FR2232832B1 - - Google Patents
Info
- Publication number
- FR2232832B1 FR2232832B1 FR7320502A FR7320502A FR2232832B1 FR 2232832 B1 FR2232832 B1 FR 2232832B1 FR 7320502 A FR7320502 A FR 7320502A FR 7320502 A FR7320502 A FR 7320502A FR 2232832 B1 FR2232832 B1 FR 2232832B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7320502A FR2232832A1 (en) | 1973-06-06 | 1973-06-06 | Discharge control in cathodic sputtering - using voltage variation on auxiliary insulated electrode to adjust gas supply |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7320502A FR2232832A1 (en) | 1973-06-06 | 1973-06-06 | Discharge control in cathodic sputtering - using voltage variation on auxiliary insulated electrode to adjust gas supply |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2232832A1 FR2232832A1 (en) | 1975-01-03 |
FR2232832B1 true FR2232832B1 (en) | 1976-11-12 |
Family
ID=9120570
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7320502A Granted FR2232832A1 (en) | 1973-06-06 | 1973-06-06 | Discharge control in cathodic sputtering - using voltage variation on auxiliary insulated electrode to adjust gas supply |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2232832A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5985115A (en) | 1997-04-11 | 1999-11-16 | Novellus Systems, Inc. | Internally cooled target assembly for magnetron sputtering |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4166783A (en) * | 1978-04-17 | 1979-09-04 | Varian Associates, Inc. | Deposition rate regulation by computer control of sputtering systems |
US4166784A (en) * | 1978-04-28 | 1979-09-04 | Applied Films Lab, Inc. | Feedback control for vacuum deposition apparatus |
DE2821119C2 (en) * | 1978-05-13 | 1983-08-25 | Leybold-Heraeus GmbH, 5000 Köln | Method and arrangement for regulating the discharge process in a cathode sputtering system |
US4201645A (en) * | 1978-06-26 | 1980-05-06 | Robert J. Ferran | Closed-loop sputtering system and method of operating same |
US4333814A (en) * | 1979-12-26 | 1982-06-08 | Western Electric Company, Inc. | Methods and apparatus for improving an RF excited reactive gas plasma |
US4336119A (en) * | 1981-01-29 | 1982-06-22 | Ppg Industries, Inc. | Method of and apparatus for control of reactive sputtering deposition |
US4500408A (en) * | 1983-07-19 | 1985-02-19 | Varian Associates, Inc. | Apparatus for and method of controlling sputter coating |
DE59307915D1 (en) * | 1992-02-14 | 1998-02-12 | Forschungszentrum Juelich Gmbh | METHOD FOR PRODUCING THIN LAYERS BY REACTIVE CATHODE SPRAYING AND DEVICE FOR CARRYING OUT THE METHOD |
EP1701598B1 (en) * | 2005-03-09 | 2010-05-05 | Askair technologies AG | Method of operating a flow-through plasma device |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3278407A (en) * | 1963-06-26 | 1966-10-11 | Ibm | Deposition of thin film by sputtering |
BE284991A (en) * | 1966-11-09 | |||
FR2082505A5 (en) * | 1970-03-18 | 1971-12-10 | Radiotechnique Compelec |
-
1973
- 1973-06-06 FR FR7320502A patent/FR2232832A1/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5985115A (en) | 1997-04-11 | 1999-11-16 | Novellus Systems, Inc. | Internally cooled target assembly for magnetron sputtering |
Also Published As
Publication number | Publication date |
---|---|
FR2232832A1 (en) | 1975-01-03 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |