|
GB1555334A
(en)
*
|
1975-06-13 |
1979-11-07 |
Imi Ltd |
Electrodeposition cell
|
|
WO1979000608A1
(en)
*
|
1978-02-09 |
1979-08-23 |
Kemwell Ltd |
Electrotreating a metal surface
|
|
US4406761A
(en)
*
|
1980-05-01 |
1983-09-27 |
Kabushiki Kaisha Kobe Seiko Sho |
Method of descaling metal sheets
|
|
FI834686A0
(fi)
*
|
1983-12-20 |
1983-12-20 |
Niinivaara Ensi Kyoesti Juhani |
Foerfarande foer undervattensrening och -belaeggning
|
|
JPS61219526A
(ja)
*
|
1985-03-25 |
1986-09-29 |
Agency Of Ind Science & Technol |
電解砥粒複合研磨装置用電極工具
|
|
US4609450A
(en)
*
|
1985-03-26 |
1986-09-02 |
Agency Of Industrial Science And Technology |
Combined electrolytic-abrasive polishing apparatus
|
|
EP0242421B1
(de)
*
|
1986-04-25 |
1989-09-06 |
Poligrat Gmbh |
Verfahren und Vorrichtung zum elektrochemischen Polieren und Beizen
|
|
JP2831713B2
(ja)
*
|
1988-08-19 |
1998-12-02 |
マルイ鍍金工業株式会社 |
電解処理用筆具
|
|
JPH0322968U
(ru)
*
|
1989-07-13 |
1991-03-11 |
|
|
|
JPH0575057U
(ja)
*
|
1992-03-13 |
1993-10-12 |
日本精工株式会社 |
衝撃吸収式ステアリングコラム装置
|
|
US5225059A
(en)
*
|
1992-08-03 |
1993-07-06 |
W. R. Associates |
Apparatus for single anode brush electroplating
|
|
US5324406A
(en)
*
|
1992-09-10 |
1994-06-28 |
Tosoh Smd, Inc. |
Automatic brush plating machine
|
|
US5409593A
(en)
*
|
1993-12-03 |
1995-04-25 |
Sifco Industries, Inc. |
Method and apparatus for selective electroplating using soluble anodes
|
|
US5776330A
(en)
*
|
1996-05-08 |
1998-07-07 |
Corpex Technologies, Inc. |
Electrolytic decontamination methods and apparatus
|
|
US5772012A
(en)
*
|
1996-05-08 |
1998-06-30 |
Corpex Technologies, Inc. |
Flexible decontamination apparatus
|
|
GB2336161B
(en)
|
1998-04-06 |
2003-03-26 |
John Michael Lowe |
Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
|
|
US6939447B2
(en)
|
1998-04-06 |
2005-09-06 |
Tdao Limited |
Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method
|
|
US6176992B1
(en)
*
|
1998-11-03 |
2001-01-23 |
Nutool, Inc. |
Method and apparatus for electro-chemical mechanical deposition
|
|
US6902659B2
(en)
*
|
1998-12-01 |
2005-06-07 |
Asm Nutool, Inc. |
Method and apparatus for electro-chemical mechanical deposition
|
|
US7427337B2
(en)
*
|
1998-12-01 |
2008-09-23 |
Novellus Systems, Inc. |
System for electropolishing and electrochemical mechanical polishing
|
|
US7425250B2
(en)
|
1998-12-01 |
2008-09-16 |
Novellus Systems, Inc. |
Electrochemical mechanical processing apparatus
|
|
US6413388B1
(en)
*
|
2000-02-23 |
2002-07-02 |
Nutool Inc. |
Pad designs and structures for a versatile materials processing apparatus
|
|
US6673216B2
(en)
*
|
1999-08-31 |
2004-01-06 |
Semitool, Inc. |
Apparatus for providing electrical and fluid communication to a rotating microelectronic workpiece during electrochemical processing
|
|
IT1311147B1
(it)
*
|
1999-11-04 |
2002-03-04 |
Edk Res Ag |
Macchina per pulizia localizzata con cella, elettrolitica e/o adultrasuoni, di decapaggio e/o lucidatura
|
|
US6478936B1
(en)
*
|
2000-05-11 |
2002-11-12 |
Nutool Inc. |
Anode assembly for plating and planarizing a conductive layer
|
|
US7754061B2
(en)
|
2000-08-10 |
2010-07-13 |
Novellus Systems, Inc. |
Method for controlling conductor deposition on predetermined portions of a wafer
|
|
US6921551B2
(en)
|
2000-08-10 |
2005-07-26 |
Asm Nutool, Inc. |
Plating method and apparatus for controlling deposition on predetermined portions of a workpiece
|
|
US20040170753A1
(en)
*
|
2000-12-18 |
2004-09-02 |
Basol Bulent M. |
Electrochemical mechanical processing using low temperature process environment
|
|
US7172497B2
(en)
*
|
2001-01-05 |
2007-02-06 |
Asm Nutool, Inc. |
Fabrication of semiconductor interconnect structures
|
|
US6572755B2
(en)
*
|
2001-04-11 |
2003-06-03 |
Speedfam-Ipec Corporation |
Method and apparatus for electrochemically depositing a material onto a workpiece surface
|
|
US7238092B2
(en)
*
|
2001-09-28 |
2007-07-03 |
Novellus Systems, Inc. |
Low-force electrochemical mechanical processing method and apparatus
|
|
US20050040049A1
(en)
*
|
2002-09-20 |
2005-02-24 |
Rimma Volodarsky |
Anode assembly for plating and planarizing a conductive layer
|
|
US7648622B2
(en)
|
2004-02-27 |
2010-01-19 |
Novellus Systems, Inc. |
System and method for electrochemical mechanical polishing
|
|
JP4628931B2
(ja)
*
|
2005-11-04 |
2011-02-09 |
日東工器株式会社 |
雄雌部材アセンブリ
|
|
US8500985B2
(en)
|
2006-07-21 |
2013-08-06 |
Novellus Systems, Inc. |
Photoresist-free metal deposition
|
|
US8197307B1
(en)
*
|
2009-03-19 |
2012-06-12 |
Kenneth Luna |
Surface polishing system
|
|
US9249521B2
(en)
|
2011-11-04 |
2016-02-02 |
Integran Technologies Inc. |
Flow-through consumable anodes
|
|
AU355902S
(en)
*
|
2014-05-12 |
2014-06-13 |
|
Electrolytic brush
|
|
AU355903S
(en)
*
|
2014-05-12 |
2014-06-13 |
|
Electrolytic brush
|
|
AU2022344864A1
(en)
*
|
2021-09-17 |
2024-04-11 |
Ensitech Ip Pty Ltd |
Electrochemical treatment device
|