FR2324425B1 - - Google Patents

Info

Publication number
FR2324425B1
FR2324425B1 FR7625010A FR7625010A FR2324425B1 FR 2324425 B1 FR2324425 B1 FR 2324425B1 FR 7625010 A FR7625010 A FR 7625010A FR 7625010 A FR7625010 A FR 7625010A FR 2324425 B1 FR2324425 B1 FR 2324425B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7625010A
Other languages
French (fr)
Other versions
FR2324425A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of FR2324425A1 publication Critical patent/FR2324425A1/fr
Application granted granted Critical
Publication of FR2324425B1 publication Critical patent/FR2324425B1/fr
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/123Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/1224Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in vacuum
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1423Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the flow carrying an electric current

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
FR7625010A 1975-09-17 1976-08-10 Appareil permettant de percer des trous dans un materiau et utilisant une energie radiante Granted FR2324425A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/614,049 US4027137A (en) 1975-09-17 1975-09-17 Laser drilling nozzle

Publications (2)

Publication Number Publication Date
FR2324425A1 FR2324425A1 (fr) 1977-04-15
FR2324425B1 true FR2324425B1 (OSRAM) 1979-04-06

Family

ID=24459671

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7625010A Granted FR2324425A1 (fr) 1975-09-17 1976-08-10 Appareil permettant de percer des trous dans un materiau et utilisant une energie radiante

Country Status (3)

Country Link
US (1) US4027137A (OSRAM)
JP (1) JPS5857277B2 (OSRAM)
FR (1) FR2324425A1 (OSRAM)

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US4224498A (en) * 1978-05-22 1980-09-23 Philip Morris Incorporated Apparatus for perforating articles by laser
US4224497A (en) * 1978-05-22 1980-09-23 Philip Morris Incorporated Method for making filter cigarettes using light energy to make perforations in the filter tipping wrap
IT1165636B (it) * 1979-03-05 1987-04-22 Fiat Auto Spa Metodo ed apparecchio per il controllo dei gas di copertura utilizzati nelle lavorazioni a mezzo di laser di potenza su pezzi metallici
DE3008176C2 (de) * 1979-03-07 1986-02-20 Crosfield Electronics Ltd., London Gravieren von Druckzylindern
JPS55155314A (en) * 1979-05-21 1980-12-03 Nippon Telegr & Teleph Corp <Ntt> Connecting method of optical fiber and its connector
CH642891A5 (de) * 1979-11-21 1984-05-15 Laser Work Ag Verfahren und vorrichtung zur bearbeitung eines werkstuecks mittels laserstrahl.
FR2464658A1 (fr) * 1980-06-16 1981-03-20 Philip Morris Inc Procede et appareil pour perforer des articles, notamment des cigarettes au moyen d'un laser
US4478677A (en) * 1983-12-22 1984-10-23 International Business Machines Corporation Laser induced dry etching of vias in glass with non-contact masking
US4659901A (en) * 1984-07-10 1987-04-21 Westinghouse Electric Corp. Particulate collection system for laser welding apparatus
DE3513501A1 (de) * 1985-04-16 1986-10-16 Rofin-Sinar Laser GmbH, 2000 Hamburg Laserschweissgeraet
US4782496A (en) * 1987-11-05 1988-11-01 United Technologies Corporation Breakaway nozzle for a laser processing machine
AT401247B (de) * 1991-02-15 1996-07-25 Schuoecker Dieter Dipl Ing Dr Laserbearbeitungsvorrichtung
GB9112105D0 (en) * 1991-06-05 1991-07-24 Molins Plc Cigarette manufacture
JP3273802B2 (ja) * 1992-02-13 2002-04-15 日本たばこ産業株式会社 シガレット製造機における巻たばこの巻径制御装置
JPH07503904A (ja) * 1992-02-25 1995-04-27 アルテック・エス・アール・エル レーザ加工装置
US5275214A (en) * 1992-10-28 1994-01-04 Rehberger Kevin M Apparatus for unloading pressurized fluid
US5359176A (en) * 1993-04-02 1994-10-25 International Business Machines Corporation Optics and environmental protection device for laser processing applications
AT402169B (de) * 1993-11-16 1997-02-25 Schuoecker Dieter Dr Verfahren zum schneiden oder abtragen eines werkstücks mittels eines laserstrahls
DE4403340A1 (de) * 1994-02-03 1995-08-10 Heinzl Joachim Verfahren zum Herstellen zumindest einer Mikrodüse eines aerostatischen Lagers
US5496985A (en) * 1994-04-01 1996-03-05 Xerox Corporation Laser ablation nozzle
AT404914B (de) * 1996-01-25 1999-03-25 Schuoecker Dieter Dr Vorrichtung zur abtragenden lasermaterialbearbeitung mit schmelzaustrieb durch eine im bearbeitungskopf angebrachte strahlpumpe
US6054673A (en) * 1997-09-17 2000-04-25 General Electric Company Method and apparatus for laser drilling
US6320158B1 (en) * 1998-01-29 2001-11-20 Fujitsu Limited Method and apparatus of fabricating perforated plate
DE19816029A1 (de) * 1998-04-09 1999-10-14 Volkswagen Ag Laservorrichtung zur Materialbearbeitung
JP4396953B2 (ja) * 1998-08-26 2010-01-13 三星電子株式会社 レーザ切断装置および切断方法
DE19840934B4 (de) * 1998-09-08 2005-03-24 Hell Gravure Systems Gmbh Anordnung zum Entfernen von Material, das durch eine Laserstrahlungsquelle bei der Materialbearbeitung von einer Bearbeitungsfläche abgetragen wird
JP3056723B1 (ja) 1999-01-04 2000-06-26 ファナック株式会社 レ―ザ加工装置
US6492616B1 (en) * 1999-05-24 2002-12-10 Nippon Steel Chemical Co., Ltd. Processes for laser beam machining of resin film for wiring boards and manufacture of wiring boards
US6326590B1 (en) * 2000-01-25 2001-12-04 Eastman Kodak Company Nozzle element adaptable to a laser beam tube used in laser edge marking equipment
US6400389B1 (en) 2000-01-25 2002-06-04 Eastman Kodak Company Apparatus for laser marking indicia on a photosensitive web
JP4659300B2 (ja) 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
DE50013496D1 (de) * 2000-09-27 2006-11-02 Eberhard Kertscher Verfahren zur kontinuierlichen Herstellung von Tropfbewässerungsrohren
DE10145819C2 (de) * 2001-09-17 2003-08-14 Asys Gmbh Werkzeugbestückung für eine Arbeitseinheit von Mikrosystemen
US6756564B2 (en) * 2001-12-31 2004-06-29 Andrx Pharmaceuticals Llc System and method for removing particulate created from a drilled or cut surface
US7994450B2 (en) * 2002-01-07 2011-08-09 International Business Machines Corporation Debris minimization and improved spatial resolution in pulsed laser ablation of materials
DE10209617C1 (de) * 2002-03-05 2003-08-07 Siemens Ag Laserbeschriftungsverfahren
TWI326626B (en) 2002-03-12 2010-07-01 Hamamatsu Photonics Kk Laser processing method
EP1632997B1 (en) 2002-03-12 2007-05-16 Hamamatsu Photonics K. K. Substrate dividing method
JP2005533657A (ja) * 2002-07-24 2005-11-10 ファイザー・プロダクツ・インク 薬剤用のレーザー穴あけ装置
US6621045B1 (en) * 2002-07-25 2003-09-16 Matsushita Electric Industrial Co., Ltd. Workpiece stabilization with gas flow
US6969822B2 (en) * 2003-05-13 2005-11-29 Hewlett-Packard Development Company, L.P. Laser micromachining systems
EP1588864A1 (en) * 2004-04-22 2005-10-26 Kba-Giori S.A. Printing machine with laser perforating unit
US20070045258A1 (en) * 2005-08-30 2007-03-01 Tsunehiko Yamazaki Nozzle polishing device in laser processing machine
JP4993886B2 (ja) * 2005-09-07 2012-08-08 株式会社ディスコ レーザー加工装置
JP5165203B2 (ja) * 2006-03-07 2013-03-21 ソニー株式会社 レーザ加工装置及びレーザ加工方法
JP4404085B2 (ja) * 2006-11-02 2010-01-27 ソニー株式会社 レーザ加工装置、レーザ加工ヘッド及びレーザ加工方法
US8642919B2 (en) * 2009-03-31 2014-02-04 Ats Automation Tooling Systems Inc. Laser processing nozzle
WO2011055373A1 (en) * 2009-11-03 2011-05-12 The Secretary, Department Of Atomic Energy,Govt.Of India. Niobium based superconducting radio frequency (scrf) cavities comprising niobium components joined by laser welding; method and apparatus for manufacturing such cavities
JP5587595B2 (ja) * 2009-12-11 2014-09-10 株式会社ディスコ レーザー加工装置
US20120118395A1 (en) * 2010-11-12 2012-05-17 Ut-Battelle, Llc Repetitive pressure-pulse apparatus and method for cavitation damage research
FR2975318B1 (fr) * 2011-05-16 2014-05-09 Air Liquide Buse laser a element mobile
US8829388B2 (en) * 2011-07-29 2014-09-09 Ipg Photonics Corporation Method for contactless laser welding and apparatus
US9579750B2 (en) * 2011-10-05 2017-02-28 Applied Materials, Inc. Particle control in laser processing systems
KR101341001B1 (ko) * 2011-11-17 2013-12-13 주식회사 아이엠티 레이저를 이용한 대면적 마스크 세정 장치 및 이를 포함하는 대면적 마스크 세정 시스템
US8969760B2 (en) 2012-09-14 2015-03-03 General Electric Company System and method for manufacturing an airfoil
US8993923B2 (en) 2012-09-14 2015-03-31 General Electric Company System and method for manufacturing an airfoil
FR2997881B1 (fr) * 2012-11-09 2015-04-17 Air Liquide Buse laser a element mobile externe
JP6104025B2 (ja) * 2013-04-11 2017-03-29 株式会社ディスコ レーザー加工装置及びレーザー加工方法
US9676058B2 (en) 2014-01-27 2017-06-13 General Electric Company Method and system for detecting drilling progress in laser drilling
US9662743B2 (en) 2014-01-27 2017-05-30 General Electric Company Method for drilling a hole in an airfoil
US9468991B2 (en) 2014-01-27 2016-10-18 General Electric Company Method determining hole completion
KR102264649B1 (ko) * 2014-11-11 2021-06-15 삼성디스플레이 주식회사 레이저 절단 장치
US9770785B2 (en) 2014-11-18 2017-09-26 General Electric Company System and method for forming a cooling hole in an airfoil
JP6128101B2 (ja) * 2014-11-21 2017-05-17 トヨタ自動車株式会社 レーザクラッド装置
US10589385B2 (en) 2015-01-08 2020-03-17 General Electric Company Method and system for confined laser drilling
US11292081B2 (en) 2015-01-08 2022-04-05 General Electric Company Method and system for confined laser drilling
US9776284B2 (en) 2015-01-22 2017-10-03 General Electric Company System and method for cutting a passage in an airfoil
US9962792B2 (en) 2015-02-20 2018-05-08 General Electric Company Component repair using confined laser drilling
JP6516624B2 (ja) * 2015-08-11 2019-05-22 株式会社ディスコ レーザ加工装置
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JP6647829B2 (ja) * 2015-10-20 2020-02-14 株式会社ディスコ レーザ加工装置
JP6450783B2 (ja) * 2017-01-19 2019-01-09 ファナック株式会社 レーザ加工ヘッド用ノズル
JP6450784B2 (ja) * 2017-01-19 2019-01-09 ファナック株式会社 レーザ加工機
TWI653970B (zh) * 2017-11-28 2019-03-21 財團法人金屬工業研究發展中心 牙材製造裝置及牙材製造方法
CN108500454A (zh) * 2018-04-27 2018-09-07 深圳市振华兴科技有限公司 吸烟吸尘装置及激光生产设备
KR102167268B1 (ko) * 2019-02-11 2020-10-19 (주)에스티아이 불량 led 제거 장치
DE102019103659B4 (de) * 2019-02-13 2023-11-30 Bystronic Laser Ag Gasführung, Laserschneidkopf und Laserschneidmaschine
US11267075B2 (en) * 2019-05-16 2022-03-08 Raytheon Technologies Corporation By-product removal device for laser welding
CN112809170A (zh) * 2019-10-29 2021-05-18 大族激光科技产业集团股份有限公司 硅晶圆切割装置及方法
JP7431601B2 (ja) * 2020-02-10 2024-02-15 株式会社ディスコ レーザー加工装置
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US3866398A (en) * 1973-12-20 1975-02-18 Texas Instruments Inc In-situ gas-phase reaction for removal of laser-scribe debris

Also Published As

Publication number Publication date
FR2324425A1 (fr) 1977-04-15
US4027137A (en) 1977-05-31
JPS5857277B2 (ja) 1983-12-19
JPS5237298A (en) 1977-03-23

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Legal Events

Date Code Title Description
ST Notification of lapse