FR2312183A7 - Element d'interconnexion et son procede de realisation - Google Patents

Element d'interconnexion et son procede de realisation

Info

Publication number
FR2312183A7
FR2312183A7 FR7614955A FR7614955A FR2312183A7 FR 2312183 A7 FR2312183 A7 FR 2312183A7 FR 7614955 A FR7614955 A FR 7614955A FR 7614955 A FR7614955 A FR 7614955A FR 2312183 A7 FR2312183 A7 FR 2312183A7
Authority
FR
France
Prior art keywords
implementation process
interconnection element
interconnection
implementation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7614955A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chomerics Inc
Original Assignee
Chomerics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chomerics Inc filed Critical Chomerics Inc
Application granted granted Critical
Publication of FR2312183A7 publication Critical patent/FR2312183A7/fr
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • G04G17/06—Electric connectors, e.g. conductive elastomers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/4922—Contact or terminal manufacturing by assembling plural parts with molding of insulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4981—Utilizing transitory attached element or associated separate material
FR7614955A 1975-05-19 1976-05-18 Element d'interconnexion et son procede de realisation Expired FR2312183A7 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/578,935 US3991463A (en) 1975-05-19 1975-05-19 Method of forming an interconnector

Publications (1)

Publication Number Publication Date
FR2312183A7 true FR2312183A7 (fr) 1976-12-17

Family

ID=24314928

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7614955A Expired FR2312183A7 (fr) 1975-05-19 1976-05-18 Element d'interconnexion et son procede de realisation

Country Status (4)

Country Link
US (1) US3991463A (fr)
JP (1) JPS52375A (fr)
DE (1) DE7614987U1 (fr)
FR (1) FR2312183A7 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4655524A (en) * 1985-01-07 1987-04-07 Rogers Corporation Solderless connection apparatus
US5138528A (en) * 1991-02-06 1992-08-11 Amp Incorporated Electrical packaging system and components therefor

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5140095A (fr) * 1974-09-30 1976-04-03 Sharp Kk
AT356190B (de) * 1976-06-16 1980-04-10 Bbc Brown Boveri & Cie Fluessigkristallanzeige
US4201435A (en) * 1976-07-26 1980-05-06 Shin-Etsu Polymer Co. Ltd. Interconnectors
AU516166B2 (en) * 1977-09-24 1981-05-21 Amp Incorporated Electrical connector
JPS5840728B2 (ja) * 1978-08-23 1983-09-07 株式会社日立製作所 液晶表示装置
US4380357A (en) * 1980-11-03 1983-04-19 Texas Instruments Incorporated System and method for effecting electrical interconnections using a flexible media with radially extending electrical conductors
US4705205A (en) * 1983-06-30 1987-11-10 Raychem Corporation Chip carrier mounting device
US4664309A (en) * 1983-06-30 1987-05-12 Raychem Corporation Chip mounting device
JPS60138524A (ja) * 1983-12-27 1985-07-23 Toshiba Corp 透過形投射スクリ−ンの製造方法
JPH0616150B2 (ja) * 1983-12-27 1994-03-02 株式会社東芝 透過形投射スクリ−ンの製造方法
US4597617A (en) * 1984-03-19 1986-07-01 Tektronix, Inc. Pressure interconnect package for integrated circuits
US4577918A (en) * 1984-05-01 1986-03-25 International Business Machines Corporation Copper and dual durometer rubber multiple connector
DE3424239A1 (de) * 1984-06-30 1986-01-16 Mannesmann Kienzle GmbH, 7730 Villingen-Schwenningen Elektronische anzeigevorrichtung
FR2572856B1 (fr) * 1984-11-06 1988-01-08 Socapex Element de connexion miniature a faible pas et procede de fabrication d'un tel element de connexion
US4647959A (en) * 1985-05-20 1987-03-03 Tektronix, Inc. Integrated circuit package, and method of forming an integrated circuit package
JPS62174173A (ja) * 1985-10-03 1987-07-30 Norio Kawashima プリンタ用給紙装置
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
NL8503526A (nl) * 1985-12-20 1987-07-16 Philips Nv Doorzichtprojektiescherm.
US4712721A (en) * 1986-03-17 1987-12-15 Raychem Corp. Solder delivery systems
US5013248A (en) * 1989-09-19 1991-05-07 Amp Incorporated Multicircuit connector assembly
US5101553A (en) * 1991-04-29 1992-04-07 Microelectronics And Computer Technology Corporation Method of making a metal-on-elastomer pressure contact connector
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US5820014A (en) * 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US5994152A (en) * 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
JP3198332B2 (ja) * 1997-12-16 2001-08-13 ローム株式会社 表示装置のマザーボードへの実装方法、および表示装置の実装構造
US6293804B2 (en) * 1999-02-08 2001-09-25 Ericsson Inc. Self-aligning LCD connector assembly
JP3622665B2 (ja) * 1999-12-10 2005-02-23 セイコーエプソン株式会社 接続構造、電気光学装置および電子機器
US6600530B1 (en) * 1999-12-17 2003-07-29 Nokia Mobile Phones Limited Display module
JP3533519B2 (ja) * 2000-03-09 2004-05-31 株式会社アドバンスト・ディスプレイ Ｔｆｔ基板、フィルムキャリアおよび液晶表示素子の製法
US7021946B2 (en) * 2002-04-19 2006-04-04 Citizens Electronics Co., Ltd. Connector integrated with a LED element
JP4570106B2 (ja) * 2007-09-18 2010-10-27 日本航空電子工業株式会社 コネクタ
JP6330697B2 (ja) * 2015-02-27 2018-05-30 カシオ計算機株式会社 基板ユニット及び時計
CN211126230U (zh) 2020-01-21 2020-07-28 东莞讯滔电子有限公司 电连接器

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3039177A (en) * 1957-07-29 1962-06-19 Itt Multiplanar printed circuit
US3345741A (en) * 1963-03-14 1967-10-10 Litton Systems Inc Weldable printed circuit board techniques
FR1398226A (fr) * 1963-05-08 1965-05-07 Procédé et dispositif pour dissiper la chaleur notamment dans les appareils électroniques
US3861135A (en) * 1973-02-08 1975-01-21 Chomerics Inc Electrical interconnector and method of making
US3883213A (en) * 1974-01-07 1975-05-13 Chomerics Inc Connectors

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4655524A (en) * 1985-01-07 1987-04-07 Rogers Corporation Solderless connection apparatus
US5138528A (en) * 1991-02-06 1992-08-11 Amp Incorporated Electrical packaging system and components therefor

Also Published As

Publication number Publication date
US3991463A (en) 1976-11-16
JPS52375A (en) 1977-01-05
DE7614987U1 (de) 1976-09-23

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Legal Events

Date Code Title Description
ST Notification of lapse