FR2321194B1 - - Google Patents

Info

Publication number
FR2321194B1
FR2321194B1 FR7624636A FR7624636A FR2321194B1 FR 2321194 B1 FR2321194 B1 FR 2321194B1 FR 7624636 A FR7624636 A FR 7624636A FR 7624636 A FR7624636 A FR 7624636A FR 2321194 B1 FR2321194 B1 FR 2321194B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7624636A
Other versions
FR2321194A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Publication of FR2321194A1 publication Critical patent/FR2321194A1/fr
Application granted granted Critical
Publication of FR2321194B1 publication Critical patent/FR2321194B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/1025—Channel region of field-effect devices
    • H01L29/1029—Channel region of field-effect devices of field-effect transistors
    • H01L29/1033—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure
    • H01L29/1041—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure with a non-uniform doping structure in the channel region surface
    • H01L29/1045—Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure with a non-uniform doping structure in the channel region surface the doping structure being parallel to the channel length, e.g. DMOS like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
FR7624636A 1975-08-14 1976-08-12 Transistor a effet de champ a declencheur isole Granted FR2321194A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50098092A JPS5222480A (en) 1975-08-14 1975-08-14 Insulating gate field effect transistor

Publications (2)

Publication Number Publication Date
FR2321194A1 FR2321194A1 (fr) 1977-03-11
FR2321194B1 true FR2321194B1 (fr) 1979-08-17

Family

ID=14210688

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7624636A Granted FR2321194A1 (fr) 1975-08-14 1976-08-12 Transistor a effet de champ a declencheur isole

Country Status (6)

Country Link
US (1) US4091405A (fr)
JP (1) JPS5222480A (fr)
CA (1) CA1054723A (fr)
DE (1) DE2636369C2 (fr)
FR (1) FR2321194A1 (fr)
NL (1) NL171397C (fr)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5448489A (en) * 1977-09-26 1979-04-17 Nippon Telegr & Teleph Corp <Ntt> Mis type semiconductor device
US4217599A (en) * 1977-12-21 1980-08-12 Tektronix, Inc. Narrow channel MOS devices and method of manufacturing
DE2802838A1 (de) * 1978-01-23 1979-08-16 Siemens Ag Mis-feldeffekttransistor mit kurzer kanallaenge
JPS55105373A (en) * 1978-12-04 1980-08-12 Mostek Corp Metal oxide semiconductor transistor and method of fabricating same
US4274105A (en) * 1978-12-29 1981-06-16 International Business Machines Corporation MOSFET Substrate sensitivity control
DE2926417A1 (de) * 1979-06-29 1981-01-22 Siemens Ag Dynamische halbleiterspeicherzelle und verfahren zu ihrer herstellung
DE2926416A1 (de) * 1979-06-29 1981-01-22 Siemens Ag Dynamische halbleiter-speicherzelle und verfahren zu ihrer herstellung
WO1981001485A1 (fr) * 1979-11-14 1981-05-28 Ncr Co Dispositifs a semi-conducteurs a effet de champ a canaux etroits et procede de fabrication de ceux-ci
US4937640A (en) * 1980-11-03 1990-06-26 International Business Machines Corporation Short channel MOSFET
JPS58115863A (ja) * 1981-12-28 1983-07-09 Matsushita Electric Ind Co Ltd 絶縁ゲ−ト型電界効果半導体装置およびその製造方法
JPS62217666A (ja) * 1986-03-18 1987-09-25 Nippon Denso Co Ltd Ｍｉｓトランジスタ
US5122474A (en) * 1988-06-23 1992-06-16 Dallas Semiconductor Corporation Method of fabricating a CMOS IC with reduced susceptibility to PMOS punchthrough
US4943537A (en) * 1988-06-23 1990-07-24 Dallas Semiconductor Corporation CMOS integrated circuit with reduced susceptibility to PMOS punchthrough
JPH0734475B2 (ja) * 1989-03-10 1995-04-12 株式会社東芝 半導体装置
JP3229012B2 (ja) * 1992-05-21 2001-11-12 株式会社東芝 半導体装置の製造方法
US5372960A (en) * 1994-01-04 1994-12-13 Motorola, Inc. Method of fabricating an insulated gate semiconductor device
WO2018147349A1 (fr) 2017-02-13 2018-08-16 株式会社Uacj Tuyau perforé plat extrudé en aluminium présentant une excellente résistance à la corrosion de surface interne/externe, et échangeur de chaleur en aluminium obtenu au moyen de ce tuyau
CN110291355A (zh) 2017-02-13 2019-09-27 株式会社Uacj 钎焊性及外表面防腐蚀性优异的铝挤出扁平多孔管及使用其而成的铝制热交换器

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3305708A (en) * 1964-11-25 1967-02-21 Rca Corp Insulated-gate field-effect semiconductor device
US3600647A (en) * 1970-03-02 1971-08-17 Gen Electric Field-effect transistor with reduced drain-to-substrate capacitance
JPS4931509U (fr) * 1972-06-17 1974-03-19
US3891190A (en) * 1972-07-07 1975-06-24 Intel Corp Integrated circuit structure and method for making integrated circuit structure
US3868187A (en) * 1972-08-31 1975-02-25 Tokyo Shibaura Electric Co Avalanche injection type mos memory
JPS5636585B2 (fr) * 1973-07-02 1981-08-25
JPS5024084A (fr) * 1973-07-05 1975-03-14

Also Published As

Publication number Publication date
DE2636369A1 (de) 1977-02-17
NL171397B (nl) 1982-10-18
US4091405A (en) 1978-05-23
FR2321194A1 (fr) 1977-03-11
JPS5222480A (en) 1977-02-19
DE2636369C2 (de) 1981-09-24
CA1054723A (fr) 1979-05-15
NL7609052A (nl) 1977-02-16
NL171397C (nl) 1983-03-16

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Legal Events

Date Code Title Description
TP Transmission of property
CA Change of address