FR2252390A1 - Polishing semi-conductor surfaces - with aq. suspension contg. zirconium silicate, sodium hypochlorite and pref sodium metasilicate - Google Patents

Polishing semi-conductor surfaces - with aq. suspension contg. zirconium silicate, sodium hypochlorite and pref sodium metasilicate

Info

Publication number
FR2252390A1
FR2252390A1 FR7438639A FR7438639A FR2252390A1 FR 2252390 A1 FR2252390 A1 FR 2252390A1 FR 7438639 A FR7438639 A FR 7438639A FR 7438639 A FR7438639 A FR 7438639A FR 2252390 A1 FR2252390 A1 FR 2252390A1
Authority
FR
France
Prior art keywords
pref
polishing
suspension
esp
semi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7438639A
Other languages
English (en)
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NL Industries Inc
Original Assignee
NL Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NL Industries Inc filed Critical NL Industries Inc
Publication of FR2252390A1 publication Critical patent/FR2252390A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
FR7438639A 1973-11-26 1974-11-25 Polishing semi-conductor surfaces - with aq. suspension contg. zirconium silicate, sodium hypochlorite and pref sodium metasilicate Withdrawn FR2252390A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US41922073A 1973-11-26 1973-11-26

Publications (1)

Publication Number Publication Date
FR2252390A1 true FR2252390A1 (en) 1975-06-20

Family

ID=23661310

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7438639A Withdrawn FR2252390A1 (en) 1973-11-26 1974-11-25 Polishing semi-conductor surfaces - with aq. suspension contg. zirconium silicate, sodium hypochlorite and pref sodium metasilicate

Country Status (3)

Country Link
JP (1) JPS5084988A (cg-RX-API-DMAC7.html)
DE (1) DE2454802A1 (cg-RX-API-DMAC7.html)
FR (1) FR2252390A1 (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4057939A (en) * 1975-12-05 1977-11-15 International Business Machines Corporation Silicon wafer polishing
DE3237235C2 (de) * 1982-10-07 1986-07-10 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen Verfahren zum Polieren von III-V-Halbleiteroberflächen
JPS61192783A (ja) * 1985-02-22 1986-08-27 Lion Corp 清掃研摩基材

Also Published As

Publication number Publication date
DE2454802A1 (de) 1975-05-28
JPS5084988A (cg-RX-API-DMAC7.html) 1975-07-09

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Legal Events

Date Code Title Description
RE Withdrawal of published application