FR2284686B1 - - Google Patents
Info
- Publication number
- FR2284686B1 FR2284686B1 FR7521481A FR7521481A FR2284686B1 FR 2284686 B1 FR2284686 B1 FR 2284686B1 FR 7521481 A FR7521481 A FR 7521481A FR 7521481 A FR7521481 A FR 7521481A FR 2284686 B1 FR2284686 B1 FR 2284686B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
-
- H10P95/00—
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/505,699 US3951710A (en) | 1974-09-13 | 1974-09-13 | Method for removing copper contaminant from semiconductor surfaces |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2284686A1 FR2284686A1 (fr) | 1976-04-09 |
| FR2284686B1 true FR2284686B1 (enExample) | 1980-04-11 |
Family
ID=24011449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7521481A Granted FR2284686A1 (fr) | 1974-09-13 | 1975-07-03 | Procede pour enlever les impuretes de cuivre des surfaces de semi-conducteurs |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3951710A (enExample) |
| JP (1) | JPS5143073A (enExample) |
| DE (1) | DE2532902A1 (enExample) |
| FR (1) | FR2284686A1 (enExample) |
| GB (1) | GB1501477A (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4255348A (en) * | 1979-10-24 | 1981-03-10 | Union Carbide Corporation | Preparation of dimethylaminosilanes |
| US4747907A (en) * | 1986-10-29 | 1988-05-31 | International Business Machines Corporation | Metal etching process with etch rate enhancement |
| DE3728693A1 (de) * | 1987-08-27 | 1989-03-09 | Wacker Chemitronic | Verfahren und vorrichtung zum aetzen von halbleiteroberflaechen |
| US5399528A (en) * | 1989-06-01 | 1995-03-21 | Leibovitz; Jacques | Multi-layer fabrication in integrated circuit systems |
| US5244000A (en) * | 1991-11-13 | 1993-09-14 | Hughes Aircraft Company | Method and system for removing contaminants |
| US5527423A (en) * | 1994-10-06 | 1996-06-18 | Cabot Corporation | Chemical mechanical polishing slurry for metal layers |
| JP3219142B2 (ja) * | 1997-12-17 | 2001-10-15 | 信越半導体株式会社 | 半導体シリコンウエーハ研磨用研磨剤及び研磨方法 |
| US5897379A (en) * | 1997-12-19 | 1999-04-27 | Sharp Microelectronics Technology, Inc. | Low temperature system and method for CVD copper removal |
| US6083840A (en) * | 1998-11-25 | 2000-07-04 | Arch Specialty Chemicals, Inc. | Slurry compositions and method for the chemical-mechanical polishing of copper and copper alloys |
| US6339022B1 (en) | 1999-12-30 | 2002-01-15 | International Business Machines Corporation | Method of annealing copper metallurgy |
| US6797623B2 (en) * | 2000-03-09 | 2004-09-28 | Sony Corporation | Methods of producing and polishing semiconductor device and polishing apparatus |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2647830A (en) * | 1949-12-17 | 1953-08-04 | Chemical Construction Corp | Preparation of pure copper metal from copper-bearing scrap |
| US2961354A (en) * | 1958-10-28 | 1960-11-22 | Bell Telephone Labor Inc | Surface treatment of semiconductive devices |
| US3413160A (en) * | 1965-10-24 | 1968-11-26 | Dow Chemical Co | Passivation of ferrous metal surface |
| US3436259A (en) * | 1966-05-12 | 1969-04-01 | Ibm | Method for plating and polishing a silicon planar surface |
| US3447965A (en) * | 1966-10-31 | 1969-06-03 | Dow Chemical Co | Removal of copper containing scale from ferrous surfaces |
| NL6807368A (enExample) * | 1967-07-05 | 1969-01-07 | ||
| US3600244A (en) * | 1969-02-20 | 1971-08-17 | Ibm | Process of etching metal with recovery or regeneration and recycling |
-
1974
- 1974-09-13 US US05/505,699 patent/US3951710A/en not_active Expired - Lifetime
-
1975
- 1975-07-03 FR FR7521481A patent/FR2284686A1/fr active Granted
- 1975-07-23 DE DE19752532902 patent/DE2532902A1/de not_active Withdrawn
- 1975-08-01 GB GB32180/75A patent/GB1501477A/en not_active Expired
- 1975-08-13 JP JP50097681A patent/JPS5143073A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5143073A (enExample) | 1976-04-13 |
| FR2284686A1 (fr) | 1976-04-09 |
| DE2532902A1 (de) | 1976-04-01 |
| GB1501477A (en) | 1978-02-15 |
| US3951710A (en) | 1976-04-20 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |