FR2256537B1 - - Google Patents

Info

Publication number
FR2256537B1
FR2256537B1 FR7439711A FR7439711A FR2256537B1 FR 2256537 B1 FR2256537 B1 FR 2256537B1 FR 7439711 A FR7439711 A FR 7439711A FR 7439711 A FR7439711 A FR 7439711A FR 2256537 B1 FR2256537 B1 FR 2256537B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7439711A
Other versions
FR2256537A1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of FR2256537A1 publication Critical patent/FR2256537A1/fr
Application granted granted Critical
Publication of FR2256537B1 publication Critical patent/FR2256537B1/fr
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/762Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76297Dielectric isolation using EPIC techniques, i.e. epitaxial passivated integrated circuit
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604Chemical etching

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Element Separation (AREA)
  • Weting (AREA)
  • Bipolar Transistors (AREA)
  • Semiconductor Integrated Circuits (AREA)
FR7439711A 1973-12-28 1974-12-04 Expired FR2256537B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US42922873A 1973-12-28 1973-12-28

Publications (2)

Publication Number Publication Date
FR2256537A1 FR2256537A1 (fr) 1975-07-25
FR2256537B1 true FR2256537B1 (fr) 1979-03-16

Family

ID=23702356

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7439711A Expired FR2256537B1 (fr) 1973-12-28 1974-12-04

Country Status (4)

Country Link
JP (1) JPS5828731B2 (fr)
DE (1) DE2460653C2 (fr)
FR (1) FR2256537B1 (fr)
GB (1) GB1494328A (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54110783A (en) * 1978-02-20 1979-08-30 Hitachi Ltd Semiconductor substrate and its manufacture
DE3300400A1 (de) 1982-01-06 1983-07-14 Canon K.K., Tokyo Halbleiterbauelement
JPS6066825A (ja) * 1983-09-22 1985-04-17 Toshiba Corp 半導体装置の製造方法
US5416354A (en) * 1989-01-06 1995-05-16 Unitrode Corporation Inverted epitaxial process semiconductor devices
DE3922671A1 (de) * 1989-07-10 1991-01-24 Siemens Ag Akustoelektronisches bauelement mit einer oberflaechenwellenanordnung und einer elektronischen halbleiterschaltung

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4936792B1 (fr) * 1970-10-15 1974-10-03

Also Published As

Publication number Publication date
JPS5828731B2 (ja) 1983-06-17
DE2460653A1 (de) 1975-07-10
DE2460653C2 (de) 1986-02-06
JPS5099272A (fr) 1975-08-06
GB1494328A (en) 1977-12-07
FR2256537A1 (fr) 1975-07-25

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