FR2186738A1 - - Google Patents
Info
- Publication number
- FR2186738A1 FR2186738A1 FR7314651A FR7314651A FR2186738A1 FR 2186738 A1 FR2186738 A1 FR 2186738A1 FR 7314651 A FR7314651 A FR 7314651A FR 7314651 A FR7314651 A FR 7314651A FR 2186738 A1 FR2186738 A1 FR 2186738A1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W44/00—Electrical arrangements for controlling or matching impedance
- H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W44/00—Electrical arrangements for controlling or matching impedance
- H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
- H10W44/226—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for HF amplifiers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US25815872A | 1972-05-31 | 1972-05-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR2186738A1 true FR2186738A1 (enExample) | 1974-01-11 |
Family
ID=22979338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR7314651A Withdrawn FR2186738A1 (enExample) | 1972-05-31 | 1973-04-20 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3801938A (enExample) |
| JP (1) | JPS5126785B2 (enExample) |
| FR (1) | FR2186738A1 (enExample) |
| GB (1) | GB1382203A (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3916434A (en) * | 1972-11-30 | 1975-10-28 | Power Hybrids Inc | Hermetically sealed encapsulation of semiconductor devices |
| JPS5758783B2 (enExample) * | 1973-02-22 | 1982-12-11 | Nippon Electric Co | |
| US3936864A (en) * | 1973-05-18 | 1976-02-03 | Raytheon Company | Microwave transistor package |
| US4193083A (en) * | 1977-01-07 | 1980-03-11 | Varian Associates, Inc. | Package for push-pull semiconductor devices |
| US4107728A (en) * | 1977-01-07 | 1978-08-15 | Varian Associates, Inc. | Package for push-pull semiconductor devices |
| JPS53116173U (enExample) * | 1977-02-23 | 1978-09-14 | ||
| US4266090A (en) * | 1978-09-14 | 1981-05-05 | Isotronics, Incorporated | All metal flat package |
| JPS5834755Y2 (ja) * | 1978-09-18 | 1983-08-04 | 富士通株式会社 | 半導体装置 |
| IT8224533A0 (it) * | 1982-12-01 | 1982-12-01 | Ora Sgs Microelettronica Spa S | Contenitore in metallo e resina ad elevata affidabilita' per dispositivo a semiconduttore. |
| US4630174A (en) * | 1983-10-31 | 1986-12-16 | Kaufman Lance R | Circuit package with external circuit board and connection |
| CA1264380A (en) * | 1985-01-30 | 1990-01-09 | Jun Fukaya | Semiconductor device package with integral earth lead and side wall |
| US4805420A (en) * | 1987-06-22 | 1989-02-21 | Ncr Corporation | Cryogenic vessel for cooling electronic components |
| US5334962A (en) * | 1987-09-18 | 1994-08-02 | Q-Dot Inc. | High-speed data supply pathway systems |
| US6072211A (en) * | 1998-08-03 | 2000-06-06 | Motorola, Inc. | Semiconductor package |
| US20080308922A1 (en) * | 2007-06-14 | 2008-12-18 | Yiwen Zhang | Method for packaging semiconductors at a wafer level |
| JP6852841B2 (ja) * | 2016-12-28 | 2021-03-31 | 住友電工デバイス・イノベーション株式会社 | 半導体装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202925C (enExample) * | 1969-04-30 | 1900-01-01 | ||
| US3515959A (en) * | 1967-04-19 | 1970-06-02 | Gen Electric | Plural motor proportional speed control using pulse responsive speed controls |
| US3649872A (en) * | 1970-07-15 | 1972-03-14 | Trw Inc | Packaging structure for high-frequency semiconductor devices |
| US3681513A (en) * | 1971-01-26 | 1972-08-01 | American Lava Corp | Hermetic power package |
| US3683241A (en) * | 1971-03-08 | 1972-08-08 | Communications Transistor Corp | Radio frequency transistor package |
-
1972
- 1972-05-31 US US00258158A patent/US3801938A/en not_active Expired - Lifetime
-
1973
- 1973-04-20 FR FR7314651A patent/FR2186738A1/fr not_active Withdrawn
- 1973-05-16 GB GB2331873A patent/GB1382203A/en not_active Expired
- 1973-05-31 JP JP48060409A patent/JPS5126785B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5126785B2 (enExample) | 1976-08-09 |
| GB1382203A (en) | 1975-01-29 |
| JPS4951878A (enExample) | 1974-05-20 |
| US3801938A (en) | 1974-04-02 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |