FR2181573A1 - Light-emitting diode - by heating aluminium-doped cadmium/magnesium telluride monocrystal in phosphorus/cadmium vapour - Google Patents
Light-emitting diode - by heating aluminium-doped cadmium/magnesium telluride monocrystal in phosphorus/cadmium vapourInfo
- Publication number
- FR2181573A1 FR2181573A1 FR7215378A FR7215378A FR2181573A1 FR 2181573 A1 FR2181573 A1 FR 2181573A1 FR 7215378 A FR7215378 A FR 7215378A FR 7215378 A FR7215378 A FR 7215378A FR 2181573 A1 FR2181573 A1 FR 2181573A1
- Authority
- FR
- France
- Prior art keywords
- cadmium
- monocrystal
- phosphorus
- light
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052793 cadmium Inorganic materials 0.000 title abstract 3
- 238000010438 heat treatment Methods 0.000 title abstract 2
- 229910052698 phosphorus Inorganic materials 0.000 title abstract 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 title 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title 1
- 239000011574 phosphorus Substances 0.000 title 1
- ZTBJFXYWWZPTFM-UHFFFAOYSA-N tellanylidenemagnesium Chemical compound [Te]=[Mg] ZTBJFXYWWZPTFM-UHFFFAOYSA-N 0.000 title 1
- 229910004613 CdTe Inorganic materials 0.000 abstract 2
- 229910017680 MgTe Inorganic materials 0.000 abstract 2
- 239000007787 solid Substances 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000002019 doping agent Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/0004—Devices characterised by their operation
- H01L33/002—Devices characterised by their operation having heterojunctions or graded gap
- H01L33/0029—Devices characterised by their operation having heterojunctions or graded gap comprising only AIIBVI compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4918—Disposition being disposed on at least two different sides of the body, e.g. dual array
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Devices (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The diode is produced from a wafer of a monocrystal of an n-type solid soln. of CdTe and MgTe contg. 0.001-0.01 atom % Al as dopant by heating 15 min. to 72 h. esp., 15 min. to 10 h, in a vapour phase of P and Cd at 670-850 (670-800) esp., 670-790 degrees C to provide a wafer with a thin coating of a p-type solid soln. of CdTe and MgTe. The luminance of the emitted light is good.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19722221952 DE2221952B2 (en) | 1972-04-27 | 1972-04-27 | Method of manufacturing a light emitting diode |
FR7215378A FR2181573A1 (en) | 1972-04-27 | 1972-04-28 | Light-emitting diode - by heating aluminium-doped cadmium/magnesium telluride monocrystal in phosphorus/cadmium vapour |
NL7206222A NL7206222A (en) | 1972-04-27 | 1972-05-08 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19722221952 DE2221952B2 (en) | 1972-04-27 | 1972-04-27 | Method of manufacturing a light emitting diode |
FR7215378A FR2181573A1 (en) | 1972-04-27 | 1972-04-28 | Light-emitting diode - by heating aluminium-doped cadmium/magnesium telluride monocrystal in phosphorus/cadmium vapour |
NL7206222A NL7206222A (en) | 1972-04-27 | 1972-05-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2181573A1 true FR2181573A1 (en) | 1973-12-07 |
FR2181573B1 FR2181573B1 (en) | 1975-10-24 |
Family
ID=27184393
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7215378A Granted FR2181573A1 (en) | 1972-04-27 | 1972-04-28 | Light-emitting diode - by heating aluminium-doped cadmium/magnesium telluride monocrystal in phosphorus/cadmium vapour |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE2221952B2 (en) |
FR (1) | FR2181573A1 (en) |
NL (1) | NL7206222A (en) |
-
1972
- 1972-04-27 DE DE19722221952 patent/DE2221952B2/en not_active Ceased
- 1972-04-28 FR FR7215378A patent/FR2181573A1/en active Granted
- 1972-05-08 NL NL7206222A patent/NL7206222A/xx not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
FR2181573B1 (en) | 1975-10-24 |
DE2221952B2 (en) | 1974-07-18 |
DE2221952A1 (en) | 1973-11-08 |
NL7206222A (en) | 1973-11-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |