FR2218662A1 - - Google Patents

Info

Publication number
FR2218662A1
FR2218662A1 FR7405306A FR7405306A FR2218662A1 FR 2218662 A1 FR2218662 A1 FR 2218662A1 FR 7405306 A FR7405306 A FR 7405306A FR 7405306 A FR7405306 A FR 7405306A FR 2218662 A1 FR2218662 A1 FR 2218662A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7405306A
Other languages
French (fr)
Other versions
FR2218662B3 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Inc filed Critical AMP Inc
Publication of FR2218662A1 publication Critical patent/FR2218662A1/fr
Application granted granted Critical
Publication of FR2218662B3 publication Critical patent/FR2218662B3/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/24—Connections using contact members penetrating or cutting insulation or cable strands
    • H01R4/2404—Connections using contact members penetrating or cutting insulation or cable strands the contact members having teeth, prongs, pins or needles penetrating the insulation
    • H01R4/2412—Connections using contact members penetrating or cutting insulation or cable strands the contact members having teeth, prongs, pins or needles penetrating the insulation actuated by insulated cams or wedges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/24—Connections using contact members penetrating or cutting insulation or cable strands
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/24—Connections using contact members penetrating or cutting insulation or cable strands
    • H01R4/2491—Connections using contact members penetrating or cutting insulation or cable strands the contact members penetrating the insulation being actuated by conductive cams or wedges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0067—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto an inorganic, non-metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Processing Of Terminals (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
FR7405306A 1973-02-16 1974-02-15 Expired FR2218662B3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00333242A US3818415A (en) 1973-02-16 1973-02-16 Electrical connections to conductors having thin film insulation

Publications (2)

Publication Number Publication Date
FR2218662A1 true FR2218662A1 (en) 1974-09-13
FR2218662B3 FR2218662B3 (en) 1976-11-26

Family

ID=23301957

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7405306A Expired FR2218662B3 (en) 1973-02-16 1974-02-15

Country Status (13)

Country Link
US (1) US3818415A (en)
JP (1) JPS49135188A (en)
AR (1) AR199430A1 (en)
AU (1) AU6553174A (en)
BE (1) BE811045A (en)
BR (1) BR7401124D0 (en)
DE (1) DE2407050A1 (en)
ES (1) ES423227A1 (en)
FR (1) FR2218662B3 (en)
GB (1) GB1411932A (en)
IT (1) IT1007196B (en)
NL (1) NL7401746A (en)
SE (1) SE7402034L (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2344983A1 (en) * 1976-03-17 1977-10-14 Amp Inc PROCESS FOR MAKING A CONNECTION ON A THIN WIRE

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4106842A (en) * 1976-09-23 1978-08-15 Gte Sylvania Incorporated Electrical contact and connector
EP0022143B1 (en) * 1979-07-09 1983-03-30 AMP INCORPORATED (a New Jersey corporation) Electrical connection to multilayer cable
FR2485857B1 (en) * 1980-06-25 1986-05-02 Commissariat Energie Atomique MULTI-ELEMENT ULTRASONIC PROBE AND MANUFACTURING METHOD THEREOF
US4404489A (en) * 1980-11-03 1983-09-13 Hewlett-Packard Company Acoustic transducer with flexible circuit board terminals
US4479069A (en) * 1981-11-12 1984-10-23 Hewlett-Packard Company Lead attachment for an acoustic transducer
US4589714A (en) * 1984-02-06 1986-05-20 Minnesota Mining And Manufacturing Company Ground clip for photoconductive film
US4717357A (en) * 1984-07-13 1988-01-05 Thomas & Betts Corporation System and method for electrical power installation
US4563050A (en) * 1984-07-13 1986-01-07 Thomas & Betts Corporation Device for flat multiconductor cable connection
US4618203A (en) * 1985-04-08 1986-10-21 Thomas & Betts Corporation Isolated ground device for flat undercarpet cable
US4647133A (en) * 1985-04-18 1987-03-03 Innovus Electrical interconnect system
USRE34190E (en) * 1986-05-27 1993-03-09 Rogers Corporation Connector arrangement
US4935312A (en) * 1987-06-25 1990-06-19 Nippon Mining Co., Ltd. Film carrier having tin and indium plated layers
US5185073A (en) * 1988-06-21 1993-02-09 International Business Machines Corporation Method of fabricating nendritic materials
US5137461A (en) * 1988-06-21 1992-08-11 International Business Machines Corporation Separable electrical connection technology
US4909746A (en) * 1989-05-31 1990-03-20 Amp Incorporated Contact for stackable electrical connector
US5169057A (en) * 1989-08-10 1992-12-08 Emc Technology, Inc. Method for soldering and apparatus therefor
US5471151A (en) * 1990-02-14 1995-11-28 Particle Interconnect, Inc. Electrical interconnect using particle enhanced joining of metal surfaces
US5083697A (en) * 1990-02-14 1992-01-28 Difrancesco Louis Particle-enhanced joining of metal surfaces
US5141702A (en) * 1990-03-13 1992-08-25 Olin Corporation Method of making coated electrical connectors
US5028492A (en) * 1990-03-13 1991-07-02 Olin Corporation Composite coating for electrical connectors
US5298685A (en) * 1990-10-30 1994-03-29 International Business Machines Corporation Interconnection method and structure for organic circuit boards
US5430254A (en) * 1993-09-15 1995-07-04 Queen's University Reverse crimp connector
DE9315490U1 (en) * 1993-10-13 1994-11-10 Hoechst Ag, 65929 Frankfurt Molded body with electrical contact
US5632631A (en) 1994-06-07 1997-05-27 Tessera, Inc. Microelectronic contacts with asperities and methods of making same
US5615824A (en) * 1994-06-07 1997-04-01 Tessera, Inc. Soldering with resilient contacts
US5802699A (en) * 1994-06-07 1998-09-08 Tessera, Inc. Methods of assembling microelectronic assembly with socket for engaging bump leads
US5983492A (en) * 1996-11-27 1999-11-16 Tessera, Inc. Low profile socket for microelectronic components and method for making the same
US5600099A (en) * 1994-12-02 1997-02-04 Augat Inc. Chemically grafted electrical devices
US5599193A (en) * 1994-08-23 1997-02-04 Augat Inc. Resilient electrical interconnect
US6271482B1 (en) 1994-08-23 2001-08-07 Thomas & Betts International, Inc. Conductive elastomer interconnect
US5949029A (en) * 1994-08-23 1999-09-07 Thomas & Betts International, Inc. Conductive elastomers and methods for fabricating the same
US5810609A (en) * 1995-08-28 1998-09-22 Tessera, Inc. Socket for engaging bump leads on a microelectronic device and methods therefor
US6072324A (en) * 1996-03-19 2000-06-06 Micron Technology, Inc. Method for testing semiconductor packages using oxide penetrating test contacts
DE19621001A1 (en) * 1996-05-24 1997-11-27 Heraeus Sensor Nite Gmbh Sensor arrangement for temperature measurement and method for producing the arrangement
CA2245413C (en) * 1997-09-16 2001-09-18 Thomas & Betts International, Inc. Conductive elastomer for grafting to an elastic substrate
AU3409702A (en) * 2000-10-24 2002-05-06 Nanopierce Technologies Inc Method and materials for printing particle-enhanced electrical contacts
US6547586B2 (en) * 2001-05-14 2003-04-15 Delphi Technologies, Inc. Sealed electrical distribution center
DE102004036829A1 (en) * 2004-07-29 2006-03-23 Sennheiser Electronic Gmbh & Co. Kg Electrical contact for very fine wire, holds and clamps wire between two plates, one with recess and one with contacting region
US20160109530A1 (en) * 2014-10-21 2016-04-21 Analog Devices Technology Combination of a battery stack and a battery monitor, and a method of connecting a battery monitor to a stack of batteries
DE102015210460B4 (en) * 2015-06-08 2021-10-07 Te Connectivity Germany Gmbh Method for changing mechanical and / or electrical properties of at least one area of an electrical contact element
JP6627620B2 (en) * 2016-04-05 2020-01-08 株式会社オートネットワーク技術研究所 Connectors, connection status detection systems, and terminals
US10959343B2 (en) * 2017-08-25 2021-03-23 Hewlett Packard Enterprise Development Lp Integrated stand-offs for printed circuit boards

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2576528A (en) * 1948-08-07 1951-11-27 Burndy Engineering Co Inc Connector with hard particle lining
USRE26208E (en) * 1959-03-30 1967-05-23 Ohiac-r terminal and lam] nat j on sfsuuiuno akhanokwj-.nt for electric devices and method of assembling same
US3718750A (en) * 1971-10-12 1973-02-27 Gen Motors Corp Electrical connector

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2344983A1 (en) * 1976-03-17 1977-10-14 Amp Inc PROCESS FOR MAKING A CONNECTION ON A THIN WIRE

Also Published As

Publication number Publication date
US3818415A (en) 1974-06-18
NL7401746A (en) 1974-08-20
JPS49135188A (en) 1974-12-26
FR2218662B3 (en) 1976-11-26
SE7402034L (en) 1974-08-19
AR199430A1 (en) 1974-08-30
AU6553174A (en) 1975-08-14
IT1007196B (en) 1976-10-30
BR7401124D0 (en) 1974-11-05
ES423227A1 (en) 1976-05-01
GB1411932A (en) 1975-10-29
DE2407050A1 (en) 1974-08-29
BE811045A (en) 1974-08-14

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Legal Events

Date Code Title Description
ST Notification of lapse