FR2243045A1 - - Google Patents

Info

Publication number
FR2243045A1
FR2243045A1 FR7430363A FR7430363A FR2243045A1 FR 2243045 A1 FR2243045 A1 FR 2243045A1 FR 7430363 A FR7430363 A FR 7430363A FR 7430363 A FR7430363 A FR 7430363A FR 2243045 A1 FR2243045 A1 FR 2243045A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7430363A
Other languages
French (fr)
Other versions
FR2243045B1 (ru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US395310A external-priority patent/US3866307A/en
Priority claimed from US476343A external-priority patent/US3904102A/en
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of FR2243045A1 publication Critical patent/FR2243045A1/fr
Application granted granted Critical
Publication of FR2243045B1 publication Critical patent/FR2243045B1/fr
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/012Soldering with the use of hot gas
    • B23K1/015Vapour-condensation soldering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/08Soldering by means of dipping in molten solder
    • B23K1/085Wave soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
FR7430363A 1973-09-07 1974-09-06 Expired FR2243045B1 (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US395310A US3866307A (en) 1973-09-07 1973-09-07 Method for soldering, fusing or brazing
US476343A US3904102A (en) 1974-06-05 1974-06-05 Apparatus and method for soldering, fusing or brazing

Publications (2)

Publication Number Publication Date
FR2243045A1 true FR2243045A1 (ru) 1975-04-04
FR2243045B1 FR2243045B1 (ru) 1979-08-03

Family

ID=27015058

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7430363A Expired FR2243045B1 (ru) 1973-09-07 1974-09-06

Country Status (10)

Country Link
JP (1) JPS5340934B2 (ru)
AU (1) AU7293274A (ru)
BR (1) BR7407403D0 (ru)
DE (1) DE2442180C3 (ru)
ES (1) ES449417A1 (ru)
FR (1) FR2243045B1 (ru)
GB (1) GB1484604A (ru)
IT (1) IT1020737B (ru)
NL (1) NL163732C (ru)
SE (1) SE424518B (ru)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0000284A1 (en) * 1977-07-01 1979-01-10 Western Electric Company, Incorporated Process and apparatus for reflowing solder of solder plated substrates and substrates formed thereby
FR2507918A1 (fr) * 1981-06-23 1982-12-24 Htc Corp Appareil de traitement continu a la vapeur, par exemple pour souder ou degraisser des pieces a la vapeur
FR2537912A1 (en) * 1982-12-21 1984-06-22 Annemasse Ultrasons Process for stabilising, in a steady state, the separation front between an upper vapour region and a lower vapour region which are created in an apparatus comprising a vessel, apparatus making use of the said process and use of the said apparatus
EP0138707A1 (fr) * 1983-10-11 1985-04-24 Piezo-Ceram Electronique Machine perfectionnée de chauffage d'un article ou produit par condensation de vapeur sur celui-ci
EP0148650A1 (en) * 1983-11-28 1985-07-17 The HTC Corporation Apparatus for solder removal
FR2564763A1 (fr) * 1984-05-25 1985-11-29 Htc Corp Appareil et procede de soudage, notamment pour circuits imprimes
EP0205309A1 (en) * 1985-06-08 1986-12-17 Nihon Den-Netsu Keiki Co., Ltd. Vapor phase soldering apparatus
WO1989010817A1 (en) * 1988-05-02 1989-11-16 Helmut Walter Leicht Device and process for treating objects in a gas-like or vapour-like medium, in particular for soldering objects in a vapour phase

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2120964A (en) * 1982-03-25 1983-12-14 Alpha Metals Processes of applying solder
DE3619964C1 (de) * 1986-06-13 1987-03-12 Heraeus Gmbh W C Vorrichtung zum Schmelzen eines Loetmittels durch Dampfphasenbehandlung
DE3813931C2 (de) * 1988-04-25 1995-05-04 Resma Gmbh Fuegetechnik Indust Schutzgaslötverfahren und Vorrichtung zur Ausführung dieses Verfahrens
DE3915040A1 (de) * 1989-05-08 1990-11-15 Helmut Walter Leicht Verfahren zum vorwaermen und/oder abkuehlen von gegenstaenden vor und/oder nach einer dampfphasenbehandlung
DE8913226U1 (de) * 1989-11-08 1989-12-21 Leicht, Helmut Walter, 8900 Augsburg Dampfphasenlötanlage mit einem direkt beheizbaren Behälter
DE4024181C1 (en) * 1990-07-30 1992-02-13 Siemens Nixdorf Informationssysteme Ag, 4790 Paderborn, De Vapour phase soldering installation - has valve in by=pass opening in dependence on preset temp. of sec. medium in soldering tank
DE4103098C1 (ru) * 1991-02-01 1992-06-25 Helmut Walter 8901 Koenigsbrunn De Leicht
DE4342634A1 (de) * 1993-12-14 1995-06-22 Helmut Walter Leicht Vorrichtung zur Wärmeübertragung, insbesondere in einer Konvektionslötanlage
DE4432774C2 (de) * 1994-09-15 2000-04-06 Fraunhofer Ges Forschung Verfahren zur Herstellung meniskusförmiger Lotbumps
DE19508402C2 (de) * 1995-03-09 1998-08-20 Helmut W Leicht Dampfphasen-Lötanlage
DE19519188C2 (de) * 1995-05-24 2001-06-28 Fraunhofer Ges Forschung Verfahren und Vorrichtung zum Wellen- und/oder Dampfphasenlöten elektronischer Baugruppen

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0000284A1 (en) * 1977-07-01 1979-01-10 Western Electric Company, Incorporated Process and apparatus for reflowing solder of solder plated substrates and substrates formed thereby
FR2507918A1 (fr) * 1981-06-23 1982-12-24 Htc Corp Appareil de traitement continu a la vapeur, par exemple pour souder ou degraisser des pieces a la vapeur
FR2537912A1 (en) * 1982-12-21 1984-06-22 Annemasse Ultrasons Process for stabilising, in a steady state, the separation front between an upper vapour region and a lower vapour region which are created in an apparatus comprising a vessel, apparatus making use of the said process and use of the said apparatus
EP0138707A1 (fr) * 1983-10-11 1985-04-24 Piezo-Ceram Electronique Machine perfectionnée de chauffage d'un article ou produit par condensation de vapeur sur celui-ci
WO1985001791A1 (fr) * 1983-10-11 1985-04-25 Piezo-Ceram Electronique Machine perfectionnee de chauffage d'un article ou produit par condensation de vapeur sur celui-ci
FR2556083A1 (fr) * 1983-10-11 1985-06-07 Piezo Ceram Electronique Machine perfectionnee de chauffage d'un article ou produit par condensation de vapeur sur celui-ci
US4612712A (en) * 1983-10-11 1986-09-23 Piezo-Ceram Electronique Machine for heating an article or product by vapor condensation
EP0148650A1 (en) * 1983-11-28 1985-07-17 The HTC Corporation Apparatus for solder removal
FR2564763A1 (fr) * 1984-05-25 1985-11-29 Htc Corp Appareil et procede de soudage, notamment pour circuits imprimes
EP0205309A1 (en) * 1985-06-08 1986-12-17 Nihon Den-Netsu Keiki Co., Ltd. Vapor phase soldering apparatus
WO1989010817A1 (en) * 1988-05-02 1989-11-16 Helmut Walter Leicht Device and process for treating objects in a gas-like or vapour-like medium, in particular for soldering objects in a vapour phase

Also Published As

Publication number Publication date
SE7410907L (ru) 1975-03-10
NL163732C (nl) 1980-10-15
BR7407403D0 (pt) 1975-09-09
DE2442180A1 (de) 1975-03-13
ES449417A1 (es) 1977-11-01
IT1020737B (it) 1977-12-30
GB1484604A (en) 1977-09-01
DE2442180B2 (de) 1979-04-26
NL7411686A (nl) 1975-03-11
DE2442180C3 (de) 1979-12-20
FR2243045B1 (ru) 1979-08-03
SE424518B (sv) 1982-07-26
AU7293274A (en) 1976-03-11
JPS5054552A (ru) 1975-05-14
JPS5340934B2 (ru) 1978-10-30

Similar Documents

Publication Publication Date Title
AR201758A1 (ru)
AU476761B2 (ru)
AU474593B2 (ru)
AU474511B2 (ru)
AU474838B2 (ru)
FR2243045B1 (ru)
AU465453B2 (ru)
AU471343B2 (ru)
AU466283B2 (ru)
AU476696B2 (ru)
AU472848B2 (ru)
AU477823B2 (ru)
AU471461B2 (ru)
AU476873B1 (ru)
AU477824B2 (ru)
AR200256A1 (ru)
JPS49111612U (ru)
BG25989A3 (ru)
BG19622A1 (ru)
AU479521A (ru)
AU479504A (ru)
AU479496A (ru)
AU479458A (ru)
AU479453A (ru)
AU479422A (ru)