FR2312172B1 - - Google Patents

Info

Publication number
FR2312172B1
FR2312172B1 FR7610362A FR7610362A FR2312172B1 FR 2312172 B1 FR2312172 B1 FR 2312172B1 FR 7610362 A FR7610362 A FR 7610362A FR 7610362 A FR7610362 A FR 7610362A FR 2312172 B1 FR2312172 B1 FR 2312172B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7610362A
Other languages
French (fr)
Other versions
FR2312172A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of FR2312172A1 publication Critical patent/FR2312172A1/fr
Application granted granted Critical
Publication of FR2312172B1 publication Critical patent/FR2312172B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/147—Semiconductor insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • H01L25/0652—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00 the devices being arranged next and on each other, i.e. mixed assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Multi-Conductor Connections (AREA)
FR7610362A 1975-05-22 1976-04-01 Procede de fabrication d'ensembles de circuits integres Granted FR2312172A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US58012175A 1975-05-22 1975-05-22

Publications (2)

Publication Number Publication Date
FR2312172A1 FR2312172A1 (fr) 1976-12-17
FR2312172B1 true FR2312172B1 (enrdf_load_stackoverflow) 1979-04-20

Family

ID=24319801

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7610362A Granted FR2312172A1 (fr) 1975-05-22 1976-04-01 Procede de fabrication d'ensembles de circuits integres

Country Status (2)

Country Link
DE (1) DE2615758A1 (enrdf_load_stackoverflow)
FR (1) FR2312172A1 (enrdf_load_stackoverflow)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4257668A (en) * 1979-01-02 1981-03-24 Gte Automatic Electric Laboratories, Inc. Edge clip terminal for mounting thick film hybrid circuits in printed circuit boards
GB2194388A (en) * 1986-08-20 1988-03-02 Plessey Co Plc Integrated circuit devices
FR2666173A1 (fr) * 1990-08-21 1992-02-28 Thomson Csf Structure hybride d'interconnexion de circuits integres et procede de fabrication.
US5367764A (en) * 1991-12-31 1994-11-29 Tessera, Inc. Method of making a multi-layer circuit assembly
JP3472299B2 (ja) * 1991-12-31 2003-12-02 テッセラ、インク． 多層回路ユニットの製造方法及びその構成要素
US5282312A (en) * 1991-12-31 1994-02-01 Tessera, Inc. Multi-layer circuit construction methods with customization features
US5861666A (en) * 1995-08-30 1999-01-19 Tessera, Inc. Stacked chip assembly
US6225688B1 (en) 1997-12-11 2001-05-01 Tessera, Inc. Stacked microelectronic assembly and method therefor
US7149095B2 (en) 1996-12-13 2006-12-12 Tessera, Inc. Stacked microelectronic assemblies
US6121676A (en) * 1996-12-13 2000-09-19 Tessera, Inc. Stacked microelectronic assembly and method therefor

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3262023A (en) * 1964-03-19 1966-07-19 Int Resistance Co Electrical circuit assembly having wafers mounted in stacked relation
DE1591501A1 (de) * 1967-06-06 1970-02-26 Siemens Ag Integrierter Halbleiterschaltkreis

Also Published As

Publication number Publication date
DE2615758A1 (de) 1977-01-20
FR2312172A1 (fr) 1976-12-17

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Legal Events

Date Code Title Description
ST Notification of lapse