FR2243045A1 - - Google Patents
Info
- Publication number
- FR2243045A1 FR2243045A1 FR7430363A FR7430363A FR2243045A1 FR 2243045 A1 FR2243045 A1 FR 2243045A1 FR 7430363 A FR7430363 A FR 7430363A FR 7430363 A FR7430363 A FR 7430363A FR 2243045 A1 FR2243045 A1 FR 2243045A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
- B23K1/015—Vapour-condensation soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US395310A US3866307A (en) | 1973-09-07 | 1973-09-07 | Method for soldering, fusing or brazing |
| US476343A US3904102A (en) | 1974-06-05 | 1974-06-05 | Apparatus and method for soldering, fusing or brazing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2243045A1 true FR2243045A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1975-04-04 |
| FR2243045B1 FR2243045B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1979-08-03 |
Family
ID=27015058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7430363A Expired FR2243045B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1973-09-07 | 1974-09-06 |
Country Status (10)
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0000284A1 (en) * | 1977-07-01 | 1979-01-10 | Western Electric Company, Incorporated | Process and apparatus for reflowing solder of solder plated substrates and substrates formed thereby |
| FR2507918A1 (fr) * | 1981-06-23 | 1982-12-24 | Htc Corp | Appareil de traitement continu a la vapeur, par exemple pour souder ou degraisser des pieces a la vapeur |
| FR2537912A1 (en) * | 1982-12-21 | 1984-06-22 | Annemasse Ultrasons | Process for stabilising, in a steady state, the separation front between an upper vapour region and a lower vapour region which are created in an apparatus comprising a vessel, apparatus making use of the said process and use of the said apparatus |
| EP0138707A1 (fr) * | 1983-10-11 | 1985-04-24 | Piezo-Ceram Electronique | Machine perfectionnée de chauffage d'un article ou produit par condensation de vapeur sur celui-ci |
| EP0148650A1 (en) * | 1983-11-28 | 1985-07-17 | The HTC Corporation | Apparatus for solder removal |
| FR2564763A1 (fr) * | 1984-05-25 | 1985-11-29 | Htc Corp | Appareil et procede de soudage, notamment pour circuits imprimes |
| EP0205309A1 (en) * | 1985-06-08 | 1986-12-17 | Nihon Den-Netsu Keiki Co., Ltd. | Vapor phase soldering apparatus |
| WO1989010817A1 (en) * | 1988-05-02 | 1989-11-16 | Helmut Walter Leicht | Device and process for treating objects in a gas-like or vapour-like medium, in particular for soldering objects in a vapour phase |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2120964A (en) * | 1982-03-25 | 1983-12-14 | Alpha Metals | Processes of applying solder |
| DE3619964C1 (de) * | 1986-06-13 | 1987-03-12 | Heraeus Gmbh W C | Vorrichtung zum Schmelzen eines Loetmittels durch Dampfphasenbehandlung |
| DE3813931C2 (de) * | 1988-04-25 | 1995-05-04 | Resma Gmbh Fuegetechnik Indust | Schutzgaslötverfahren und Vorrichtung zur Ausführung dieses Verfahrens |
| DE3915040A1 (de) * | 1989-05-08 | 1990-11-15 | Helmut Walter Leicht | Verfahren zum vorwaermen und/oder abkuehlen von gegenstaenden vor und/oder nach einer dampfphasenbehandlung |
| DE8913226U1 (de) * | 1989-11-08 | 1989-12-21 | Leicht, Helmut Walter, 8900 Augsburg | Dampfphasenlötanlage mit einem direkt beheizbaren Behälter |
| DE4024181C1 (en) * | 1990-07-30 | 1992-02-13 | Siemens Nixdorf Informationssysteme Ag, 4790 Paderborn, De | Vapour phase soldering installation - has valve in by=pass opening in dependence on preset temp. of sec. medium in soldering tank |
| DE4103098C1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1991-02-01 | 1992-06-25 | Helmut Walter 8901 Koenigsbrunn De Leicht | |
| DE4342634A1 (de) * | 1993-12-14 | 1995-06-22 | Helmut Walter Leicht | Vorrichtung zur Wärmeübertragung, insbesondere in einer Konvektionslötanlage |
| DE4432774C2 (de) * | 1994-09-15 | 2000-04-06 | Fraunhofer Ges Forschung | Verfahren zur Herstellung meniskusförmiger Lotbumps |
| DE19508402C2 (de) * | 1995-03-09 | 1998-08-20 | Helmut W Leicht | Dampfphasen-Lötanlage |
| DE19519188C2 (de) * | 1995-05-24 | 2001-06-28 | Fraunhofer Ges Forschung | Verfahren und Vorrichtung zum Wellen- und/oder Dampfphasenlöten elektronischer Baugruppen |
-
1974
- 1974-08-28 SE SE7410907A patent/SE424518B/xx not_active IP Right Cessation
- 1974-09-03 DE DE19742442180 patent/DE2442180C3/de not_active Expired
- 1974-09-03 NL NL7411686A patent/NL163732C/xx not_active IP Right Cessation
- 1974-09-03 AU AU72932/74A patent/AU7293274A/en not_active Expired
- 1974-09-04 GB GB3858474A patent/GB1484604A/en not_active Expired
- 1974-09-05 BR BR740374A patent/BR7407403D0/pt unknown
- 1974-09-06 FR FR7430363A patent/FR2243045B1/fr not_active Expired
- 1974-09-06 IT IT6971074A patent/IT1020737B/it active
- 1974-09-07 JP JP10253574A patent/JPS5340934B2/ja not_active Expired
-
1976
- 1976-07-01 ES ES449417A patent/ES449417A1/es not_active Expired
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0000284A1 (en) * | 1977-07-01 | 1979-01-10 | Western Electric Company, Incorporated | Process and apparatus for reflowing solder of solder plated substrates and substrates formed thereby |
| FR2507918A1 (fr) * | 1981-06-23 | 1982-12-24 | Htc Corp | Appareil de traitement continu a la vapeur, par exemple pour souder ou degraisser des pieces a la vapeur |
| FR2537912A1 (en) * | 1982-12-21 | 1984-06-22 | Annemasse Ultrasons | Process for stabilising, in a steady state, the separation front between an upper vapour region and a lower vapour region which are created in an apparatus comprising a vessel, apparatus making use of the said process and use of the said apparatus |
| EP0138707A1 (fr) * | 1983-10-11 | 1985-04-24 | Piezo-Ceram Electronique | Machine perfectionnée de chauffage d'un article ou produit par condensation de vapeur sur celui-ci |
| WO1985001791A1 (fr) * | 1983-10-11 | 1985-04-25 | Piezo-Ceram Electronique | Machine perfectionnee de chauffage d'un article ou produit par condensation de vapeur sur celui-ci |
| FR2556083A1 (fr) * | 1983-10-11 | 1985-06-07 | Piezo Ceram Electronique | Machine perfectionnee de chauffage d'un article ou produit par condensation de vapeur sur celui-ci |
| US4612712A (en) * | 1983-10-11 | 1986-09-23 | Piezo-Ceram Electronique | Machine for heating an article or product by vapor condensation |
| EP0148650A1 (en) * | 1983-11-28 | 1985-07-17 | The HTC Corporation | Apparatus for solder removal |
| FR2564763A1 (fr) * | 1984-05-25 | 1985-11-29 | Htc Corp | Appareil et procede de soudage, notamment pour circuits imprimes |
| EP0205309A1 (en) * | 1985-06-08 | 1986-12-17 | Nihon Den-Netsu Keiki Co., Ltd. | Vapor phase soldering apparatus |
| WO1989010817A1 (en) * | 1988-05-02 | 1989-11-16 | Helmut Walter Leicht | Device and process for treating objects in a gas-like or vapour-like medium, in particular for soldering objects in a vapour phase |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2442180B2 (de) | 1979-04-26 |
| DE2442180A1 (de) | 1975-03-13 |
| NL163732C (nl) | 1980-10-15 |
| NL7411686A (nl) | 1975-03-11 |
| SE424518B (sv) | 1982-07-26 |
| BR7407403D0 (pt) | 1975-09-09 |
| AU7293274A (en) | 1976-03-11 |
| ES449417A1 (es) | 1977-11-01 |
| SE7410907L (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1975-03-10 |
| JPS5340934B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1978-10-30 |
| FR2243045B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1979-08-03 |
| JPS5054552A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1975-05-14 |
| GB1484604A (en) | 1977-09-01 |
| IT1020737B (it) | 1977-12-30 |
| DE2442180C3 (de) | 1979-12-20 |