holding the pins so the flat part of the profile faces the underside of the base to which the pins are attached. The jig is pref. made of bent stainless steel- or beryllium copper- strip, where the sides form an angle of min. 15 degrees, and pref. 20 degrees with the flat part of the strip, which may contain holes opposite the bases. Used for the selective electroplating of can bases employed for holding semiconductor chips, e.g. a TO-5 or other can base. Rapid loading and unloading of the bases in the jig, and good electrical contact, are achieved.
FR7615222A 1976-05-20 1976-05-20 Jig for selectively plating with noble metal partic. gold - partic. for plating can bases and connector pins for holding semiconductor chips Granted FR2352079A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7615222A FR2352079A1 (en) 1976-05-20 1976-05-20 Jig for selectively plating with noble metal partic. gold - partic. for plating can bases and connector pins for holding semiconductor chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7615222A FR2352079A1 (en) 1976-05-20 1976-05-20 Jig for selectively plating with noble metal partic. gold - partic. for plating can bases and connector pins for holding semiconductor chips

Publications (2)

Publication Number Publication Date
FR2352079A1 true FR2352079A1 (en) 1977-12-16
FR2352079B1 FR2352079B1 (en) 1978-10-13

Family

ID=9173411

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7615222A Granted FR2352079A1 (en) 1976-05-20 1976-05-20 Jig for selectively plating with noble metal partic. gold - partic. for plating can bases and connector pins for holding semiconductor chips

Country Status (1)

Country Link
FR (1) FR2352079A1 (en)

Also Published As

Publication number Publication date
FR2352079B1 (en) 1978-10-13

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Legal Events

Date Code Title Description
ST Notification of lapse