FR2284686A1 - Procede pour enlever les impuretes de cuivre des surfaces de semi-conducteurs - Google Patents

Procede pour enlever les impuretes de cuivre des surfaces de semi-conducteurs

Info

Publication number
FR2284686A1
FR2284686A1 FR7521481A FR7521481A FR2284686A1 FR 2284686 A1 FR2284686 A1 FR 2284686A1 FR 7521481 A FR7521481 A FR 7521481A FR 7521481 A FR7521481 A FR 7521481A FR 2284686 A1 FR2284686 A1 FR 2284686A1
Authority
FR
France
Prior art keywords
semiconductor surfaces
removing copper
copper impurities
impurities
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7521481A
Other languages
English (en)
Other versions
FR2284686B1 (fr
Inventor
Jagtar Singh Basi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of FR2284686A1 publication Critical patent/FR2284686A1/fr
Application granted granted Critical
Publication of FR2284686B1 publication Critical patent/FR2284686B1/fr
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/46—Regeneration of etching compositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
FR7521481A 1974-09-13 1975-07-03 Procede pour enlever les impuretes de cuivre des surfaces de semi-conducteurs Granted FR2284686A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/505,699 US3951710A (en) 1974-09-13 1974-09-13 Method for removing copper contaminant from semiconductor surfaces

Publications (2)

Publication Number Publication Date
FR2284686A1 true FR2284686A1 (fr) 1976-04-09
FR2284686B1 FR2284686B1 (fr) 1980-04-11

Family

ID=24011449

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7521481A Granted FR2284686A1 (fr) 1974-09-13 1975-07-03 Procede pour enlever les impuretes de cuivre des surfaces de semi-conducteurs

Country Status (5)

Country Link
US (1) US3951710A (fr)
JP (1) JPS5143073A (fr)
DE (1) DE2532902A1 (fr)
FR (1) FR2284686A1 (fr)
GB (1) GB1501477A (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4255348A (en) * 1979-10-24 1981-03-10 Union Carbide Corporation Preparation of dimethylaminosilanes
US4747907A (en) * 1986-10-29 1988-05-31 International Business Machines Corporation Metal etching process with etch rate enhancement
DE3728693A1 (de) * 1987-08-27 1989-03-09 Wacker Chemitronic Verfahren und vorrichtung zum aetzen von halbleiteroberflaechen
US5399528A (en) * 1989-06-01 1995-03-21 Leibovitz; Jacques Multi-layer fabrication in integrated circuit systems
US5244000A (en) * 1991-11-13 1993-09-14 Hughes Aircraft Company Method and system for removing contaminants
US5527423A (en) * 1994-10-06 1996-06-18 Cabot Corporation Chemical mechanical polishing slurry for metal layers
JP3219142B2 (ja) * 1997-12-17 2001-10-15 信越半導体株式会社 半導体シリコンウエーハ研磨用研磨剤及び研磨方法
US5897379A (en) * 1997-12-19 1999-04-27 Sharp Microelectronics Technology, Inc. Low temperature system and method for CVD copper removal
US6083840A (en) * 1998-11-25 2000-07-04 Arch Specialty Chemicals, Inc. Slurry compositions and method for the chemical-mechanical polishing of copper and copper alloys
US6339022B1 (en) 1999-12-30 2002-01-15 International Business Machines Corporation Method of annealing copper metallurgy
US6797623B2 (en) * 2000-03-09 2004-09-28 Sony Corporation Methods of producing and polishing semiconductor device and polishing apparatus

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2647830A (en) * 1949-12-17 1953-08-04 Chemical Construction Corp Preparation of pure copper metal from copper-bearing scrap
US2961354A (en) * 1958-10-28 1960-11-22 Bell Telephone Labor Inc Surface treatment of semiconductive devices
US3413160A (en) * 1965-10-24 1968-11-26 Dow Chemical Co Passivation of ferrous metal surface
US3436259A (en) * 1966-05-12 1969-04-01 Ibm Method for plating and polishing a silicon planar surface
US3447965A (en) * 1966-10-31 1969-06-03 Dow Chemical Co Removal of copper containing scale from ferrous surfaces
NL6807368A (fr) * 1967-07-05 1969-01-07
US3600244A (en) * 1969-02-20 1971-08-17 Ibm Process of etching metal with recovery or regeneration and recycling

Also Published As

Publication number Publication date
US3951710A (en) 1976-04-20
DE2532902A1 (de) 1976-04-01
GB1501477A (en) 1978-02-15
JPS5143073A (fr) 1976-04-13
FR2284686B1 (fr) 1980-04-11

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Legal Events

Date Code Title Description
ST Notification of lapse