FR2335045A1 - Procede de commande de la duree de vie des porteurs dans les dispositifs semi-conducteurs et dispositifs en resultant - Google Patents
Procede de commande de la duree de vie des porteurs dans les dispositifs semi-conducteurs et dispositifs en resultantInfo
- Publication number
- FR2335045A1 FR2335045A1 FR7632456A FR7632456A FR2335045A1 FR 2335045 A1 FR2335045 A1 FR 2335045A1 FR 7632456 A FR7632456 A FR 7632456A FR 7632456 A FR7632456 A FR 7632456A FR 2335045 A1 FR2335045 A1 FR 2335045A1
- Authority
- FR
- France
- Prior art keywords
- devices
- lifetime
- carriers
- procedure
- controlling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000969 carrier Substances 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
- H01L21/3221—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/30—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by physical imperfections; having polished or roughened surface
- H01L29/32—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by physical imperfections; having polished or roughened surface the imperfections being within the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- High Energy & Nuclear Physics (AREA)
- Ceramic Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US64013775A | 1975-12-12 | 1975-12-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2335045A1 true FR2335045A1 (fr) | 1977-07-08 |
FR2335045B1 FR2335045B1 (fr) | 1979-09-21 |
Family
ID=24566992
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7632456A Granted FR2335045A1 (fr) | 1975-12-12 | 1976-10-18 | Procede de commande de la duree de vie des porteurs dans les dispositifs semi-conducteurs et dispositifs en resultant |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS5272583A (fr) |
DE (1) | DE2642206A1 (fr) |
FR (1) | FR2335045A1 (fr) |
GB (1) | GB1503249A (fr) |
IT (1) | IT1123671B (fr) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0030856B1 (fr) * | 1979-12-13 | 1984-03-21 | Fujitsu Limited | Cellule à mémoire semiconductrice à pompage de charges comprenant une région de stockage de charge et dispositif à mémoire utilisant ces cellules |
EP0253059A2 (fr) * | 1986-03-20 | 1988-01-20 | Hitachi, Ltd. | Procédé pour supprimer la montée de la couche enterrée d'un dispositif semi-conducteur |
WO1995006956A1 (fr) * | 1993-09-03 | 1995-03-09 | National Semiconductor Corporation | Procede d'isolement planar apte a etre utilise dans l'industrie de la microelectronique |
WO1996026536A1 (fr) * | 1995-02-20 | 1996-08-29 | Rohm Co., Ltd. | Dispositif a semiconducteur dote d'un cristal a defauts, et son procede de fabrication |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58143563A (ja) * | 1982-02-22 | 1983-08-26 | Hitachi Ltd | 半導体装置の製造方法 |
NL8301554A (nl) * | 1982-05-06 | 1983-12-01 | Mitsubishi Electric Corp | Geintegreerde schakeling-inrichting van het cmos-type. |
-
1976
- 1976-09-20 DE DE19762642206 patent/DE2642206A1/de active Pending
- 1976-10-18 FR FR7632456A patent/FR2335045A1/fr active Granted
- 1976-11-09 IT IT29128/76A patent/IT1123671B/it active
- 1976-11-11 JP JP51134744A patent/JPS5272583A/ja active Pending
- 1976-12-06 GB GB50821/76A patent/GB1503249A/en not_active Expired
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0030856B1 (fr) * | 1979-12-13 | 1984-03-21 | Fujitsu Limited | Cellule à mémoire semiconductrice à pompage de charges comprenant une région de stockage de charge et dispositif à mémoire utilisant ces cellules |
EP0253059A2 (fr) * | 1986-03-20 | 1988-01-20 | Hitachi, Ltd. | Procédé pour supprimer la montée de la couche enterrée d'un dispositif semi-conducteur |
EP0253059A3 (fr) * | 1986-03-20 | 1989-09-13 | Hitachi, Ltd. | Procédé pour supprimer la montée de la couche enterrée d'un dispositif semi-conducteur |
WO1995006956A1 (fr) * | 1993-09-03 | 1995-03-09 | National Semiconductor Corporation | Procede d'isolement planar apte a etre utilise dans l'industrie de la microelectronique |
WO1996026536A1 (fr) * | 1995-02-20 | 1996-08-29 | Rohm Co., Ltd. | Dispositif a semiconducteur dote d'un cristal a defauts, et son procede de fabrication |
Also Published As
Publication number | Publication date |
---|---|
DE2642206A1 (de) | 1977-06-23 |
GB1503249A (en) | 1978-03-08 |
IT1123671B (it) | 1986-04-30 |
JPS5272583A (en) | 1977-06-17 |
FR2335045B1 (fr) | 1979-09-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |