FR2276395A1 - Bains d'electroplacage non cyanures ameliores - Google Patents

Bains d'electroplacage non cyanures ameliores

Info

Publication number
FR2276395A1
FR2276395A1 FR7422110A FR7422110A FR2276395A1 FR 2276395 A1 FR2276395 A1 FR 2276395A1 FR 7422110 A FR7422110 A FR 7422110A FR 7422110 A FR7422110 A FR 7422110A FR 2276395 A1 FR2276395 A1 FR 2276395A1
Authority
FR
France
Prior art keywords
oxidising agent
electroplating bath
improve brightness
cyanide free
containing phosphonate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7422110A
Other languages
English (en)
Other versions
FR2276395B1 (fr
Inventor
Fred I Nobel
Lazaro C Yoen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
LeaRonal Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LeaRonal Inc filed Critical LeaRonal Inc
Priority to FR7422110A priority Critical patent/FR2276395A1/fr
Publication of FR2276395A1 publication Critical patent/FR2276395A1/fr
Application granted granted Critical
Publication of FR2276395B1 publication Critical patent/FR2276395B1/fr
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Removal Of Specific Substances (AREA)
FR7422110A 1974-06-25 1974-06-25 Bains d'electroplacage non cyanures ameliores Granted FR2276395A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7422110A FR2276395A1 (fr) 1974-06-25 1974-06-25 Bains d'electroplacage non cyanures ameliores

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7422110A FR2276395A1 (fr) 1974-06-25 1974-06-25 Bains d'electroplacage non cyanures ameliores

Publications (2)

Publication Number Publication Date
FR2276395A1 true FR2276395A1 (fr) 1976-01-23
FR2276395B1 FR2276395B1 (fr) 1978-05-26

Family

ID=9140499

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7422110A Granted FR2276395A1 (fr) 1974-06-25 1974-06-25 Bains d'electroplacage non cyanures ameliores

Country Status (1)

Country Link
FR (1) FR2276395A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001020647A2 (fr) * 1999-09-17 2001-03-22 Nutool, Inc. Nouveaux procedes et nouvelles structures d'interconnexion de puce et de depot sur un boitier

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6921551B2 (en) 2000-08-10 2005-07-26 Asm Nutool, Inc. Plating method and apparatus for controlling deposition on predetermined portions of a workpiece
US8500985B2 (en) 2006-07-21 2013-08-06 Novellus Systems, Inc. Photoresist-free metal deposition

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NEANT *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001020647A2 (fr) * 1999-09-17 2001-03-22 Nutool, Inc. Nouveaux procedes et nouvelles structures d'interconnexion de puce et de depot sur un boitier
WO2001020647A3 (fr) * 1999-09-17 2002-01-17 Nutool Inc Nouveaux procedes et nouvelles structures d'interconnexion de puce et de depot sur un boitier
US6355153B1 (en) 1999-09-17 2002-03-12 Nutool, Inc. Chip interconnect and packaging deposition methods and structures
US7147766B2 (en) 1999-09-17 2006-12-12 Asm Nutool, Inc. Chip interconnect and packaging deposition methods and structures

Also Published As

Publication number Publication date
FR2276395B1 (fr) 1978-05-26

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Legal Events

Date Code Title Description
ST Notification of lapse