|
US4436978A
(en)
|
1977-08-18 |
1984-03-13 |
Lemelson Jerome H |
Sampling device
|
|
US4162390A
(en)
*
|
1977-10-03 |
1979-07-24 |
The International Nickel Company, Inc. |
Laser welding chamber
|
|
US4207874A
(en)
*
|
1978-03-27 |
1980-06-17 |
Choy Daniel S J |
Laser tunnelling device
|
|
US4224498A
(en)
*
|
1978-05-22 |
1980-09-23 |
Philip Morris Incorporated |
Apparatus for perforating articles by laser
|
|
US4224497A
(en)
*
|
1978-05-22 |
1980-09-23 |
Philip Morris Incorporated |
Method for making filter cigarettes using light energy to make perforations in the filter tipping wrap
|
|
IT1165636B
(it)
*
|
1979-03-05 |
1987-04-22 |
Fiat Auto Spa |
Metodo ed apparecchio per il controllo dei gas di copertura utilizzati nelle lavorazioni a mezzo di laser di potenza su pezzi metallici
|
|
DE3008176C2
(de)
*
|
1979-03-07 |
1986-02-20 |
Crosfield Electronics Ltd., London |
Gravieren von Druckzylindern
|
|
JPS55155314A
(en)
*
|
1979-05-21 |
1980-12-03 |
Nippon Telegr & Teleph Corp <Ntt> |
Connecting method of optical fiber and its connector
|
|
CH642891A5
(de)
*
|
1979-11-21 |
1984-05-15 |
Laser Work Ag |
Verfahren und vorrichtung zur bearbeitung eines werkstuecks mittels laserstrahl.
|
|
FR2464658A1
(fr)
*
|
1980-06-16 |
1981-03-20 |
Philip Morris Inc |
Procede et appareil pour perforer des articles, notamment des cigarettes au moyen d'un laser
|
|
US4478677A
(en)
*
|
1983-12-22 |
1984-10-23 |
International Business Machines Corporation |
Laser induced dry etching of vias in glass with non-contact masking
|
|
US4659901A
(en)
*
|
1984-07-10 |
1987-04-21 |
Westinghouse Electric Corp. |
Particulate collection system for laser welding apparatus
|
|
DE3513501A1
(de)
*
|
1985-04-16 |
1986-10-16 |
Rofin-Sinar Laser GmbH, 2000 Hamburg |
Laserschweissgeraet
|
|
US4782496A
(en)
*
|
1987-11-05 |
1988-11-01 |
United Technologies Corporation |
Breakaway nozzle for a laser processing machine
|
|
AT401247B
(de)
*
|
1991-02-15 |
1996-07-25 |
Schuoecker Dieter Dipl Ing Dr |
Laserbearbeitungsvorrichtung
|
|
GB9112105D0
(en)
*
|
1991-06-05 |
1991-07-24 |
Molins Plc |
Cigarette manufacture
|
|
JP3273802B2
(ja)
*
|
1992-02-13 |
2002-04-15 |
日本たばこ産業株式会社 |
シガレット製造機における巻たばこの巻径制御装置
|
|
JPH07503904A
(ja)
*
|
1992-02-25 |
1995-04-27 |
アルテック・エス・アール・エル |
レーザ加工装置
|
|
US5275214A
(en)
*
|
1992-10-28 |
1994-01-04 |
Rehberger Kevin M |
Apparatus for unloading pressurized fluid
|
|
US5359176A
(en)
*
|
1993-04-02 |
1994-10-25 |
International Business Machines Corporation |
Optics and environmental protection device for laser processing applications
|
|
AT402169B
(de)
*
|
1993-11-16 |
1997-02-25 |
Schuoecker Dieter Dr |
Verfahren zum schneiden oder abtragen eines werkstücks mittels eines laserstrahls
|
|
DE4403340A1
(de)
*
|
1994-02-03 |
1995-08-10 |
Heinzl Joachim |
Verfahren zum Herstellen zumindest einer Mikrodüse eines aerostatischen Lagers
|
|
US5496985A
(en)
*
|
1994-04-01 |
1996-03-05 |
Xerox Corporation |
Laser ablation nozzle
|
|
AT404914B
(de)
*
|
1996-01-25 |
1999-03-25 |
Schuoecker Dieter Dr |
Vorrichtung zur abtragenden lasermaterialbearbeitung mit schmelzaustrieb durch eine im bearbeitungskopf angebrachte strahlpumpe
|
|
US6054673A
(en)
*
|
1997-09-17 |
2000-04-25 |
General Electric Company |
Method and apparatus for laser drilling
|
|
US6320158B1
(en)
*
|
1998-01-29 |
2001-11-20 |
Fujitsu Limited |
Method and apparatus of fabricating perforated plate
|
|
DE19816029A1
(de)
*
|
1998-04-09 |
1999-10-14 |
Volkswagen Ag |
Laservorrichtung zur Materialbearbeitung
|
|
JP4396953B2
(ja)
*
|
1998-08-26 |
2010-01-13 |
三星電子株式会社 |
レーザ切断装置および切断方法
|
|
DE19840934B4
(de)
*
|
1998-09-08 |
2005-03-24 |
Hell Gravure Systems Gmbh |
Anordnung zum Entfernen von Material, das durch eine Laserstrahlungsquelle bei der Materialbearbeitung von einer Bearbeitungsfläche abgetragen wird
|
|
JP3056723B1
(ja)
|
1999-01-04 |
2000-06-26 |
ファナック株式会社 |
レ―ザ加工装置
|
|
US6492616B1
(en)
*
|
1999-05-24 |
2002-12-10 |
Nippon Steel Chemical Co., Ltd. |
Processes for laser beam machining of resin film for wiring boards and manufacture of wiring boards
|
|
US6326590B1
(en)
*
|
2000-01-25 |
2001-12-04 |
Eastman Kodak Company |
Nozzle element adaptable to a laser beam tube used in laser edge marking equipment
|
|
US6400389B1
(en)
|
2000-01-25 |
2002-06-04 |
Eastman Kodak Company |
Apparatus for laser marking indicia on a photosensitive web
|
|
JP4659300B2
(ja)
|
2000-09-13 |
2011-03-30 |
浜松ホトニクス株式会社 |
レーザ加工方法及び半導体チップの製造方法
|
|
DE50013496D1
(de)
*
|
2000-09-27 |
2006-11-02 |
Eberhard Kertscher |
Verfahren zur kontinuierlichen Herstellung von Tropfbewässerungsrohren
|
|
DE10145819C2
(de)
*
|
2001-09-17 |
2003-08-14 |
Asys Gmbh |
Werkzeugbestückung für eine Arbeitseinheit von Mikrosystemen
|
|
US6756564B2
(en)
*
|
2001-12-31 |
2004-06-29 |
Andrx Pharmaceuticals Llc |
System and method for removing particulate created from a drilled or cut surface
|
|
US7994450B2
(en)
*
|
2002-01-07 |
2011-08-09 |
International Business Machines Corporation |
Debris minimization and improved spatial resolution in pulsed laser ablation of materials
|
|
DE10209617C1
(de)
*
|
2002-03-05 |
2003-08-07 |
Siemens Ag |
Laserbeschriftungsverfahren
|
|
TWI326626B
(en)
|
2002-03-12 |
2010-07-01 |
Hamamatsu Photonics Kk |
Laser processing method
|
|
EP1632997B1
(en)
|
2002-03-12 |
2007-05-16 |
Hamamatsu Photonics K. K. |
Substrate dividing method
|
|
JP2005533657A
(ja)
*
|
2002-07-24 |
2005-11-10 |
ファイザー・プロダクツ・インク |
薬剤用のレーザー穴あけ装置
|
|
US6621045B1
(en)
*
|
2002-07-25 |
2003-09-16 |
Matsushita Electric Industrial Co., Ltd. |
Workpiece stabilization with gas flow
|
|
US6969822B2
(en)
*
|
2003-05-13 |
2005-11-29 |
Hewlett-Packard Development Company, L.P. |
Laser micromachining systems
|
|
EP1588864A1
(en)
*
|
2004-04-22 |
2005-10-26 |
Kba-Giori S.A. |
Printing machine with laser perforating unit
|
|
US20070045258A1
(en)
*
|
2005-08-30 |
2007-03-01 |
Tsunehiko Yamazaki |
Nozzle polishing device in laser processing machine
|
|
JP4993886B2
(ja)
*
|
2005-09-07 |
2012-08-08 |
株式会社ディスコ |
レーザー加工装置
|
|
JP5165203B2
(ja)
*
|
2006-03-07 |
2013-03-21 |
ソニー株式会社 |
レーザ加工装置及びレーザ加工方法
|
|
JP4404085B2
(ja)
*
|
2006-11-02 |
2010-01-27 |
ソニー株式会社 |
レーザ加工装置、レーザ加工ヘッド及びレーザ加工方法
|
|
US8642919B2
(en)
*
|
2009-03-31 |
2014-02-04 |
Ats Automation Tooling Systems Inc. |
Laser processing nozzle
|
|
WO2011055373A1
(en)
*
|
2009-11-03 |
2011-05-12 |
The Secretary, Department Of Atomic Energy,Govt.Of India. |
Niobium based superconducting radio frequency (scrf) cavities comprising niobium components joined by laser welding; method and apparatus for manufacturing such cavities
|
|
JP5587595B2
(ja)
*
|
2009-12-11 |
2014-09-10 |
株式会社ディスコ |
レーザー加工装置
|
|
US20120118395A1
(en)
*
|
2010-11-12 |
2012-05-17 |
Ut-Battelle, Llc |
Repetitive pressure-pulse apparatus and method for cavitation damage research
|
|
FR2975318B1
(fr)
*
|
2011-05-16 |
2014-05-09 |
Air Liquide |
Buse laser a element mobile
|
|
US8829388B2
(en)
*
|
2011-07-29 |
2014-09-09 |
Ipg Photonics Corporation |
Method for contactless laser welding and apparatus
|
|
US9579750B2
(en)
*
|
2011-10-05 |
2017-02-28 |
Applied Materials, Inc. |
Particle control in laser processing systems
|
|
KR101341001B1
(ko)
*
|
2011-11-17 |
2013-12-13 |
주식회사 아이엠티 |
레이저를 이용한 대면적 마스크 세정 장치 및 이를 포함하는 대면적 마스크 세정 시스템
|
|
US8969760B2
(en)
|
2012-09-14 |
2015-03-03 |
General Electric Company |
System and method for manufacturing an airfoil
|
|
US8993923B2
(en)
|
2012-09-14 |
2015-03-31 |
General Electric Company |
System and method for manufacturing an airfoil
|
|
FR2997881B1
(fr)
*
|
2012-11-09 |
2015-04-17 |
Air Liquide |
Buse laser a element mobile externe
|
|
JP6104025B2
(ja)
*
|
2013-04-11 |
2017-03-29 |
株式会社ディスコ |
レーザー加工装置及びレーザー加工方法
|
|
US9676058B2
(en)
|
2014-01-27 |
2017-06-13 |
General Electric Company |
Method and system for detecting drilling progress in laser drilling
|
|
US9662743B2
(en)
|
2014-01-27 |
2017-05-30 |
General Electric Company |
Method for drilling a hole in an airfoil
|
|
US9468991B2
(en)
|
2014-01-27 |
2016-10-18 |
General Electric Company |
Method determining hole completion
|
|
KR102264649B1
(ko)
*
|
2014-11-11 |
2021-06-15 |
삼성디스플레이 주식회사 |
레이저 절단 장치
|
|
US9770785B2
(en)
|
2014-11-18 |
2017-09-26 |
General Electric Company |
System and method for forming a cooling hole in an airfoil
|
|
JP6128101B2
(ja)
*
|
2014-11-21 |
2017-05-17 |
トヨタ自動車株式会社 |
レーザクラッド装置
|
|
US10589385B2
(en)
|
2015-01-08 |
2020-03-17 |
General Electric Company |
Method and system for confined laser drilling
|
|
US11292081B2
(en)
|
2015-01-08 |
2022-04-05 |
General Electric Company |
Method and system for confined laser drilling
|
|
US9776284B2
(en)
|
2015-01-22 |
2017-10-03 |
General Electric Company |
System and method for cutting a passage in an airfoil
|
|
US9962792B2
(en)
|
2015-02-20 |
2018-05-08 |
General Electric Company |
Component repair using confined laser drilling
|
|
JP6516624B2
(ja)
*
|
2015-08-11 |
2019-05-22 |
株式会社ディスコ |
レーザ加工装置
|
|
WO2017034807A1
(en)
|
2015-08-26 |
2017-03-02 |
Electro Scientific Industries, Inc. |
Laser scan sequencing and direction with respect to gas flow
|
|
JP6647829B2
(ja)
*
|
2015-10-20 |
2020-02-14 |
株式会社ディスコ |
レーザ加工装置
|
|
JP6450783B2
(ja)
*
|
2017-01-19 |
2019-01-09 |
ファナック株式会社 |
レーザ加工ヘッド用ノズル
|
|
JP6450784B2
(ja)
*
|
2017-01-19 |
2019-01-09 |
ファナック株式会社 |
レーザ加工機
|
|
TWI653970B
(zh)
*
|
2017-11-28 |
2019-03-21 |
財團法人金屬工業研究發展中心 |
牙材製造裝置及牙材製造方法
|
|
CN108500454A
(zh)
*
|
2018-04-27 |
2018-09-07 |
深圳市振华兴科技有限公司 |
吸烟吸尘装置及激光生产设备
|
|
KR102167268B1
(ko)
*
|
2019-02-11 |
2020-10-19 |
(주)에스티아이 |
불량 led 제거 장치
|
|
DE102019103659B4
(de)
*
|
2019-02-13 |
2023-11-30 |
Bystronic Laser Ag |
Gasführung, Laserschneidkopf und Laserschneidmaschine
|
|
US11267075B2
(en)
*
|
2019-05-16 |
2022-03-08 |
Raytheon Technologies Corporation |
By-product removal device for laser welding
|
|
CN112809170A
(zh)
*
|
2019-10-29 |
2021-05-18 |
大族激光科技产业集团股份有限公司 |
硅晶圆切割装置及方法
|
|
JP7431601B2
(ja)
*
|
2020-02-10 |
2024-02-15 |
株式会社ディスコ |
レーザー加工装置
|
|
DE102020129495A1
(de)
|
2020-11-09 |
2022-05-12 |
Endress+Hauser SE+Co. KG |
Spülaufsatz und Verfahren zur Bearbeitung, insbesondere Strukturierung, einer Oberfläche eines Werkstücks mittels Laser
|