FR2288396A1 - Heat pipe cooled semiconductor device - has unitary arrangement of semiconductor and evaporation surface free of boundary layer pressure - Google Patents

Heat pipe cooled semiconductor device - has unitary arrangement of semiconductor and evaporation surface free of boundary layer pressure

Info

Publication number
FR2288396A1
FR2288396A1 FR7434969A FR7434969A FR2288396A1 FR 2288396 A1 FR2288396 A1 FR 2288396A1 FR 7434969 A FR7434969 A FR 7434969A FR 7434969 A FR7434969 A FR 7434969A FR 2288396 A1 FR2288396 A1 FR 2288396A1
Authority
FR
France
Prior art keywords
cup
shaped elements
semiconductor
boundary layer
heat pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7434969A
Other languages
French (fr)
Inventor
Steven Joseph Brzozowski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Priority to FR7434969A priority Critical patent/FR2288396A1/en
Publication of FR2288396A1 publication Critical patent/FR2288396A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The device contains a power semiconductor with two parallel main surfaces and two thin, cup-shaped elements, whose outer bottom surfaces are each coupled to the semiconductor surfaces, this connection providing pressure-free boundary layer. The cup-shaped elements are of electrically and thermally conductive material. Along the outer walls of the cup-shaped elements is mounted a creep path extending device, having a thermal density of at least 3.5. W per surface sq.cm. One of the cup-shaped elements closes an open evaporation section end of a long heat tube, to which it is connected via high-pressure free members along its side wall part. The inner bottom surface of the element forms the evaporation surface in the heat tube.
FR7434969A 1974-10-17 1974-10-17 Heat pipe cooled semiconductor device - has unitary arrangement of semiconductor and evaporation surface free of boundary layer pressure Withdrawn FR2288396A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7434969A FR2288396A1 (en) 1974-10-17 1974-10-17 Heat pipe cooled semiconductor device - has unitary arrangement of semiconductor and evaporation surface free of boundary layer pressure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7434969A FR2288396A1 (en) 1974-10-17 1974-10-17 Heat pipe cooled semiconductor device - has unitary arrangement of semiconductor and evaporation surface free of boundary layer pressure

Publications (1)

Publication Number Publication Date
FR2288396A1 true FR2288396A1 (en) 1976-05-14

Family

ID=9144222

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7434969A Withdrawn FR2288396A1 (en) 1974-10-17 1974-10-17 Heat pipe cooled semiconductor device - has unitary arrangement of semiconductor and evaporation surface free of boundary layer pressure

Country Status (1)

Country Link
FR (1) FR2288396A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2428916A1 (en) * 1977-06-13 1980-01-11 Gen Electric COOLING DEVICE FOR ELECTRONIC POWER COMPONENTS
FR2547906A1 (en) * 1983-03-24 1984-12-28 Uop Inc Enhanced nucleate boiling carrier

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2428916A1 (en) * 1977-06-13 1980-01-11 Gen Electric COOLING DEVICE FOR ELECTRONIC POWER COMPONENTS
FR2547906A1 (en) * 1983-03-24 1984-12-28 Uop Inc Enhanced nucleate boiling carrier

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Legal Events

Date Code Title Description
ST Notification of lapse