FR2198675A5 - - Google Patents

Info

Publication number
FR2198675A5
FR2198675A5 FR7331911A FR7331911A FR2198675A5 FR 2198675 A5 FR2198675 A5 FR 2198675A5 FR 7331911 A FR7331911 A FR 7331911A FR 7331911 A FR7331911 A FR 7331911A FR 2198675 A5 FR2198675 A5 FR 2198675A5
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7331911A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Application granted granted Critical
Publication of FR2198675A5 publication Critical patent/FR2198675A5/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
    • G09F9/3023—Segmented electronic displays
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02D—CONTROLLING COMBUSTION ENGINES
    • F02D41/00—Electrical control of supply of combustible mixture or its constituents
    • F02D41/02—Circuit arrangements for generating control signals
    • F02D41/14—Introducing closed-loop corrections
    • F02D41/1438—Introducing closed-loop corrections using means for determining characteristics of the combustion gases; Sensors therefor
    • F02D41/1444—Introducing closed-loop corrections using means for determining characteristics of the combustion gases; Sensors therefor characterised by the characteristics of the combustion gases
    • F02D41/1454—Introducing closed-loop corrections using means for determining characteristics of the combustion gases; Sensors therefor characterised by the characteristics of the combustion gases the characteristics being an oxygen content or concentration or the air-fuel ratio
    • F02D41/1456—Introducing closed-loop corrections using means for determining characteristics of the combustion gases; Sensors therefor characterised by the characteristics of the combustion gases the characteristics being an oxygen content or concentration or the air-fuel ratio with sensor output signal being linear or quasi-linear with the concentration of oxygen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Digital Computer Display Output (AREA)
FR7331911A 1972-09-05 1973-09-04 Expired FR2198675A5 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8926772A JPS5127988B2 (fr) 1972-09-05 1972-09-05

Publications (1)

Publication Number Publication Date
FR2198675A5 true FR2198675A5 (fr) 1974-03-29

Family

ID=13965963

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7331911A Expired FR2198675A5 (fr) 1972-09-05 1973-09-04

Country Status (7)

Country Link
US (1) US3921026A (fr)
JP (1) JPS5127988B2 (fr)
CA (1) CA998454A (fr)
DE (1) DE2344774C3 (fr)
FR (1) FR2198675A5 (fr)
GB (1) GB1428730A (fr)
IT (1) IT994718B (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0464394A2 (fr) * 1990-07-03 1992-01-08 Siemens Aktiengesellschaft Méthode pour fabriquer un dispositif d'affichage à diodes électroluminescentes
EP0921568A3 (fr) * 1997-11-25 2000-04-12 Matsushita Electric Works, Ltd. Luminaire à diodes électroluminescentes
WO2003045709A1 (fr) * 2001-11-27 2003-06-05 Iouri Sokolov Procede pour creer une image luminescente sur un support solide, dispositif publicitaire et emballage alimentaire fabriques selon ce procede
US6809475B2 (en) 2000-06-15 2004-10-26 Lednium Pty Limited Led lamp with light-emitting junctions arranged in a three-dimensional array
US7320632B2 (en) 2000-06-15 2008-01-22 Lednium Pty Limited Method of producing a lamp
EP1921686A3 (fr) * 2000-03-10 2009-06-10 Kabushiki Kaisha Toshiba Dispositif électroluminescent semi-conducteur et son procédé de fabrication
US7704762B2 (en) 2002-06-14 2010-04-27 Lednium Technology Pty Limited Lamp and method of producing a lamp

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4146883A (en) * 1977-09-12 1979-03-27 Minnesota Mining And Manufacturing Company Display
JPH087808A (ja) * 1994-06-21 1996-01-12 Nec Kagoshima Ltd 蛍光表示管
JPH08149280A (ja) * 1994-11-18 1996-06-07 Canon Inc 画像処理装置
US6600175B1 (en) 1996-03-26 2003-07-29 Advanced Technology Materials, Inc. Solid state white light emitter and display using same
DE19655445B3 (de) * 1996-09-20 2016-09-22 Osram Gmbh Weißes Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionsschicht und Verwendung solcher Halbleiterbauelemente
EP0866506B1 (fr) * 1996-10-09 2008-12-03 Josuke Nakata Dispositif a semi-conducteurs
US6275205B1 (en) * 1998-03-31 2001-08-14 Intel Corporation Method and apparatus for displaying information with an integrated circuit device
DE10065381B4 (de) * 2000-12-27 2010-08-26 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauelement mit Lumineszenzkonversionselement
US20080102726A2 (en) * 2003-03-12 2008-05-01 Balu Jeganathan Lamp and a process for producing a lamp
JP2010225754A (ja) * 2009-03-23 2010-10-07 Stanley Electric Co Ltd 半導体発光装置
JP6505626B2 (ja) * 2016-03-17 2019-04-24 富士通フロンテック株式会社 表示ユニット及び時計表示ユニット

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3529200A (en) * 1968-03-28 1970-09-15 Gen Electric Light-emitting phosphor-diode combination
US3510732A (en) * 1968-04-22 1970-05-05 Gen Electric Solid state lamp having a lens with rhodamine or fluorescent material dispersed therein
US3501676A (en) * 1968-04-29 1970-03-17 Zenith Radio Corp Solid state matrix having an injection luminescent diode as the light source
US3593055A (en) * 1969-04-16 1971-07-13 Bell Telephone Labor Inc Electro-luminescent device
JPS5026433B1 (fr) * 1970-12-21 1975-09-01
US3774086A (en) * 1972-09-25 1973-11-20 Gen Electric Solid state lamp having visible-emitting phosphor at edge of infrated-emitting element

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0464394A2 (fr) * 1990-07-03 1992-01-08 Siemens Aktiengesellschaft Méthode pour fabriquer un dispositif d'affichage à diodes électroluminescentes
EP0464394A3 (en) * 1990-07-03 1992-02-26 Siemens Aktiengesellschaft Method to produce a light emitting diode display
US5167556A (en) * 1990-07-03 1992-12-01 Siemens Aktiengesellschaft Method for manufacturing a light emitting diode display means
EP0921568A3 (fr) * 1997-11-25 2000-04-12 Matsushita Electric Works, Ltd. Luminaire à diodes électroluminescentes
EP1921686A3 (fr) * 2000-03-10 2009-06-10 Kabushiki Kaisha Toshiba Dispositif électroluminescent semi-conducteur et son procédé de fabrication
US6809475B2 (en) 2000-06-15 2004-10-26 Lednium Pty Limited Led lamp with light-emitting junctions arranged in a three-dimensional array
US7320632B2 (en) 2000-06-15 2008-01-22 Lednium Pty Limited Method of producing a lamp
US7352127B2 (en) 2000-06-15 2008-04-01 Lednium Pty Limited LED lamp with light-emitting junction arranged in three-dimensional array
WO2003045709A1 (fr) * 2001-11-27 2003-06-05 Iouri Sokolov Procede pour creer une image luminescente sur un support solide, dispositif publicitaire et emballage alimentaire fabriques selon ce procede
US7704762B2 (en) 2002-06-14 2010-04-27 Lednium Technology Pty Limited Lamp and method of producing a lamp

Also Published As

Publication number Publication date
DE2344774A1 (de) 1974-04-04
GB1428730A (en) 1976-03-17
JPS4946398A (fr) 1974-05-02
JPS5127988B2 (fr) 1976-08-16
IT994718B (it) 1975-10-20
DE2344774B2 (de) 1975-04-24
DE2344774C3 (de) 1980-10-16
US3921026A (en) 1975-11-18
CA998454A (en) 1976-10-12

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Legal Events

Date Code Title Description
ST Notification of lapse