FR2345888A1 - Procede et dispositif pour la fabrication de circuits imprimes - Google Patents
Procede et dispositif pour la fabrication de circuits imprimesInfo
- Publication number
- FR2345888A1 FR2345888A1 FR7708699A FR7708699A FR2345888A1 FR 2345888 A1 FR2345888 A1 FR 2345888A1 FR 7708699 A FR7708699 A FR 7708699A FR 7708699 A FR7708699 A FR 7708699A FR 2345888 A1 FR2345888 A1 FR 2345888A1
- Authority
- FR
- France
- Prior art keywords
- circuit board
- grooves
- pressed
- separation lines
- metal foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09045—Locally raised area or protrusion of insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/091—Locally and permanently deformed areas including dielectric material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19762612257 DE2612257C3 (de) | 1976-03-23 | 1976-03-23 | Verfahren und Vorrichtung zur Herstellung von Leiterplatten |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2345888A1 true FR2345888A1 (fr) | 1977-10-21 |
FR2345888B3 FR2345888B3 (fr) | 1980-02-29 |
Family
ID=5973201
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7708699A Granted FR2345888A1 (fr) | 1976-03-23 | 1977-03-23 | Procede et dispositif pour la fabrication de circuits imprimes |
Country Status (6)
Country | Link |
---|---|
AT (1) | AT362009B (fr) |
BR (1) | BR7701750A (fr) |
DE (1) | DE2612257C3 (fr) |
ES (1) | ES456268A1 (fr) |
FR (1) | FR2345888A1 (fr) |
SE (1) | SE7702753L (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2621774A1 (fr) * | 1987-10-12 | 1989-04-14 | Dav | Plaque circuit pour courants eleves et procede de preparation |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3642039A1 (de) * | 1986-12-09 | 1988-06-23 | Philips Patentverwaltung | Werkzeug zum herstellen eines schaltungsmusters einer elektrischen schaltungsplatte durch schneiden einer kupferplatte und schaltungsmuster einer elektrischen schaltungsplatte, das zur bearbeitung mit dem werkzeug geeignet ist |
US4811504A (en) * | 1988-01-28 | 1989-03-14 | Bunke Clinton R | Walk ease ski boot soles |
-
1976
- 1976-03-23 DE DE19762612257 patent/DE2612257C3/de not_active Expired
-
1977
- 1977-02-24 ES ES456268A patent/ES456268A1/es not_active Expired
- 1977-03-11 SE SE7702753A patent/SE7702753L/xx not_active Application Discontinuation
- 1977-03-22 BR BR7701750A patent/BR7701750A/pt unknown
- 1977-03-22 AT AT198577A patent/AT362009B/de not_active IP Right Cessation
- 1977-03-23 FR FR7708699A patent/FR2345888A1/fr active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2621774A1 (fr) * | 1987-10-12 | 1989-04-14 | Dav | Plaque circuit pour courants eleves et procede de preparation |
EP0312415A1 (fr) * | 1987-10-12 | 1989-04-19 | DAV, Société dite | Plaque circuit pour courants élevés et procédé de préparation |
Also Published As
Publication number | Publication date |
---|---|
ES456268A1 (es) | 1978-05-01 |
ATA198577A (de) | 1980-09-15 |
DE2612257C3 (de) | 1979-06-07 |
DE2612257A1 (de) | 1977-09-29 |
SE7702753L (sv) | 1977-09-24 |
AT362009B (de) | 1981-04-27 |
FR2345888B3 (fr) | 1980-02-29 |
BR7701750A (pt) | 1978-01-17 |
DE2612257B2 (de) | 1978-10-05 |
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