FR2333831A1 - Compositions de resines epoxy pour encapsuler des dispositifs semi-conducteurs - Google Patents

Compositions de resines epoxy pour encapsuler des dispositifs semi-conducteurs

Info

Publication number
FR2333831A1
FR2333831A1 FR7531584A FR7531584A FR2333831A1 FR 2333831 A1 FR2333831 A1 FR 2333831A1 FR 7531584 A FR7531584 A FR 7531584A FR 7531584 A FR7531584 A FR 7531584A FR 2333831 A1 FR2333831 A1 FR 2333831A1
Authority
FR
France
Prior art keywords
compositions
semiconductor devices
epoxy resins
encapsulating semiconductor
encapsulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7531584A
Other languages
English (en)
French (fr)
Other versions
FR2333831B1 (esLanguage
Inventor
Tooru Tamura
Nobuyuki Ojima
Sigeru Kondo
Yozo Jizodo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP49120838A external-priority patent/JPS5146877A/ja
Priority claimed from JP49120829A external-priority patent/JPS5146878A/ja
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of FR2333831A1 publication Critical patent/FR2333831A1/fr
Application granted granted Critical
Publication of FR2333831B1 publication Critical patent/FR2333831B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H10W74/47—
FR7531584A 1974-10-18 1975-10-15 Compositions de resines epoxy pour encapsuler des dispositifs semi-conducteurs Granted FR2333831A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP49120838A JPS5146877A (en) 1974-10-18 1974-10-18 Toranjisutafushojushisoseibutsu
JP49120829A JPS5146878A (en) 1974-10-18 1974-10-18 Toranjisutafushojushisoseibutsu

Publications (2)

Publication Number Publication Date
FR2333831A1 true FR2333831A1 (fr) 1977-07-01
FR2333831B1 FR2333831B1 (esLanguage) 1978-04-14

Family

ID=26458340

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7531584A Granted FR2333831A1 (fr) 1974-10-18 1975-10-15 Compositions de resines epoxy pour encapsuler des dispositifs semi-conducteurs

Country Status (4)

Country Link
US (1) US4013612A (esLanguage)
DE (1) DE2545471C3 (esLanguage)
FR (1) FR2333831A1 (esLanguage)
GB (1) GB1528203A (esLanguage)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4248920A (en) * 1978-04-26 1981-02-03 Tokyo Shibaura Denki Kabushiki Kaisha Resin-sealed semiconductor device
US4176142A (en) * 1978-05-22 1979-11-27 Western Electric Company, Inc. Powder coating composition
US4282136A (en) * 1979-04-09 1981-08-04 Hunt Earl R Flame retardant epoxy molding compound method and encapsulated device
DE3442131A1 (de) * 1984-11-17 1986-05-22 Messerschmitt-Bölkow-Blohm GmbH, 8012 Ottobrunn Verfahren zum einkapseln von mikroelektronischen halbleiter- und schichtschaltungen
JPH01141908A (ja) * 1987-11-30 1989-06-02 Dainippon Ink & Chem Inc 活性エネルギー線硬化性樹脂組成物
KR910008560B1 (ko) * 1988-02-15 1991-10-19 주식회사 럭키 반도체 봉지용 에폭시 수지 조성물

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1903098A1 (de) * 1968-01-26 1970-06-11 Dexter Corp Einkapselungsmassen fuer Halbleiter

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3394105A (en) * 1963-05-02 1968-07-23 Shell Oil Co Process for curing polyepoxides and resulting products
NL6504681A (esLanguage) * 1965-04-13 1965-06-25
US3838094A (en) * 1973-04-23 1974-09-24 Nat Semiconductor Corp Molding composition and molded product

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1903098A1 (de) * 1968-01-26 1970-06-11 Dexter Corp Einkapselungsmassen fuer Halbleiter

Also Published As

Publication number Publication date
GB1528203A (en) 1978-10-11
DE2545471B2 (de) 1981-04-16
DE2545471C3 (de) 1982-01-21
DE2545471A1 (de) 1976-04-22
US4013612A (en) 1977-03-22
FR2333831B1 (esLanguage) 1978-04-14

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