FR2304176A1 - Procede et dispositif de soudage par immersion de composants a semi-conducteurs - Google Patents

Procede et dispositif de soudage par immersion de composants a semi-conducteurs

Info

Publication number
FR2304176A1
FR2304176A1 FR7607283A FR7607283A FR2304176A1 FR 2304176 A1 FR2304176 A1 FR 2304176A1 FR 7607283 A FR7607283 A FR 7607283A FR 7607283 A FR7607283 A FR 7607283A FR 2304176 A1 FR2304176 A1 FR 2304176A1
Authority
FR
France
Prior art keywords
semiconductor components
immersion welding
immersion
welding
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7607283A
Other languages
English (en)
French (fr)
Other versions
FR2304176B1 (US20090192370A1-20090730-C00001.png
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Switzerland
BBC Brown Boveri AG Germany
Original Assignee
BBC Brown Boveri AG Switzerland
BBC Brown Boveri AG Germany
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC Brown Boveri AG Switzerland, BBC Brown Boveri AG Germany filed Critical BBC Brown Boveri AG Switzerland
Publication of FR2304176A1 publication Critical patent/FR2304176A1/fr
Application granted granted Critical
Publication of FR2304176B1 publication Critical patent/FR2304176B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coating With Molten Metal (AREA)
  • Molten Solder (AREA)
  • Die Bonding (AREA)
FR7607283A 1975-03-14 1976-03-12 Procede et dispositif de soudage par immersion de composants a semi-conducteurs Granted FR2304176A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2511210A DE2511210C3 (de) 1975-03-14 1975-03-14 Verfahren und Vorrichtung zum Tauchlöten von Halbleiterbauelementen

Publications (2)

Publication Number Publication Date
FR2304176A1 true FR2304176A1 (fr) 1976-10-08
FR2304176B1 FR2304176B1 (US20090192370A1-20090730-C00001.png) 1979-08-24

Family

ID=5941404

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7607283A Granted FR2304176A1 (fr) 1975-03-14 1976-03-12 Procede et dispositif de soudage par immersion de composants a semi-conducteurs

Country Status (5)

Country Link
US (1) US4019671A (US20090192370A1-20090730-C00001.png)
JP (1) JPS51115772A (US20090192370A1-20090730-C00001.png)
CH (1) CH596736A5 (US20090192370A1-20090730-C00001.png)
DE (1) DE2511210C3 (US20090192370A1-20090730-C00001.png)
FR (1) FR2304176A1 (US20090192370A1-20090730-C00001.png)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5731195A (en) * 1980-08-01 1982-02-19 Aiwa Co Method of soldering leadless electric part
US4475682A (en) * 1982-05-04 1984-10-09 The United States Of America As Represented By The United States Department Of Energy Process for reducing series resistance of solar cell metal contact systems with a soldering flux etchant
IT1210953B (it) * 1982-11-19 1989-09-29 Ates Componenti Elettron Metodo per la saldatura di piastrine di semiconduttore su supporti di metallo non nobile.
US4538757A (en) * 1983-08-01 1985-09-03 Motorola, Inc. Wave soldering in a reducing atmosphere
DE3628569A1 (de) * 1986-08-22 1988-02-25 Philips Patentverwaltung Verfahren zum verloeten von elektrischen schaltungsplatten und vorrichtung zur durchfuehrung dieses verfahrens
NL8701237A (nl) * 1987-05-22 1988-12-16 Soltec Bv Inrichting voor het aanbrengen van geleidend hechtmiddel, zoals soldeer, op een kaart met bedrukte bedrading.
DE4041272C2 (de) * 1990-12-21 1996-12-05 Siemens Ag Wellenlötvorrichtung
US5230462A (en) * 1992-07-08 1993-07-27 Materials Research Corporation Method of soldering a sputtering target to a backing member
DE10108023C2 (de) * 2001-02-19 2003-04-17 Air Liquide Gmbh Verfahren zum Löten unter einer Schutzgasatmosphäre und Lötvorrichtung
NL1017843C2 (nl) * 2001-04-12 2002-10-22 Vitronics Soltec B V Inrichting voor selectief solderen.
US8205784B1 (en) * 2011-04-29 2012-06-26 Trane International Inc. Systems and methods for joining metal
DE102020007704A1 (de) * 2020-12-16 2022-06-23 Amsel-Advanced Materials and Surfaces for Environment and Life GmbH Verfahren und Vorrichtung zum Reduzieren von Oberflächen sowie Verwendung des Verfahrens

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB567286A (en) * 1941-10-01 1945-02-07 John Louis Coltman Improvements in or relating to the manufacture of heat exchange devices
DE1235713B (de) * 1965-09-02 1967-03-02 Siemens Ag Vorrichtung zum Tauchloeten elektrischer Anschluesse
DE1514561A1 (de) * 1965-09-06 1969-06-26 Siemens Ag Verfahren zum serienmaessigen Herstellen von Halbleiterbauelementen
CH512823A (de) * 1970-01-30 1971-09-15 Siemens Ag Verfahren zum Herstellen eines Halbleiterbauelementes

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB567286A (en) * 1941-10-01 1945-02-07 John Louis Coltman Improvements in or relating to the manufacture of heat exchange devices
DE1235713B (de) * 1965-09-02 1967-03-02 Siemens Ag Vorrichtung zum Tauchloeten elektrischer Anschluesse
DE1514561A1 (de) * 1965-09-06 1969-06-26 Siemens Ag Verfahren zum serienmaessigen Herstellen von Halbleiterbauelementen
CH512823A (de) * 1970-01-30 1971-09-15 Siemens Ag Verfahren zum Herstellen eines Halbleiterbauelementes

Also Published As

Publication number Publication date
CH596736A5 (US20090192370A1-20090730-C00001.png) 1978-03-15
DE2511210C3 (de) 1980-03-06
FR2304176B1 (US20090192370A1-20090730-C00001.png) 1979-08-24
US4019671A (en) 1977-04-26
DE2511210A1 (de) 1976-09-23
JPS51115772A (en) 1976-10-12
DE2511210B2 (de) 1979-06-28

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Legal Events

Date Code Title Description
ST Notification of lapse