FR2208185A1 - - Google Patents
Info
- Publication number
- FR2208185A1 FR2208185A1 FR7309037A FR7309037A FR2208185A1 FR 2208185 A1 FR2208185 A1 FR 2208185A1 FR 7309037 A FR7309037 A FR 7309037A FR 7309037 A FR7309037 A FR 7309037A FR 2208185 A1 FR2208185 A1 FR 2208185A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH1720272A CH558428A (de) | 1972-11-23 | 1972-11-23 | Target-wechselvorrichtung fuer die zerstaeubung mittels ionen. |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2208185A1 true FR2208185A1 (bg) | 1974-06-21 |
FR2208185B1 FR2208185B1 (bg) | 1977-02-04 |
Family
ID=4423556
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7309037A Expired FR2208185B1 (bg) | 1972-11-23 | 1973-03-14 |
Country Status (4)
Country | Link |
---|---|
US (1) | US3853740A (bg) |
CH (1) | CH558428A (bg) |
FR (1) | FR2208185B1 (bg) |
GB (1) | GB1394942A (bg) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0109148A2 (en) * | 1982-09-16 | 1984-05-23 | Energy Conversion Devices, Inc. | Substrate shield for preventing the deposition of nonhomogeneous films |
DE19543375A1 (de) * | 1995-11-21 | 1997-05-22 | Leybold Ag | Vorrichtung zum Beschichten von Substraten mittels Magnetronzerstäuben |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4169031A (en) * | 1978-01-13 | 1979-09-25 | Polyohm, Inc. | Magnetron sputter cathode assembly |
US4282924A (en) * | 1979-03-16 | 1981-08-11 | Varian Associates, Inc. | Apparatus for mechanically clamping semiconductor wafer against pliable thermally conductive surface |
US4239611A (en) * | 1979-06-11 | 1980-12-16 | Vac-Tec Systems, Inc. | Magnetron sputtering devices |
US4816133A (en) * | 1987-05-14 | 1989-03-28 | Northrop Corporation | Apparatus for preparing thin film optical coatings on substrates |
GB2213838A (en) * | 1987-12-23 | 1989-08-23 | Plessey Co Plc | Environmental protection of superconducting thin films |
GB2228948A (en) * | 1989-02-28 | 1990-09-12 | British Aerospace | Fabrication of thin films from a composite target |
JPH0733576B2 (ja) * | 1989-11-29 | 1995-04-12 | 株式会社日立製作所 | スパツタ装置、及びターゲツト交換装置、並びにその交換方法 |
DE4040856A1 (de) * | 1990-12-20 | 1992-06-25 | Leybold Ag | Zerstaeubungsanlage |
US6051113A (en) * | 1998-04-27 | 2000-04-18 | Cvc Products, Inc. | Apparatus and method for multi-target physical-vapor deposition of a multi-layer material structure using target indexing |
AU2001227109A1 (en) * | 2000-01-27 | 2001-08-07 | Nikon Corporation | Method for preparing film of compound material containing gas forming element |
SG90171A1 (en) * | 2000-09-26 | 2002-07-23 | Inst Data Storage | Sputtering device |
US6635154B2 (en) * | 2001-11-03 | 2003-10-21 | Intevac, Inc. | Method and apparatus for multi-target sputtering |
GB0404436D0 (en) * | 2004-02-27 | 2004-03-31 | Nanofilm Technologies Int | Continuous arc deposition apparatus and method with multiple available targets |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3528906A (en) * | 1967-06-05 | 1970-09-15 | Texas Instruments Inc | Rf sputtering method and system |
US3537973A (en) * | 1967-09-15 | 1970-11-03 | Varian Associates | Sequential sputtering with movable targets |
-
1972
- 1972-11-23 CH CH1720272A patent/CH558428A/xx not_active IP Right Cessation
-
1973
- 1973-02-05 GB GB555673A patent/GB1394942A/en not_active Expired
- 1973-03-14 FR FR7309037A patent/FR2208185B1/fr not_active Expired
- 1973-04-05 US US00348018A patent/US3853740A/en not_active Expired - Lifetime
Non-Patent Citations (1)
Title |
---|
NEANT * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0109148A2 (en) * | 1982-09-16 | 1984-05-23 | Energy Conversion Devices, Inc. | Substrate shield for preventing the deposition of nonhomogeneous films |
EP0109148A3 (en) * | 1982-09-16 | 1984-07-18 | Energy Conversion Devices, Inc. | Substrate shield for preventing the deposition of nonhomogeneous films |
DE19543375A1 (de) * | 1995-11-21 | 1997-05-22 | Leybold Ag | Vorrichtung zum Beschichten von Substraten mittels Magnetronzerstäuben |
Also Published As
Publication number | Publication date |
---|---|
GB1394942A (en) | 1975-05-21 |
CH558428A (de) | 1975-01-31 |
FR2208185B1 (bg) | 1977-02-04 |
US3853740A (en) | 1974-12-10 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |