FR2226802A1 - - Google Patents

Info

Publication number
FR2226802A1
FR2226802A1 FR7413165A FR7413165A FR2226802A1 FR 2226802 A1 FR2226802 A1 FR 2226802A1 FR 7413165 A FR7413165 A FR 7413165A FR 7413165 A FR7413165 A FR 7413165A FR 2226802 A1 FR2226802 A1 FR 2226802A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7413165A
Other languages
French (fr)
Other versions
FR2226802B1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of FR2226802A1 publication Critical patent/FR2226802A1/fr
Application granted granted Critical
Publication of FR2226802B1 publication Critical patent/FR2226802B1/fr
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0669—Solder baths with dipping means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
FR7413165A 1973-04-18 1974-04-16 Expired FR2226802B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2319630A DE2319630C3 (en) 1973-04-18 1973-04-18 Soldering device for printed circuits

Publications (2)

Publication Number Publication Date
FR2226802A1 true FR2226802A1 (en) 1974-11-15
FR2226802B1 FR2226802B1 (en) 1979-06-29

Family

ID=5878502

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7413165A Expired FR2226802B1 (en) 1973-04-18 1974-04-16

Country Status (6)

Country Link
JP (1) JPS5530955B2 (en)
BE (1) BE813784A (en)
DE (1) DE2319630C3 (en)
FR (1) FR2226802B1 (en)
GB (1) GB1468873A (en)
NL (1) NL7405070A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5544734Y2 (en) * 1973-12-03 1980-10-21
JPS5376372A (en) * 1976-12-17 1978-07-06 Matsushita Electric Ind Co Ltd Device for attaching chip circuit parts
JPS5425248A (en) * 1977-07-29 1979-02-26 Hitachi Ltd Vacuum soldering apparatus
GB2018036B (en) * 1978-03-31 1982-08-25 Vishay Intertechnology Inc Precision resistors subassemblies therefor and their manufacture
JPS62227571A (en) * 1986-03-27 1987-10-06 Tamura Seisakusho Co Ltd Soldering method
DE10008031A1 (en) * 2000-02-15 2001-08-16 Bos Berlin Oberspree Sondermas Method and device for filling cavities

Also Published As

Publication number Publication date
GB1468873A (en) 1977-03-30
JPS5530955B2 (en) 1980-08-14
NL7405070A (en) 1974-10-22
BE813784A (en) 1974-10-16
JPS509560A (en) 1975-01-31
DE2319630B2 (en) 1979-04-12
FR2226802B1 (en) 1979-06-29
DE2319630C3 (en) 1979-12-20
DE2319630A1 (en) 1974-11-14

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Legal Events

Date Code Title Description
ST Notification of lapse