|
US4045200A
(en)
*
|
1975-01-02 |
1977-08-30 |
Owens-Illinois, Inc. |
Method of forming glass substrates with pre-attached sealing media
|
|
DE2842492C2
(de)
*
|
1978-09-29 |
1986-04-17 |
Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt |
Verfahren zur Herstellung einer aus einem Halbleiter-Glas-Verbundwerkstoff bestehenden Photokathode
|
|
JPS6083189U
(ja)
*
|
1983-11-15 |
1985-06-08 |
タキロン株式会社 |
二層窓
|
|
DE3436001A1
(de)
*
|
1984-10-01 |
1986-04-03 |
Siemens AG, 1000 Berlin und 8000 München |
Elektrostatisches glasloeten von halbleiterbauteilen
|
|
JPH0618234B2
(ja)
*
|
1985-04-19 |
1994-03-09 |
日本電信電話株式会社 |
半導体基板の接合方法
|
|
NL8501773A
(nl)
*
|
1985-06-20 |
1987-01-16 |
Philips Nv |
Werkwijze voor het vervaardigen van halfgeleiderinrichtingen.
|
|
JP2559700B2
(ja)
*
|
1986-03-18 |
1996-12-04 |
富士通株式会社 |
半導体装置の製造方法
|
|
US4905075A
(en)
*
|
1986-05-05 |
1990-02-27 |
General Electric Company |
Hermetic semiconductor enclosure
|
|
US5133795A
(en)
*
|
1986-11-04 |
1992-07-28 |
General Electric Company |
Method of making a silicon package for a power semiconductor device
|
|
US5086011A
(en)
*
|
1987-01-27 |
1992-02-04 |
Advanced Micro Devices, Inc. |
Process for producing thin single crystal silicon islands on insulator
|
|
US4792533A
(en)
*
|
1987-03-13 |
1988-12-20 |
Motorola Inc. |
Coplanar die to substrate bond method
|
|
US4828597A
(en)
*
|
1987-12-07 |
1989-05-09 |
General Electric Company |
Flexible glass fiber mat bonding method
|
|
US5034044A
(en)
*
|
1988-05-11 |
1991-07-23 |
General Electric Company |
Method of bonding a silicon package for a power semiconductor device
|
|
NL8902271A
(nl)
*
|
1989-09-12 |
1991-04-02 |
Philips Nv |
Werkwijze voor het verbinden van twee lichamen.
|
|
DE69233314T2
(de)
*
|
1991-10-11 |
2005-03-24 |
Canon K.K. |
Verfahren zur Herstellung von Halbleiter-Produkten
|
|
JP3237888B2
(ja)
*
|
1992-01-31 |
2001-12-10 |
キヤノン株式会社 |
半導体基体及びその作製方法
|
|
US5444014A
(en)
*
|
1994-12-16 |
1995-08-22 |
Electronics And Telecommunications Research Institute |
Method for fabricating semiconductor device
|
|
US5681775A
(en)
*
|
1995-11-15 |
1997-10-28 |
International Business Machines Corporation |
Soi fabrication process
|
|
JP3431454B2
(ja)
*
|
1997-06-18 |
2003-07-28 |
株式会社東芝 |
半導体装置の製造方法
|
|
US6197663B1
(en)
*
|
1999-12-07 |
2001-03-06 |
Lucent Technologies Inc. |
Process for fabricating integrated circuit devices having thin film transistors
|
|
US6563133B1
(en)
*
|
2000-08-09 |
2003-05-13 |
Ziptronix, Inc. |
Method of epitaxial-like wafer bonding at low temperature and bonded structure
|
|
JP2003209144A
(ja)
*
|
2002-01-16 |
2003-07-25 |
Seiko Epson Corp |
半導体装置及びその製造方法、半導体装置の製造装置並びに電子機器
|
|
US20060108678A1
(en)
*
|
2002-05-07 |
2006-05-25 |
Microfabrica Inc. |
Probe arrays and method for making
|
|
AU2003234398A1
(en)
*
|
2002-05-07 |
2003-11-11 |
Memgen Corporation |
Electrochemically fabricated structures having dielectric or active bases
|
|
US20050067292A1
(en)
*
|
2002-05-07 |
2005-03-31 |
Microfabrica Inc. |
Electrochemically fabricated structures having dielectric or active bases and methods of and apparatus for producing such structures
|
|
US20050142739A1
(en)
*
|
2002-05-07 |
2005-06-30 |
Microfabrica Inc. |
Probe arrays and method for making
|
|
US10416192B2
(en)
|
2003-02-04 |
2019-09-17 |
Microfabrica Inc. |
Cantilever microprobes for contacting electronic components
|
|
DE10320375B3
(de)
*
|
2003-05-07 |
2004-12-16 |
Süss Micro Tec Laboratory Equipment GmbH |
Verfahren zum temporären Fixieren zweier flächiger Werksücke
|
|
DE10326893A1
(de)
|
2003-06-14 |
2004-12-30 |
Degussa Ag |
Harze auf Basis von Ketonen und Aldehyde mit verbesserten Löslichkeitseigenschaften und geringen Farbzahlen
|
|
US20080105355A1
(en)
*
|
2003-12-31 |
2008-05-08 |
Microfabrica Inc. |
Probe Arrays and Method for Making
|
|
US9236369B2
(en)
*
|
2013-07-18 |
2016-01-12 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Bonded semiconductor structures
|
|
FR3079662B1
(fr)
*
|
2018-03-30 |
2020-02-28 |
Soitec |
Substrat pour applications radiofrequences et procede de fabrication associe
|
|
US11262383B1
(en)
|
2018-09-26 |
2022-03-01 |
Microfabrica Inc. |
Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
|
|
CN119141981B
(zh)
*
|
2024-09-12 |
2025-04-11 |
苏州融睿电子科技有限公司 |
一种玻璃基板及其制备方法、电子器件
|