FR2312172B1 - - Google Patents

Info

Publication number
FR2312172B1
FR2312172B1 FR7610362A FR7610362A FR2312172B1 FR 2312172 B1 FR2312172 B1 FR 2312172B1 FR 7610362 A FR7610362 A FR 7610362A FR 7610362 A FR7610362 A FR 7610362A FR 2312172 B1 FR2312172 B1 FR 2312172B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7610362A
Other languages
French (fr)
Other versions
FR2312172A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of FR2312172A1 publication Critical patent/FR2312172A1/fr
Application granted granted Critical
Publication of FR2312172B1 publication Critical patent/FR2312172B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H10W70/698—
    • H10W70/611—
    • H10W90/00—
    • H10W90/401—
    • H10W72/07251—
    • H10W72/20—
FR7610362A 1975-05-22 1976-04-01 Procede de fabrication d'ensembles de circuits integres Granted FR2312172A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US58012175A 1975-05-22 1975-05-22

Publications (2)

Publication Number Publication Date
FR2312172A1 FR2312172A1 (fr) 1976-12-17
FR2312172B1 true FR2312172B1 (enExample) 1979-04-20

Family

ID=24319801

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7610362A Granted FR2312172A1 (fr) 1975-05-22 1976-04-01 Procede de fabrication d'ensembles de circuits integres

Country Status (2)

Country Link
DE (1) DE2615758A1 (enExample)
FR (1) FR2312172A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4257668A (en) * 1979-01-02 1981-03-24 Gte Automatic Electric Laboratories, Inc. Edge clip terminal for mounting thick film hybrid circuits in printed circuit boards
GB2194388A (en) * 1986-08-20 1988-03-02 Plessey Co Plc Integrated circuit devices
FR2666173A1 (fr) * 1990-08-21 1992-02-28 Thomson Csf Structure hybride d'interconnexion de circuits integres et procede de fabrication.
US5367764A (en) * 1991-12-31 1994-11-29 Tessera, Inc. Method of making a multi-layer circuit assembly
US5282312A (en) * 1991-12-31 1994-02-01 Tessera, Inc. Multi-layer circuit construction methods with customization features
EP0834921B1 (en) * 1991-12-31 2003-11-26 Tessera, Inc. Multi-layer circuit construction method and structures with customization features and components for use therein
US5861666A (en) * 1995-08-30 1999-01-19 Tessera, Inc. Stacked chip assembly
US7149095B2 (en) 1996-12-13 2006-12-12 Tessera, Inc. Stacked microelectronic assemblies
US6225688B1 (en) 1997-12-11 2001-05-01 Tessera, Inc. Stacked microelectronic assembly and method therefor
US6121676A (en) * 1996-12-13 2000-09-19 Tessera, Inc. Stacked microelectronic assembly and method therefor

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3262023A (en) * 1964-03-19 1966-07-19 Int Resistance Co Electrical circuit assembly having wafers mounted in stacked relation
DE1591501A1 (de) * 1967-06-06 1970-02-26 Siemens Ag Integrierter Halbleiterschaltkreis

Also Published As

Publication number Publication date
FR2312172A1 (fr) 1976-12-17
DE2615758A1 (de) 1977-01-20

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Legal Events

Date Code Title Description
ST Notification of lapse