FR2311406B1 - - Google Patents

Info

Publication number
FR2311406B1
FR2311406B1 FR7514872A FR7514872A FR2311406B1 FR 2311406 B1 FR2311406 B1 FR 2311406B1 FR 7514872 A FR7514872 A FR 7514872A FR 7514872 A FR7514872 A FR 7514872A FR 2311406 B1 FR2311406 B1 FR 2311406B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7514872A
Other languages
French (fr)
Other versions
FR2311406A1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bull SA
Original Assignee
Societe Industrielle Honeywell Bull
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Societe Industrielle Honeywell Bull filed Critical Societe Industrielle Honeywell Bull
Priority to FR7514872A priority Critical patent/FR2311406A1/en
Priority to US05/680,749 priority patent/US4038744A/en
Priority to GB17133/76A priority patent/GB1523225A/en
Priority to SE7605080A priority patent/SE406248B/en
Priority to JP51052882A priority patent/JPS51139777A/en
Priority to DE19762620998 priority patent/DE2620998A1/en
Publication of FR2311406A1 publication Critical patent/FR2311406A1/en
Application granted granted Critical
Publication of FR2311406B1 publication Critical patent/FR2311406B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
FR7514872A 1975-05-13 1975-05-13 IMPROVEMENTS IN THE MANUFACTURING METHODS OF PACKAGING SUPPORTS FOR MICRO-PLATELETS OF INTEGRATED CIRCUITS Granted FR2311406A1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
FR7514872A FR2311406A1 (en) 1975-05-13 1975-05-13 IMPROVEMENTS IN THE MANUFACTURING METHODS OF PACKAGING SUPPORTS FOR MICRO-PLATELETS OF INTEGRATED CIRCUITS
US05/680,749 US4038744A (en) 1975-05-13 1976-04-27 Methods of manufacturing carrier supports for integrated chips and mounting of integrated circuit chips to a substrate
GB17133/76A GB1523225A (en) 1975-05-13 1976-04-27 Methods of manufacturing carrier supports for integrated circuit chips
SE7605080A SE406248B (en) 1975-05-13 1976-05-04 SET TO PROVIDE A TREATMENT STAND FOR MICRO-PLATER WITH INTEGRATED CIRCUITS WHICH ARE INTENDED TO FINALLY BE MOUNTED ON A SUBSTRATE
JP51052882A JPS51139777A (en) 1975-05-13 1976-05-11 Method of making carriers for integrated citcuits chip
DE19762620998 DE2620998A1 (en) 1975-05-13 1976-05-12 METHOD FOR MANUFACTURING CARRIERS FOR PROCESSING IC CHIPS

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7514872A FR2311406A1 (en) 1975-05-13 1975-05-13 IMPROVEMENTS IN THE MANUFACTURING METHODS OF PACKAGING SUPPORTS FOR MICRO-PLATELETS OF INTEGRATED CIRCUITS

Publications (2)

Publication Number Publication Date
FR2311406A1 FR2311406A1 (en) 1976-12-10
FR2311406B1 true FR2311406B1 (en) 1977-12-02

Family

ID=9155164

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7514872A Granted FR2311406A1 (en) 1975-05-13 1975-05-13 IMPROVEMENTS IN THE MANUFACTURING METHODS OF PACKAGING SUPPORTS FOR MICRO-PLATELETS OF INTEGRATED CIRCUITS

Country Status (6)

Country Link
US (1) US4038744A (en)
JP (1) JPS51139777A (en)
DE (1) DE2620998A1 (en)
FR (1) FR2311406A1 (en)
GB (1) GB1523225A (en)
SE (1) SE406248B (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2337381A1 (en) * 1975-12-31 1977-07-29 Honeywell Bull Soc Ind PORTABLE CARD FOR ELECTRICAL SIGNAL PROCESSING SYSTEM AND PROCESS FOR MANUFACTURING THIS CARD
CH623452B (en) * 1977-12-14 Fontainemelon Horlogerie METHOD OF MANUFACTURING AN ELECTRONIC CLOCK PART MODULE AND CLOCK PART MODULE OBTAINED BY IMPLEMENTATION OF THIS PROCESS.
US4209355A (en) * 1978-07-26 1980-06-24 National Semiconductor Corporation Manufacture of bumped composite tape for automatic gang bonding of semiconductor devices
US4399610A (en) * 1981-04-01 1983-08-23 Western Electric Company, Inc. Assembling an electronic device
FR2521350B1 (en) * 1982-02-05 1986-01-24 Hitachi Ltd SEMICONDUCTOR CHIP HOLDER
DE3377313D1 (en) * 1982-08-23 1988-08-11 Burroughs Corp Alpha-particle protection in integrated circuit packages
US4531285A (en) * 1983-03-21 1985-07-30 The United States Of America As Represented By The Secretary Of The Navy Method for interconnecting close lead center integrated circuit packages to boards
JPH0339746Y2 (en) * 1985-06-28 1991-08-21
DE3534502A1 (en) * 1985-09-27 1987-04-09 Licentia Gmbh METHOD FOR PRODUCING ADHESIVE CONTACT
JPS6413600U (en) * 1987-07-17 1989-01-24
JPH0266480A (en) * 1988-08-31 1990-03-06 Murata Mfg Co Ltd Method for assembling and mounting sensor element
AU7954491A (en) * 1990-05-14 1991-12-10 Richard Lee Schendelman Interdigitated trans-die lead construction and method of construction for maximizing population density of chip-on-board construction
US5152056A (en) * 1991-08-27 1992-10-06 Sun Microsystems, Inc. Method for replacing tape automated bonding components on a printed circuit board
US5686352A (en) * 1993-07-26 1997-11-11 Motorola Inc. Method for making a tab semiconductor device with self-aligning cavity and intrinsic standoff

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE787379A (en) * 1971-08-10 1973-02-09 Merck & Co Inc ENZYMES FOR HYGIENE OF THE MOUTH AND METHOD FOR PREPARING THESE ENZYMES
US3868724A (en) * 1973-11-21 1975-02-25 Fairchild Camera Instr Co Multi-layer connecting structures for packaging semiconductor devices mounted on a flexible carrier

Also Published As

Publication number Publication date
SE7605080L (en) 1976-11-14
JPS5750072B2 (en) 1982-10-25
JPS51139777A (en) 1976-12-02
DE2620998A1 (en) 1976-11-25
FR2311406A1 (en) 1976-12-10
SE406248B (en) 1979-01-29
US4038744A (en) 1977-08-02
GB1523225A (en) 1978-08-31

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