FR2348573B1 - - Google Patents
Info
- Publication number
- FR2348573B1 FR2348573B1 FR7711238A FR7711238A FR2348573B1 FR 2348573 B1 FR2348573 B1 FR 2348573B1 FR 7711238 A FR7711238 A FR 7711238A FR 7711238 A FR7711238 A FR 7711238A FR 2348573 B1 FR2348573 B1 FR 2348573B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
- H10W74/134—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being in grooves in the semiconductor body
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT22280/76A IT1059086B (it) | 1976-04-14 | 1976-04-14 | Procedimento per la passivazione di dispositivi a semiconduttore di potenza ad alta tensione inversa |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2348573A1 FR2348573A1 (fr) | 1977-11-10 |
| FR2348573B1 true FR2348573B1 (ref) | 1982-08-13 |
Family
ID=11194095
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7711238A Granted FR2348573A1 (fr) | 1976-04-14 | 1977-04-14 | Procede de passivation d'elements semi-conducteurs a jonction |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4126931A (ref) |
| JP (1) | JPS6026296B2 (ref) |
| BR (1) | BR7702277A (ref) |
| DE (1) | DE2716419A1 (ref) |
| FR (1) | FR2348573A1 (ref) |
| GB (1) | GB1569931A (ref) |
| IT (1) | IT1059086B (ref) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54106599A (en) * | 1978-02-09 | 1979-08-21 | Hitachi Chem Co Ltd | Preparation of polyamide intermediate for semiconductor processing |
| SE8306663L (sv) * | 1982-12-08 | 1984-06-09 | Int Rectifier Corp | Forfarande for framstellning av halvledaranordning |
| JPH0716077B2 (ja) * | 1985-10-11 | 1995-02-22 | 三菱電機株式会社 | 半導体レーザ装置の製造方法 |
| US6025268A (en) * | 1996-06-26 | 2000-02-15 | Advanced Micro Devices, Inc. | Method of etching conductive lines through an etch resistant photoresist mask |
| TW554639B (en) * | 2002-10-04 | 2003-09-21 | Au Optronics Corp | Method for fabricating an OLED device and the solid passivation |
| EP2683633A4 (en) * | 2011-03-08 | 2015-06-17 | Lorillard Tobacco Co | PHASE TRANSFER COMPOSITIONS FOR REDUCED INFLAMMATORY INFLUENCE OF SMOKING ITEMS |
| JP6833864B2 (ja) | 2015-11-05 | 2021-02-24 | アーベーベー・シュバイツ・アーゲーＡＢＢ Ｓｃｈｗｅｉｚ ＡＧ | パワー半導体装置およびパワー半導体装置を作製するための方法 |
| JP6903375B2 (ja) * | 2017-04-19 | 2021-07-14 | 株式会社ディスコ | デバイスチップの製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3375419A (en) * | 1965-02-25 | 1968-03-26 | Union Carbide Corp | Field effect transistor with poly-p-xylylene insulated gate structure and method |
| US3432919A (en) * | 1966-10-31 | 1969-03-18 | Raytheon Co | Method of making semiconductor diodes |
| GB1261378A (en) * | 1968-07-08 | 1972-01-26 | Internat Rectifier Company Gre | Improvements relating to the encapsulation of semiconductor devices and other electrical components |
| GB1285708A (en) * | 1968-10-28 | 1972-08-16 | Lucas Industries Ltd | Semi-conductor devices |
| US3895429A (en) * | 1974-05-09 | 1975-07-22 | Rca Corp | Method of making a semiconductor device |
| US4037306A (en) * | 1975-10-02 | 1977-07-26 | Motorola, Inc. | Integrated circuit and method |
-
1976
- 1976-04-14 IT IT22280/76A patent/IT1059086B/it active
-
1977
- 1977-04-11 US US05/786,385 patent/US4126931A/en not_active Expired - Lifetime
- 1977-04-12 BR BR7702277A patent/BR7702277A/pt unknown
- 1977-04-14 FR FR7711238A patent/FR2348573A1/fr active Granted
- 1977-04-14 GB GB15573/77A patent/GB1569931A/en not_active Expired
- 1977-04-14 DE DE19772716419 patent/DE2716419A1/de not_active Ceased
- 1977-04-14 JP JP52042094A patent/JPS6026296B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| US4126931A (en) | 1978-11-28 |
| JPS6026296B2 (ja) | 1985-06-22 |
| IT1059086B (it) | 1982-05-31 |
| BR7702277A (pt) | 1977-12-20 |
| JPS52144968A (en) | 1977-12-02 |
| FR2348573A1 (fr) | 1977-11-10 |
| DE2716419A1 (de) | 1977-11-03 |
| GB1569931A (en) | 1980-06-25 |