FR2352077A1 - High speed plating of metal with nickel layer - using insoluble anode and controlling nickel ion concn in bath - Google Patents
High speed plating of metal with nickel layer - using insoluble anode and controlling nickel ion concn in bathInfo
- Publication number
- FR2352077A1 FR2352077A1 FR7614810A FR7614810A FR2352077A1 FR 2352077 A1 FR2352077 A1 FR 2352077A1 FR 7614810 A FR7614810 A FR 7614810A FR 7614810 A FR7614810 A FR 7614810A FR 2352077 A1 FR2352077 A1 FR 2352077A1
- Authority
- FR
- France
- Prior art keywords
- bath
- plating
- layer
- high speed
- nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title abstract 14
- 238000007747 plating Methods 0.000 title abstract 5
- 229910001453 nickel ion Inorganic materials 0.000 title abstract 3
- 239000002184 metal Substances 0.000 title 1
- 229910052751 metal Inorganic materials 0.000 title 1
- 229910052759 nickel Inorganic materials 0.000 title 1
- 229910000679 solder Inorganic materials 0.000 abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 238000004090 dissolution Methods 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
Abstract
A high speed Ni plating process uses an insoluble anode made of e.g. Ni which does not cause a passive state, and the supply of nickel ions into the bath is controlled by the detected pH value of the bath not by the amt. of dissolution of the anode, so as to adjust the pH and Ni ion density in the bath. The supplying Ni ion-contg. contg. soln. is prepared by reacting Ni flakes with a bath in a nickel ion supplying apparatus according to the detected pH value. Plating can be carried out with a high current density of 70 A/dm2 max. without losing the properties of the deposited Ni layer. It is possible to continuously seed the stable Ni plating bath soln. into a bath. When plating Ni on a solder layer, good adhesion can be obtd. between a solder and Ni plated layer without forming a copper strike between the solder layer and Ni plated layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7614810A FR2352077A1 (en) | 1976-05-17 | 1976-05-17 | High speed plating of metal with nickel layer - using insoluble anode and controlling nickel ion concn in bath |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7614810A FR2352077A1 (en) | 1976-05-17 | 1976-05-17 | High speed plating of metal with nickel layer - using insoluble anode and controlling nickel ion concn in bath |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2352077A1 true FR2352077A1 (en) | 1977-12-16 |
FR2352077B1 FR2352077B1 (en) | 1980-08-29 |
Family
ID=9173218
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7614810A Granted FR2352077A1 (en) | 1976-05-17 | 1976-05-17 | High speed plating of metal with nickel layer - using insoluble anode and controlling nickel ion concn in bath |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2352077A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2473560A1 (en) * | 1980-01-12 | 1981-07-17 | Koito Mfg Co Ltd | METHOD AND APPARATUS FOR RECHARGING METAL TO REMOVE AN ELECTROLYTIC VENEER BATH |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2449422A (en) * | 1944-04-15 | 1948-09-14 | Harshaw Chem Corp | Electrodeposition of nickel |
FR1398658A (en) * | 1963-07-01 | 1965-05-07 | M & T Chemicals Inc | Bright nickel electroplating process |
FR1582093A (en) * | 1968-05-31 | 1969-09-26 |
-
1976
- 1976-05-17 FR FR7614810A patent/FR2352077A1/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2449422A (en) * | 1944-04-15 | 1948-09-14 | Harshaw Chem Corp | Electrodeposition of nickel |
FR1398658A (en) * | 1963-07-01 | 1965-05-07 | M & T Chemicals Inc | Bright nickel electroplating process |
FR1582093A (en) * | 1968-05-31 | 1969-09-26 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2473560A1 (en) * | 1980-01-12 | 1981-07-17 | Koito Mfg Co Ltd | METHOD AND APPARATUS FOR RECHARGING METAL TO REMOVE AN ELECTROLYTIC VENEER BATH |
Also Published As
Publication number | Publication date |
---|---|
FR2352077B1 (en) | 1980-08-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |